JP2002128861A5 - - Google Patents
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- Publication number
- JP2002128861A5 JP2002128861A5 JP2000322630A JP2000322630A JP2002128861A5 JP 2002128861 A5 JP2002128861 A5 JP 2002128861A5 JP 2000322630 A JP2000322630 A JP 2000322630A JP 2000322630 A JP2000322630 A JP 2000322630A JP 2002128861 A5 JP2002128861 A5 JP 2002128861A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- tetramethylbiphenyl
- weight
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims 11
- 229920000647 polyepoxide Polymers 0.000 claims 11
- 239000000203 mixture Substances 0.000 claims 10
- QDRFIDSUGRGGAY-UHFFFAOYSA-N 4-(3,5-dimethyl-4-oxocyclohexa-2,5-dien-1-ylidene)-2,6-dimethylcyclohexa-2,5-dien-1-one Chemical compound C1=C(C)C(=O)C(C)=CC1=C1C=C(C)C(=O)C(C)=C1 QDRFIDSUGRGGAY-UHFFFAOYSA-N 0.000 claims 6
- -1 glycidyl compound Chemical class 0.000 claims 5
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 claims 3
- YGYPMFPGZQPETF-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenyl)-2,6-dimethylphenol Chemical group CC1=C(O)C(C)=CC(C=2C=C(C)C(O)=C(C)C=2)=C1 YGYPMFPGZQPETF-UHFFFAOYSA-N 0.000 claims 2
- 150000001339 alkali metal compounds Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000322630A JP2002128861A (ja) | 2000-10-23 | 2000-10-23 | エポキシ樹脂組成物及びその製法 |
| SG200106284A SG102009A1 (en) | 2000-10-23 | 2001-10-12 | Epoxy resin composition and process for producing the same |
| US09/977,415 US6548620B2 (en) | 2000-10-23 | 2001-10-16 | Epoxy resin composition and process for producing the same |
| KR1020010065039A KR20020031316A (ko) | 2000-10-23 | 2001-10-22 | 에폭시 수지 조성물 및 그의 제조 방법 |
| CNB011415789A CN1220729C (zh) | 2000-10-23 | 2001-10-22 | 环氧树脂组合物及其生产方法 |
| TW090126044A TW555777B (en) | 2000-10-23 | 2001-10-22 | Epoxy resin composition and process for producing the same |
| MYPI20014898A MY117629A (en) | 2000-10-23 | 2001-10-22 | Epoxy resin composition and process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000322630A JP2002128861A (ja) | 2000-10-23 | 2000-10-23 | エポキシ樹脂組成物及びその製法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004235954A Division JP2005002351A (ja) | 2004-08-13 | 2004-08-13 | 半導体封止用硬化性エポキシ樹脂組成物 |
| JP2004235908A Division JP2004315831A (ja) | 2004-08-13 | 2004-08-13 | エポキシ樹脂組成物の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002128861A JP2002128861A (ja) | 2002-05-09 |
| JP2002128861A5 true JP2002128861A5 (https=) | 2004-08-26 |
Family
ID=18800475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000322630A Pending JP2002128861A (ja) | 2000-10-23 | 2000-10-23 | エポキシ樹脂組成物及びその製法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6548620B2 (https=) |
| JP (1) | JP2002128861A (https=) |
| KR (1) | KR20020031316A (https=) |
| CN (1) | CN1220729C (https=) |
| MY (1) | MY117629A (https=) |
| SG (1) | SG102009A1 (https=) |
| TW (1) | TW555777B (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002363254A (ja) * | 2001-06-06 | 2002-12-18 | Nippon Kayaku Co Ltd | エポキシ化合物、エポキシ樹脂組成物及びその硬化物 |
| JP4433368B2 (ja) * | 2003-04-08 | 2010-03-17 | ジャパンエポキシレジン株式会社 | エポキシ樹脂粒状化物及びその製造方法 |
| JP5607447B2 (ja) * | 2010-07-22 | 2014-10-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
| JP6507506B2 (ja) * | 2014-07-16 | 2019-05-08 | 住友ベークライト株式会社 | 封止用樹脂組成物及び半導体装置 |
| SG11201704514XA (en) | 2014-12-04 | 2017-07-28 | Mitsubishi Chem Corp | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material |
| JP2019104906A (ja) * | 2017-12-12 | 2019-06-27 | 三菱ケミカル株式会社 | エポキシ樹脂組成物、硬化物及び電気・電子部品 |
| EP4375309A4 (en) * | 2021-07-19 | 2024-12-11 | Mitsubishi Chemical Corporation | PHENOLIC MIXTURE, EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRICAL/ELECTRONIC COMPONENT |
| TWI866272B (zh) * | 2022-06-14 | 2024-12-11 | 南韓商新亚Ｔ&Ｃ公司 | 四甲基雙酚型環氧樹脂以及其製備方法，四甲基雙酚型環氧樹脂組成物，固化物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5817077A (ja) * | 1981-07-22 | 1983-02-01 | 株式会社東芝 | エレベ−タの群管理制御方法 |
| JPS6147725A (ja) | 1984-08-16 | 1986-03-08 | Yuka Shell Epoxy Kk | 半導体封止用エポキシ樹脂組成物 |
| JPH0621086B2 (ja) | 1985-05-23 | 1994-03-23 | 三菱油化株式会社 | ３，３’，５，５’‐テトラメチル‐４，４’‐ジヒドロキシジフェニルの製造法 |
| JPH0212225A (ja) | 1988-06-30 | 1990-01-17 | Nippon Mektron Ltd | 電気泳動表示素子 |
| US5844062A (en) * | 1997-04-29 | 1998-12-01 | Industrial Technology Research Institute | Process for preparing phenolepoxy resins in the absence of an aqueous phase |
-
2000
- 2000-10-23 JP JP2000322630A patent/JP2002128861A/ja active Pending
-
2001
- 2001-10-12 SG SG200106284A patent/SG102009A1/en unknown
- 2001-10-16 US US09/977,415 patent/US6548620B2/en not_active Expired - Lifetime
- 2001-10-22 KR KR1020010065039A patent/KR20020031316A/ko not_active Ceased
- 2001-10-22 CN CNB011415789A patent/CN1220729C/zh not_active Expired - Lifetime
- 2001-10-22 TW TW090126044A patent/TW555777B/zh not_active IP Right Cessation
- 2001-10-22 MY MYPI20014898A patent/MY117629A/en unknown
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