DE60138509D1 - Referenzplatte für einen Belichtungsapparat - Google Patents
Referenzplatte für einen BelichtungsapparatInfo
- Publication number
- DE60138509D1 DE60138509D1 DE60138509T DE60138509T DE60138509D1 DE 60138509 D1 DE60138509 D1 DE 60138509D1 DE 60138509 T DE60138509 T DE 60138509T DE 60138509 T DE60138509 T DE 60138509T DE 60138509 D1 DE60138509 D1 DE 60138509D1
- Authority
- DE
- Germany
- Prior art keywords
- exposure apparatus
- reference plate
- plate
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000183410A JP4579376B2 (ja) | 2000-06-19 | 2000-06-19 | 露光装置およびデバイス製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60138509D1 true DE60138509D1 (de) | 2009-06-10 |
Family
ID=18684001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60138509T Expired - Lifetime DE60138509D1 (de) | 2000-06-19 | 2001-06-18 | Referenzplatte für einen Belichtungsapparat |
Country Status (4)
Country | Link |
---|---|
US (1) | US6608666B2 (de) |
EP (1) | EP1168085B1 (de) |
JP (1) | JP4579376B2 (de) |
DE (1) | DE60138509D1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040071161A1 (en) * | 2000-06-30 | 2004-04-15 | Tokyo Electron Limited | Part maintenance system and part maintenance method of semiconductor processing system |
US7095484B1 (en) * | 2001-06-27 | 2006-08-22 | University Of South Florida | Method and apparatus for maskless photolithography |
DE60232568D1 (de) * | 2001-07-09 | 2009-07-23 | Canon Kk | Belichtungsapparat |
JP2004206702A (ja) * | 2002-12-12 | 2004-07-22 | Tokyo Electron Ltd | パーツ管理システム及び方法、並びにプログラム及び記憶媒体 |
JP4101076B2 (ja) * | 2003-02-06 | 2008-06-11 | キヤノン株式会社 | 位置検出方法及び装置 |
TW201738932A (zh) | 2003-10-09 | 2017-11-01 | Nippon Kogaku Kk | 曝光裝置及曝光方法、元件製造方法 |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
JP2006173377A (ja) * | 2004-12-16 | 2006-06-29 | Nikon Corp | 光学部品及び投影露光装置 |
JP4923480B2 (ja) * | 2005-08-23 | 2012-04-25 | 株式会社ニコン | 露光装置及びデバイス製造方法、計測部材 |
KR101435124B1 (ko) * | 2008-04-29 | 2014-08-29 | 삼성전자 주식회사 | 노광 장치의 정렬 방법, 이를 이용한 감광막의 노광 방법및 감광막의 노광 방법을 수행하기 위한 노광 장치 |
NL2002998A1 (nl) * | 2008-06-18 | 2009-12-22 | Asml Netherlands Bv | Lithographic apparatus. |
NL2003529A (en) * | 2008-10-24 | 2010-04-27 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method and position control method. |
JP5355245B2 (ja) * | 2009-06-25 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
KR101902469B1 (ko) * | 2012-03-08 | 2018-09-28 | 마퍼 리쏘그라피 아이피 비.브이. | 정렬 센서 및 빔 측정 센서를 갖는 하전 입자 리소그래피 시스템 |
WO2013132081A2 (en) * | 2012-03-08 | 2013-09-12 | Mapper Lithography Ip B.V. | Lithography system and method for processing a target, such as a wafer |
JP7089348B2 (ja) * | 2017-07-28 | 2022-06-22 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL301413A (de) * | 1963-12-05 | |||
JPS57119348A (en) * | 1981-01-17 | 1982-07-24 | Mitsubishi Electric Corp | Hard mask |
JPS58214154A (ja) * | 1982-06-08 | 1983-12-13 | Nec Corp | フオトマスク |
