DE60232568D1 - Belichtungsapparat - Google Patents
BelichtungsapparatInfo
- Publication number
- DE60232568D1 DE60232568D1 DE60232568T DE60232568T DE60232568D1 DE 60232568 D1 DE60232568 D1 DE 60232568D1 DE 60232568 T DE60232568 T DE 60232568T DE 60232568 T DE60232568 T DE 60232568T DE 60232568 D1 DE60232568 D1 DE 60232568D1
- Authority
- DE
- Germany
- Prior art keywords
- exposure apparatus
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Water Treatments (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001207363A JP2003022955A (ja) | 2001-07-09 | 2001-07-09 | 露光装置 |
JP2001208961A JP2003022963A (ja) | 2001-07-10 | 2001-07-10 | 露光装置 |
JP2001274762A JP2003086486A (ja) | 2001-09-11 | 2001-09-11 | 露光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232568D1 true DE60232568D1 (de) | 2009-07-23 |
Family
ID=27347109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232568T Expired - Lifetime DE60232568D1 (de) | 2001-07-09 | 2002-06-26 | Belichtungsapparat |
Country Status (4)
Country | Link |
---|---|
US (3) | US7038759B2 (de) |
EP (2) | EP1276016B1 (de) |
KR (1) | KR100492476B1 (de) |
DE (1) | DE60232568D1 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60232568D1 (de) * | 2001-07-09 | 2009-07-23 | Canon Kk | Belichtungsapparat |
JP2004146492A (ja) * | 2002-10-23 | 2004-05-20 | Canon Inc | Euv露光装置 |
US7282821B2 (en) * | 2002-01-28 | 2007-10-16 | Canon Kabushiki Kaisha | Linear motor, stage apparatus, exposure apparatus, and device manufacturing apparatus |
JP2004134566A (ja) * | 2002-10-10 | 2004-04-30 | Canon Inc | デバイス製造装置 |
CN1723541B (zh) * | 2002-12-10 | 2010-06-02 | 株式会社尼康 | 曝光装置和器件制造方法 |
JP2004247688A (ja) * | 2003-02-17 | 2004-09-02 | Canon Inc | 冷媒供給装置 |
KR20110110320A (ko) * | 2003-05-28 | 2011-10-06 | 가부시키가이샤 니콘 | 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP3748559B2 (ja) * | 2003-06-30 | 2006-02-22 | キヤノン株式会社 | ステージ装置、露光装置、荷電ビーム描画装置、デバイス製造方法、基板電位測定方法及び静電チャック |
JP4515385B2 (ja) | 2003-07-09 | 2010-07-28 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
TWI245163B (en) * | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
JP3894562B2 (ja) | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | 基板吸着装置、露光装置およびデバイス製造方法 |
JP3814598B2 (ja) * | 2003-10-02 | 2006-08-30 | キヤノン株式会社 | 温度調整装置、露光装置及びデバイス製造方法 |
EP1531362A3 (de) * | 2003-11-13 | 2007-07-25 | Matsushita Electric Industrial Co., Ltd. | Vorrichtung zur Herstellung von Halbleitern und Methode zur Bildung von Mustern |
JP4418699B2 (ja) * | 2004-03-24 | 2010-02-17 | キヤノン株式会社 | 露光装置 |
JP4418710B2 (ja) * | 2004-05-17 | 2010-02-24 | キヤノン株式会社 | ステージ装置 |
KR20170016532A (ko) * | 2004-06-09 | 2017-02-13 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
CN100349333C (zh) * | 2004-07-14 | 2007-11-14 | 发那科株式会社 | 激光装置 |
JP3981682B2 (ja) * | 2004-07-14 | 2007-09-26 | ファナック株式会社 | レーザ装置 |
CN100434830C (zh) * | 2004-09-29 | 2008-11-19 | 周庆龙 | 去阴阳离子防止氧化作用的冷却系统 |
CN101032068B (zh) * | 2004-10-01 | 2010-12-22 | 株式会社尼康 | 线性电机、载台装置和曝光装置 |
US6973958B1 (en) * | 2004-10-19 | 2005-12-13 | Ching-Lung Chou | Heat transfer apparatus having anti-oxidization device |
