JP2002008962A5 - - Google Patents
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- JP2002008962A5 JP2002008962A5 JP2000183410A JP2000183410A JP2002008962A5 JP 2002008962 A5 JP2002008962 A5 JP 2002008962A5 JP 2000183410 A JP2000183410 A JP 2000183410A JP 2000183410 A JP2000183410 A JP 2000183410A JP 2002008962 A5 JP2002008962 A5 JP 2002008962A5
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000183410A JP4579376B2 (ja) | 2000-06-19 | 2000-06-19 | 露光装置およびデバイス製造方法 |
| DE60138509T DE60138509D1 (de) | 2000-06-19 | 2001-06-18 | Referenzplatte für einen Belichtungsapparat |
| US09/881,804 US6608666B2 (en) | 2000-06-19 | 2001-06-18 | Reference plate, exposure apparatus, device manufacturing system, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method |
| EP01305290A EP1168085B1 (en) | 2000-06-19 | 2001-06-18 | Reference plate for exposure apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000183410A JP4579376B2 (ja) | 2000-06-19 | 2000-06-19 | 露光装置およびデバイス製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002008962A JP2002008962A (ja) | 2002-01-11 |
| JP2002008962A5 true JP2002008962A5 (enExample) | 2007-08-02 |
| JP4579376B2 JP4579376B2 (ja) | 2010-11-10 |
Family
ID=18684001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000183410A Expired - Fee Related JP4579376B2 (ja) | 2000-06-19 | 2000-06-19 | 露光装置およびデバイス製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6608666B2 (enExample) |
| EP (1) | EP1168085B1 (enExample) |
| JP (1) | JP4579376B2 (enExample) |
| DE (1) | DE60138509D1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040071161A1 (en) * | 2000-06-30 | 2004-04-15 | Tokyo Electron Limited | Part maintenance system and part maintenance method of semiconductor processing system |
| US7095484B1 (en) * | 2001-06-27 | 2006-08-22 | University Of South Florida | Method and apparatus for maskless photolithography |
| EP1276016B1 (en) * | 2001-07-09 | 2009-06-10 | Canon Kabushiki Kaisha | Exposure apparatus |
| JP2004206702A (ja) * | 2002-12-12 | 2004-07-22 | Tokyo Electron Ltd | パーツ管理システム及び方法、並びにプログラム及び記憶媒体 |
| JP4101076B2 (ja) * | 2003-02-06 | 2008-06-11 | キヤノン株式会社 | 位置検出方法及び装置 |
| TW201738932A (zh) | 2003-10-09 | 2017-11-01 | Nippon Kogaku Kk | 曝光裝置及曝光方法、元件製造方法 |
| US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
| JP2006173377A (ja) * | 2004-12-16 | 2006-06-29 | Nikon Corp | 光学部品及び投影露光装置 |
| JP4923480B2 (ja) * | 2005-08-23 | 2012-04-25 | 株式会社ニコン | 露光装置及びデバイス製造方法、計測部材 |
| KR101435124B1 (ko) * | 2008-04-29 | 2014-08-29 | 삼성전자 주식회사 | 노광 장치의 정렬 방법, 이를 이용한 감광막의 노광 방법및 감광막의 노광 방법을 수행하기 위한 노광 장치 |
| NL2002998A1 (nl) | 2008-06-18 | 2009-12-22 | Asml Netherlands Bv | Lithographic apparatus. |
| NL2003529A (en) * | 2008-10-24 | 2010-04-27 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method and position control method. |
| JP5355245B2 (ja) * | 2009-06-25 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
| JP2015509666A (ja) | 2012-03-08 | 2015-03-30 | マッパー・リソグラフィー・アイピー・ビー．ブイ． | アライメントセンサーとビーム測定センサーを備えている荷電粒子リソグラフィシステム |
| EP2823361B1 (en) | 2012-03-08 | 2022-03-02 | ASML Netherlands B.V. | Lithography system and method for processing a target, such as a wafer |
| JP7089348B2 (ja) * | 2017-07-28 | 2022-06-22 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL301413A (enExample) * | 1963-12-05 | |||
| JPS57119348A (en) * | 1981-01-17 | 1982-07-24 | Mitsubishi Electric Corp | Hard mask |
| JPS58214154A (ja) * | 1982-06-08 | 1983-12-13 | Nec Corp | フオトマスク |
| JPH0325913A (ja) * | 1989-06-23 | 1991-02-04 | Nec Kyushu Ltd | 縮小投影型露光装置 |
| JPH0437113A (ja) * | 1990-06-01 | 1992-02-07 | Mitsubishi Electric Corp | 縮小投影露光装置 |
| KR100254024B1 (ko) * | 1990-07-23 | 2000-06-01 | 가나이 쓰도무 | 반도체 장치의 제조 방법 |
| JPH04155813A (ja) * | 1990-10-19 | 1992-05-28 | Nec Corp | アライメントマーク |
| US5477309A (en) * | 1992-03-09 | 1995-12-19 | Nikon Corporation | Alignment apparatus |
| JP3420314B2 (ja) | 1993-12-03 | 2003-06-23 | キヤノン株式会社 | 位置ずれ計測方法及びそれを用いた計測装置 |
| JPH07249558A (ja) * | 1994-03-09 | 1995-09-26 | Nikon Corp | 位置合わせ方法 |
| JP3555230B2 (ja) * | 1994-05-18 | 2004-08-18 | 株式会社ニコン | 投影露光装置 |
| US6018384A (en) * | 1994-09-07 | 2000-01-25 | Nikon Corporation | Projection exposure system |
| JP3555208B2 (ja) * | 1994-12-14 | 2004-08-18 | 株式会社ニコン | 露光方法 |
| US5751404A (en) * | 1995-07-24 | 1998-05-12 | Canon Kabushiki Kaisha | Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates |
| JP3437352B2 (ja) | 1995-10-02 | 2003-08-18 | キヤノン株式会社 | 照明光学系及び光源装置 |
| US6242792B1 (en) * | 1996-07-02 | 2001-06-05 | Denso Corporation | Semiconductor device having oblique portion as reflection |
| JP3428829B2 (ja) | 1996-08-27 | 2003-07-22 | キヤノン株式会社 | 位置合わせ方法及びそれを用いた投影露光装置 |
| KR100197885B1 (ko) * | 1996-12-23 | 1999-06-15 | 윤종용 | 노광설비의 기준마크 보호장치 |
| JPH10284412A (ja) * | 1997-04-10 | 1998-10-23 | Nikon Corp | 外部と光を授受するステージ装置及び投影露光装置 |
| US5981352A (en) * | 1997-09-08 | 1999-11-09 | Lsi Logic Corporation | Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer |
| US5985764A (en) * | 1997-12-22 | 1999-11-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Layer independent alignment system |
| JP3090113B2 (ja) * | 1998-02-13 | 2000-09-18 | 日本電気株式会社 | 半導体装置の製造方法 |
| US6197481B1 (en) * | 1998-09-17 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company | Wafer alignment marks protected by photoresist |
| US6294018B1 (en) * | 1999-09-15 | 2001-09-25 | Lucent Technologies | Alignment techniques for epitaxial growth processes |
| US6057206A (en) * | 1999-10-01 | 2000-05-02 | Advanced Micro Devices, Inc. | Mark protection scheme with no masking |
| US6417076B1 (en) * | 2000-06-05 | 2002-07-09 | Micron Technology, Inc. | Automated combi deposition apparatus and method |
| TW497204B (en) * | 2001-02-08 | 2002-08-01 | Mosel Vitelic Inc | Method for protecting alignment mark of stepping machine |
-
2000
- 2000-06-19 JP JP2000183410A patent/JP4579376B2/ja not_active Expired - Fee Related
-
2001
- 2001-06-18 DE DE60138509T patent/DE60138509D1/de not_active Expired - Lifetime
- 2001-06-18 EP EP01305290A patent/EP1168085B1/en not_active Expired - Lifetime
- 2001-06-18 US US09/881,804 patent/US6608666B2/en not_active Expired - Fee Related