JP2002060945A5 - - Google Patents
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- Publication number
- JP2002060945A5 JP2002060945A5 JP2001109076A JP2001109076A JP2002060945A5 JP 2002060945 A5 JP2002060945 A5 JP 2002060945A5 JP 2001109076 A JP2001109076 A JP 2001109076A JP 2001109076 A JP2001109076 A JP 2001109076A JP 2002060945 A5 JP2002060945 A5 JP 2002060945A5
- Authority
- JP
- Japan
- Prior art keywords
- power
- silicon
- chamber
- less
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/544,728 US6451390B1 (en) | 2000-04-06 | 2000-04-06 | Deposition of TEOS oxide using pulsed RF plasma |
| US09/544728 | 2000-04-06 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010288412A Division JP5323804B2 (ja) | 2000-04-06 | 2010-12-24 | パルスｒｆプラズマを用いたｔｅｏｓ酸化物の堆積 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002060945A JP2002060945A (ja) | 2002-02-28 |
| JP2002060945A5 true JP2002060945A5 (https=) | 2006-04-20 |
Family
ID=24173335
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001109076A Pending JP2002060945A (ja) | 2000-04-06 | 2001-04-06 | パルスｒｆプラズマを用いたｔｅｏｓ酸化物の堆積 |
| JP2010288412A Expired - Fee Related JP5323804B2 (ja) | 2000-04-06 | 2010-12-24 | パルスｒｆプラズマを用いたｔｅｏｓ酸化物の堆積 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010288412A Expired - Fee Related JP5323804B2 (ja) | 2000-04-06 | 2010-12-24 | パルスｒｆプラズマを用いたｔｅｏｓ酸化物の堆積 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6451390B1 (https=) |
| JP (2) | JP2002060945A (https=) |
| KR (1) | KR100708322B1 (https=) |
| TW (1) | TWI225106B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6962732B2 (en) * | 2001-08-23 | 2005-11-08 | Applied Materials, Inc. | Process for controlling thin film uniformity and products produced thereby |
| US9708707B2 (en) * | 2001-09-10 | 2017-07-18 | Asm International N.V. | Nanolayer deposition using bias power treatment |
| WO2004044039A2 (en) * | 2002-11-12 | 2004-05-27 | Dow Global Technologies Inc. | Process and apparatus for depositing plasma coating onto a container |
| US9121098B2 (en) | 2003-02-04 | 2015-09-01 | Asm International N.V. | NanoLayer Deposition process for composite films |
| US7713592B2 (en) | 2003-02-04 | 2010-05-11 | Tegal Corporation | Nanolayer deposition process |
| US7199061B2 (en) * | 2003-04-21 | 2007-04-03 | Applied Materials, Inc. | Pecvd silicon oxide thin film deposition |
| US20070099417A1 (en) * | 2005-10-28 | 2007-05-03 | Applied Materials, Inc. | Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop |
| US8025932B2 (en) * | 2007-02-21 | 2011-09-27 | Colorado School Of Mines | Self-limiting thin film synthesis achieved by pulsed plasma-enhanced chemical vapor deposition |
| US20090325391A1 (en) * | 2008-06-30 | 2009-12-31 | Asm International Nv | Ozone and teos process for silicon oxide deposition |
| US9496405B2 (en) * | 2010-05-20 | 2016-11-15 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer |
| TWI501307B (zh) * | 2013-07-31 | 2015-09-21 | 盛美半導體設備（上海）有限公司 | Pulse electrochemical polishing method and device |
| US9887277B2 (en) * | 2015-01-23 | 2018-02-06 | Applied Materials, Inc. | Plasma treatment on metal-oxide TFT |
| US10199388B2 (en) * | 2015-08-27 | 2019-02-05 | Applied Mateerials, Inc. | VNAND tensile thick TEOS oxide |
| KR102216380B1 (ko) * | 2016-12-08 | 2021-02-17 | 주식회사 원익아이피에스 | 반도체 소자의 패터닝 방법 |
| CN111303638A (zh) * | 2020-04-17 | 2020-06-19 | 广东思泉新材料股份有限公司 | 一种导热硅橡胶垫片的制备方法 |
| CN116043190A (zh) * | 2022-11-02 | 2023-05-02 | 长鑫存储技术有限公司 | 二氧化硅薄膜及其预沉积方法、半导体结构 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8516537D0 (en) | 1985-06-29 | 1985-07-31 | Standard Telephones Cables Ltd | Pulsed plasma apparatus |
| DE59209786D1 (de) * | 1991-09-20 | 2000-02-03 | Balzers Hochvakuum | Verfahren zur Schutzbeschichtung von Substraten sowie Beschichtungsanlage |
| JPH086181B2 (ja) | 1992-11-30 | 1996-01-24 | 日本電気株式会社 | 化学気相成長法および化学気相成長装置 |
| JPH0794421A (ja) | 1993-09-21 | 1995-04-07 | Anelva Corp | アモルファスシリコン薄膜の製造方法 |
| JPH0817744A (ja) * | 1994-06-29 | 1996-01-19 | Sony Corp | ヘリコン波プラズマ装置およびこれを用いたプラズマｃｖｄ方法 |
| JPH08181276A (ja) * | 1994-12-26 | 1996-07-12 | Toshiba Corp | 半導体装置の製造方法 |
| US5618758A (en) | 1995-02-17 | 1997-04-08 | Sharp Kabushiki Kaisha | Method for forming a thin semiconductor film and a plasma CVD apparatus to be used in the method |
| JP3388651B2 (ja) * | 1995-04-07 | 2003-03-24 | 株式会社アルバック | 絶縁膜の形成方法 |
| JPH098030A (ja) * | 1995-06-23 | 1997-01-10 | Sony Corp | シリコン系酸化膜の製造方法 |
| US5968377A (en) * | 1996-05-24 | 1999-10-19 | Sekisui Chemical Co., Ltd. | Treatment method in glow-discharge plasma and apparatus thereof |
| US5882411A (en) * | 1996-10-21 | 1999-03-16 | Applied Materials, Inc. | Faceplate thermal choke in a CVD plasma reactor |
-
2000
- 2000-04-06 US US09/544,728 patent/US6451390B1/en not_active Expired - Lifetime
-
2001
- 2001-03-30 TW TW090107793A patent/TWI225106B/zh not_active IP Right Cessation
- 2001-04-06 KR KR1020010018268A patent/KR100708322B1/ko not_active Expired - Fee Related
- 2001-04-06 JP JP2001109076A patent/JP2002060945A/ja active Pending
-
2002
- 2002-07-19 US US10/200,457 patent/US20020192475A1/en not_active Abandoned
-
2010
- 2010-12-24 JP JP2010288412A patent/JP5323804B2/ja not_active Expired - Fee Related
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