JP4326461B2 (ja) * | 2004-11-15 | 2009-09-09 | Smc株式会社 | 小流量液体の温調システム |
JP4576270B2 (ja) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | ハンダ回路基板の製造方法 |
JP2006287014A (ja) * | 2005-04-01 | 2006-10-19 | Canon Inc | 位置決め装置およびリニアモータ |
WO2007007865A1 (en) * | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
US20090041990A1 (en) * | 2005-09-09 | 2009-02-12 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
US7714980B2 (en) * | 2006-02-15 | 2010-05-11 | Canon Kabushiki Kaisha | Exposure apparatus, exposure method, and exposure system |
US20070257563A1 (en) * | 2006-05-06 | 2007-11-08 | Lieh-Feng Huang | Heat Dissipating Arrangement for a Linear Motor |
JP5020662B2 (ja) * | 2006-05-26 | 2012-09-05 | キヤノン株式会社 | ステージ装置、露光装置、及びデバイス製造方法 |
KR20090106555A (ko) * | 2006-12-27 | 2009-10-09 | 가부시키가이샤 니콘 | 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법 |
US8339573B2 (en) * | 2009-05-27 | 2012-12-25 | 3M Innovative Properties Company | Method and apparatus for photoimaging a substrate |
JP6404110B2 (ja) * | 2014-12-18 | 2018-10-10 | 信越化学工業株式会社 | シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物 |
JP2016186998A (ja) * | 2015-03-27 | 2016-10-27 | 株式会社東芝 | 半導体製造装置および半導体製造方法 |
KR102447776B1 (ko) * | 2018-01-19 | 2022-09-26 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치, 동작 방법 및 디바이스 제조 방법 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60158626A (ja) * | 1984-01-30 | 1985-08-20 | Canon Inc | 半導体露光装置 |
JPH01245893A (ja) * | 1987-12-07 | 1989-10-02 | Fujitsu Ltd | 超純水の製造方法 |
EP0357423B1 (de) * | 1988-09-02 | 1995-03-15 | Canon Kabushiki Kaisha | Belichtungseinrichtung |
DE68922061T2 (de) * | 1988-10-03 | 1995-08-31 | Canon Kk | Vorrichtung zum Regeln der Temperatur. |
US5231291A (en) * | 1989-08-01 | 1993-07-27 | Canon Kabushiki Kaisha | Wafer table and exposure apparatus with the same |
JPH0390847A (ja) * | 1989-09-02 | 1991-04-16 | Fuji Electric Co Ltd | 純水純度測定装置 |
US5190627A (en) * | 1989-11-07 | 1993-03-02 | Ebara Corporation | Process for removing dissolved oxygen from water and system therefor |
US5220171A (en) * | 1990-11-01 | 1993-06-15 | Canon Kabushiki Kaisha | Wafer holding device in an exposure apparatus |
JP2746047B2 (ja) | 1993-03-26 | 1998-04-28 | 三菱電機株式会社 | 純水使用の循環冷却装置 |
US5696623A (en) * | 1993-08-05 | 1997-12-09 | Fujitsu Limited | UV exposure with elongated service lifetime |
JP3148512B2 (ja) | 1994-05-02 | 2001-03-19 | キヤノン株式会社 | 駆動装置 |
JP2994203B2 (ja) | 1994-05-02 | 1999-12-27 | キヤノン株式会社 | 駆動装置 |
US6297871B1 (en) * | 1995-09-12 | 2001-10-02 | Nikon Corporation | Exposure apparatus |
US5971565A (en) * | 1995-10-20 | 1999-10-26 | Regents Of The University Of California | Lamp system with conditioned water coolant and diffuse reflector of polytetrafluorethylene(PTFE) |
US5959732A (en) * | 1996-04-10 | 1999-09-28 | Nikon Corporation | Stage apparatus and a stage control method |
JP3498475B2 (ja) | 1996-04-22 | 2004-02-16 | 株式会社日立製作所 | 冷却水供給装置 |
JP3661291B2 (ja) * | 1996-08-01 | 2005-06-15 | 株式会社ニコン | 露光装置 |
JP3278380B2 (ja) | 1997-03-06 | 2002-04-30 | キヤノン株式会社 | リニアモータ |
US6084319A (en) * | 1996-10-16 | 2000-07-04 | Canon Kabushiki Kaisha | Linear motor, and stage device and exposure apparatus provided with the same |
JPH10209036A (ja) * | 1997-01-24 | 1998-08-07 | Canon Inc | 露光方法および露光装置 |
JPH10245893A (ja) | 1997-03-07 | 1998-09-14 | Sekisui Chem Co Ltd | 壁パネル、建物ユニット及び建物ユニットの懸吊方法 |
JPH10262351A (ja) | 1997-03-19 | 1998-09-29 | Hitachi Ltd | 水冷発電機固定子コイルの製造方法 |
JPH11184539A (ja) * | 1997-12-24 | 1999-07-09 | Canon Inc | 駆動装置及びこれを用いたステージ装置や露光装置 |
JPH11307430A (ja) * | 1998-04-23 | 1999-11-05 | Canon Inc | 露光装置およびデバイス製造方法ならびに駆動装置 |
KR100271766B1 (ko) | 1998-04-28 | 2001-01-15 | 윤종용 | 반도체 장치 제조설비의 진단 시스템과 이를 이용한 식각설비및 노광설비 |
JP4011218B2 (ja) * | 1999-01-04 | 2007-11-21 | 株式会社東芝 | 基板処理装置及び基板処理方法 |
JP4583530B2 (ja) | 1999-03-19 | 2010-11-17 | オルガノ株式会社 | 熱交換用水及びその供給装置 |
JP2000350414A (ja) | 1999-06-03 | 2000-12-15 | Hitachi Ltd | タービン発電機の運転方法 |
US6590355B1 (en) * | 1999-06-07 | 2003-07-08 | Nikon Corporation | Linear motor device, stage device, and exposure apparatus |
JP2000348932A (ja) * | 1999-06-07 | 2000-12-15 | Nikon Corp | ステージ装置及び露光装置 |
US6266073B1 (en) * | 1999-08-19 | 2001-07-24 | Hewlett-Packard Co. | Four beam electrophotographic printing apparatus |
JP4117598B2 (ja) * | 2000-01-25 | 2008-07-16 | 信越半導体株式会社 | ウェーハ収納容器及びその発塵防止方法並びにウェーハの収納方法 |
TWI238292B (en) * | 2000-02-10 | 2005-08-21 | Asml Netherlands Bv | Lithographic projection apparatus having a temperature controlled heat shield |
JP3870002B2 (ja) * | 2000-04-07 | 2007-01-17 | キヤノン株式会社 | 露光装置 |
JP2001345250A (ja) * | 2000-06-01 | 2001-12-14 | Canon Inc | 位置合せ方法、位置合せ装置、プロファイラ、露光装置、半導体デバイス製造方法、半導体製造工場、および露光装置の保守方法 |
JP4579376B2 (ja) * | 2000-06-19 | 2010-11-10 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
DE60232568D1 (de) | 2001-07-09 | 2009-07-23 | Canon Kk | Belichtungsapparat |
AU2009219100B2 (en) | 2008-02-29 | 2014-09-11 | Silesco Pty Ltd | An orthopaedic safety system |
-
2002
- 2002-06-26 DE DE60232568T patent/DE60232568D1/de not_active Expired - Lifetime
- 2002-06-26 EP EP02254504A patent/EP1276016B1/de not_active Expired - Lifetime
- 2002-06-26 EP EP08168735A patent/EP2017675A1/de not_active Withdrawn
- 2002-07-03 US US10/187,841 patent/US7038759B2/en not_active Expired - Fee Related
- 2002-07-08 KR KR10-2002-0039264A patent/KR100492476B1/ko not_active IP Right Cessation
-
2005
- 2005-05-13 US US11/128,220 patent/US7057703B2/en not_active Expired - Fee Related
- 2005-10-07 US US11/245,242 patent/US7391496B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100492476B1 (ko) | 2005-06-03 |
EP1276016B1 (de) | 2009-06-10 |
EP2017675A1 (de) | 2009-01-21 |
US20030007136A1 (en) | 2003-01-09 |
US20060028629A1 (en) | 2006-02-09 |
US20050213062A1 (en) | 2005-09-29 |
US7057703B2 (en) | 2006-06-06 |
KR20030007041A (ko) | 2003-01-23 |
US7038759B2 (en) | 2006-05-02 |
US7391496B2 (en) | 2008-06-24 |
EP1276016A3 (de) | 2005-06-15 |
EP1276016A2 (de) | 2003-01-15 |
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