JP2002075580A - 異方導電フィルムの製造方法 - Google Patents
異方導電フィルムの製造方法Info
- Publication number
- JP2002075580A JP2002075580A JP2000267374A JP2000267374A JP2002075580A JP 2002075580 A JP2002075580 A JP 2002075580A JP 2000267374 A JP2000267374 A JP 2000267374A JP 2000267374 A JP2000267374 A JP 2000267374A JP 2002075580 A JP2002075580 A JP 2002075580A
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- substrate
- film
- adhesive
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000267374A JP2002075580A (ja) | 2000-09-04 | 2000-09-04 | 異方導電フィルムの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000267374A JP2002075580A (ja) | 2000-09-04 | 2000-09-04 | 異方導電フィルムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002075580A true JP2002075580A (ja) | 2002-03-15 |
JP2002075580A5 JP2002075580A5 (enrdf_load_stackoverflow) | 2007-06-07 |
Family
ID=18754314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000267374A Pending JP2002075580A (ja) | 2000-09-04 | 2000-09-04 | 異方導電フィルムの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002075580A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7227730B2 (en) | 2004-05-28 | 2007-06-05 | Infineon Technolgoies Ag | Device for ESD protection of an integrated circuit |
JP2015025103A (ja) * | 2013-07-29 | 2015-02-05 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
US9155207B2 (en) | 2007-09-20 | 2015-10-06 | Dexerials Corporation | Method for producing an anisotropic conductive film |
KR20160037161A (ko) * | 2013-07-29 | 2016-04-05 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
CN108384475A (zh) * | 2013-07-29 | 2018-08-10 | 迪睿合株式会社 | 导电性粘接膜及其制造方法、连接体的制造方法 |
US20190090354A1 (en) * | 2015-11-26 | 2019-03-21 | Dexerials Corporation | Anisotropic conductive film |
KR20220048287A (ko) * | 2020-10-12 | 2022-04-19 | 조선대학교산학협력단 | 이방성 도전 필름, 그리고 전기수력학적 인쇄 기술을 이용한 이방성 도전 필름 제조 장치 |
-
2000
- 2000-09-04 JP JP2000267374A patent/JP2002075580A/ja active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7227730B2 (en) | 2004-05-28 | 2007-06-05 | Infineon Technolgoies Ag | Device for ESD protection of an integrated circuit |
US9155207B2 (en) | 2007-09-20 | 2015-10-06 | Dexerials Corporation | Method for producing an anisotropic conductive film |
KR101861451B1 (ko) * | 2013-07-29 | 2018-05-29 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
US11139629B2 (en) | 2013-07-29 | 2021-10-05 | Dexerials Corporation | Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector |
CN105358641A (zh) * | 2013-07-29 | 2016-02-24 | 迪睿合株式会社 | 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法 |
KR20160037161A (ko) * | 2013-07-29 | 2016-04-05 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
US20160149366A1 (en) * | 2013-07-29 | 2016-05-26 | Dexerials Corporation | Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector |
KR20180054935A (ko) * | 2013-07-29 | 2018-05-24 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
JP2015025103A (ja) * | 2013-07-29 | 2015-02-05 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
KR101883577B1 (ko) * | 2013-07-29 | 2018-07-30 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
CN108384475A (zh) * | 2013-07-29 | 2018-08-10 | 迪睿合株式会社 | 导电性粘接膜及其制造方法、连接体的制造方法 |
CN109722174B (zh) * | 2013-07-29 | 2022-04-29 | 迪睿合株式会社 | 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法 |
CN109722174A (zh) * | 2013-07-29 | 2019-05-07 | 迪睿合株式会社 | 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法 |
KR101986470B1 (ko) * | 2013-07-29 | 2019-06-05 | 데쿠세리아루즈 가부시키가이샤 | 도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법 |
WO2015016168A1 (ja) * | 2013-07-29 | 2015-02-05 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
US10827625B2 (en) * | 2015-11-26 | 2020-11-03 | Dexerials Corporation | Anisotropic conductive film |
US20190090354A1 (en) * | 2015-11-26 | 2019-03-21 | Dexerials Corporation | Anisotropic conductive film |
KR20220048287A (ko) * | 2020-10-12 | 2022-04-19 | 조선대학교산학협력단 | 이방성 도전 필름, 그리고 전기수력학적 인쇄 기술을 이용한 이방성 도전 필름 제조 장치 |
KR102461932B1 (ko) * | 2020-10-12 | 2022-10-31 | 조선대학교 산학협력단 | 이방성 도전 필름, 그리고 전기수력학적 인쇄 기술을 이용한 이방성 도전 필름 제조 장치 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5317438A (en) | Liquid crystal display device and method of producing the same having an improved connection between a flexible film substrate and a drive circuit substrate | |
US20040183182A1 (en) | Apparatus incorporating small-feature-size and large-feature-size components and method for making same | |
US4999460A (en) | Conductive connecting structure | |
JPH0738502B2 (ja) | 回路基板の接続方法 | |
EP0385787B1 (en) | Method of producing connection electrodes | |
WO1998038701A9 (en) | Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive, and method for manufacturing the adhesive | |
JP2005128528A (ja) | インターコネクタ,ディスプレイ装置,及びインターコネクタの接続方法 | |
WO1995004387A1 (en) | An electrical connecting structure and a method for electrically connecting terminals to each other | |
JP2002075580A (ja) | 異方導電フィルムの製造方法 | |
US7466030B2 (en) | Semiconductor device and fabrication process thereof | |
JPH0567480A (ja) | 異方導電性接着樹脂層及びその製造方法 | |
JP2004202738A (ja) | 接着材テープの接続方法 | |
JP2002075488A (ja) | 異方性導電膜及びその製造方法 | |
JPH0362411A (ja) | 異方性導電フィルムの製造方法 | |
JP2888466B2 (ja) | ヒートシールコネクターの製造方法 | |
JP2004335663A (ja) | 異方導電フィルムの製造方法 | |
KR100766563B1 (ko) | 플라즈마 디스플레이 패널 및 그 제조방법 | |
JPH08320498A (ja) | 液晶表示パネルの端子接続構造 | |
JPH0696620A (ja) | 異方性導電材料および該材料を用いた回路の接続方法並びに電気回路基板 | |
JP2000174066A (ja) | 半導体装置の実装方法 | |
JPH08102464A (ja) | 突起電極構造とその形成方法及び突起電極を用いた接続構造とその接続方法 | |
JPH1084178A (ja) | 微小物体の配列方法及び該配列方法を用いた接続構造の形成方法 | |
JP2005019274A (ja) | 異方導電フィルムの製造方法 | |
JPS63299242A (ja) | 半導体装置の接続方法 | |
JP2006024551A (ja) | 異方導電フィルムの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070412 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070412 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080516 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080528 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081008 |