JPH0325913A (ja) * | 1989-06-23 | 1991-02-04 | Nec Kyushu Ltd | 縮小投影型露光装置 |
JPH0437113A (ja) * | 1990-06-01 | 1992-02-07 | Mitsubishi Electric Corp | 縮小投影露光装置 |
KR100254024B1 (ko) * | 1990-07-23 | 2000-06-01 | 가나이 쓰도무 | 반도체 장치의 제조 방법 |
JPH04155813A (ja) * | 1990-10-19 | 1992-05-28 | Nec Corp | アライメントマーク |
US5477309A (en) * | 1992-03-09 | 1995-12-19 | Nikon Corporation | Alignment apparatus |
JP3420314B2 (ja) | 1993-12-03 | 2003-06-23 | キヤノン株式会社 | 位置ずれ計測方法及びそれを用いた計測装置 |
JPH07249558A (ja) * | 1994-03-09 | 1995-09-26 | Nikon Corp | 位置合わせ方法 |
JP3555230B2 (ja) * | 1994-05-18 | 2004-08-18 | 株式会社ニコン | 投影露光装置 |
US6018384A (en) * | 1994-09-07 | 2000-01-25 | Nikon Corporation | Projection exposure system |
JP3555208B2 (ja) * | 1994-12-14 | 2004-08-18 | 株式会社ニコン | 露光方法 |
US5751404A (en) * | 1995-07-24 | 1998-05-12 | Canon Kabushiki Kaisha | Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates |
JP3437352B2 (ja) | 1995-10-02 | 2003-08-18 | キヤノン株式会社 | 照明光学系及び光源装置 |
US6242792B1 (en) * | 1996-07-02 | 2001-06-05 | Denso Corporation | Semiconductor device having oblique portion as reflection |
JP3428829B2 (ja) | 1996-08-27 | 2003-07-22 | キヤノン株式会社 | 位置合わせ方法及びそれを用いた投影露光装置 |
KR100197885B1 (ko) * | 1996-12-23 | 1999-06-15 | 윤종용 | 노광설비의 기준마크 보호장치 |
JPH10284412A (ja) * | 1997-04-10 | 1998-10-23 | Nikon Corp | 外部と光を授受するステージ装置及び投影露光装置 |
US5981352A (en) * | 1997-09-08 | 1999-11-09 | Lsi Logic Corporation | Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer |
US5985764A (en) * | 1997-12-22 | 1999-11-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Layer independent alignment system |
JP3090113B2 (ja) * | 1998-02-13 | 2000-09-18 | 日本電気株式会社 | 半導体装置の製造方法 |
US6197481B1 (en) * | 1998-09-17 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company | Wafer alignment marks protected by photoresist |
US6294018B1 (en) * | 1999-09-15 | 2001-09-25 | Lucent Technologies | Alignment techniques for epitaxial growth processes |
US6057206A (en) * | 1999-10-01 | 2000-05-02 | Advanced Micro Devices, Inc. | Mark protection scheme with no masking |
US6417076B1 (en) * | 2000-06-05 | 2002-07-09 | Micron Technology, Inc. | Automated combi deposition apparatus and method |
TW497204B (en) * | 2001-02-08 | 2002-08-01 | Mosel Vitelic Inc | Method for protecting alignment mark of stepping machine |
-
2000
- 2000-06-19 JP JP2000183410A patent/JP4579376B2/ja not_active Expired - Fee Related
-
2001
- 2001-06-18 US US09/881,804 patent/US6608666B2/en not_active Expired - Fee Related
- 2001-06-18 DE DE60138509T patent/DE60138509D1/de not_active Expired - Lifetime
- 2001-06-18 EP EP01305290A patent/EP1168085B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4579376B2 (ja) | 2010-11-10 |
US6608666B2 (en) | 2003-08-19 |
EP1168085B1 (de) | 2009-04-29 |
JP2002008962A (ja) | 2002-01-11 |
US20020067473A1 (en) | 2002-06-06 |
EP1168085A3 (de) | 2005-12-07 |
EP1168085A2 (de) | 2002-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |