JP2001518980A - 高強度の銀−パラジウム合金 - Google Patents
高強度の銀−パラジウム合金Info
- Publication number
- JP2001518980A JP2001518980A JP54308598A JP54308598A JP2001518980A JP 2001518980 A JP2001518980 A JP 2001518980A JP 54308598 A JP54308598 A JP 54308598A JP 54308598 A JP54308598 A JP 54308598A JP 2001518980 A JP2001518980 A JP 2001518980A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- palladium
- silver
- hardness
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 本質的に下記の元素からなる電気用途のための銀/パラジウム合金: (a) 20〜50重量%の銀; (b) 20〜50重量%のパラジウム; (c) 20〜40重量%の銅; (d) 1.0重量%未満のニッケル; (e) 0.1〜5重量%の亜鉛; (f) 0.01〜0.3重量%のホウ素; (g) 1.0重量%以下のレニウム、ルテニウム、金、および白金からなる 群から選択される改質元素。 2. 28〜45重量%の銀、29〜40重量%のパラジウム、25〜30重量 %の銅、実質的に0〜0.2重量%のニッケル、0.15重量%のホウ素、および 1重量%の亜鉛を含有する、請求項1に記載の銀/パラジウム合金。 3. 本質的に下記の元素からなる銀/パラジウム合金から形成された鍛錬性金 属の電気部品: (a) 20〜50重量%の銀; (b) 20〜50重量%のパラジウム; (c) 20〜40重量%の銅; (d) 1.0重量%未満のニッケル; (e) 0.1〜5重量%の亜鉛; (f) 0.01〜0.3重量%のホウ素; (g) 1.0重量%以下のレニウム、ルテニウム、金、および白金からなる 群から選択される改質元素。 4. 前記部品は高い強度と硬度を示す、請求項3に記載の鍛錬性金属の電気部 品。 5. 前記部品は100グラムの荷重において少なくとも200ヌープの焼鈍後 硬度を示す、請求項4に記載の鍛錬性金属の電気部品。 6. 前記部品は、析出熱処理後に、100グラムの荷重において少なくとも3 00ヌープの硬度を示す、請求項4に記載の鍛錬性金属の電気部品。 7. 前記部品は100グラムの荷重において200〜400ヌープの冷間加工 後硬度を示す、請求項4に記載の鍛錬性金属の電気部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/835,665 US5833774A (en) | 1997-04-10 | 1997-04-10 | High strength silver palladium alloy |
US08/835,665 | 1997-04-10 | ||
PCT/US1998/006981 WO1998045489A1 (en) | 1997-04-10 | 1998-04-07 | High strength silver palladium alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001518980A true JP2001518980A (ja) | 2001-10-16 |
JP4226661B2 JP4226661B2 (ja) | 2009-02-18 |
Family
ID=25270136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54308598A Expired - Fee Related JP4226661B2 (ja) | 1997-04-10 | 1998-04-07 | 高強度の銀−パラジウム合金 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5833774A (ja) |
EP (1) | EP0975817A4 (ja) |
JP (1) | JP4226661B2 (ja) |
AU (1) | AU6892398A (ja) |
WO (1) | WO1998045489A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019130511A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社徳力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6210636B1 (en) * | 1999-04-30 | 2001-04-03 | The J. M. Ney Company | Cu-Ni-Zn-Pd alloys |
CA2322714A1 (en) * | 1999-10-25 | 2001-04-25 | Ainissa G. Ramirez | Article comprising improved noble metal-based alloys and method for making the same |
CA2561865A1 (en) | 2004-05-10 | 2005-12-01 | Deringer-Ney, Inc. | Palladium alloy |
DE602006016477D1 (de) * | 2005-12-13 | 2010-10-07 | Cook Inc | Implantierbare medizinische vorrichtung mit palladium |
US7959855B2 (en) * | 2006-10-19 | 2011-06-14 | Heru Budihartono | White precious metal alloy |
US8896075B2 (en) * | 2008-01-23 | 2014-11-25 | Ev Products, Inc. | Semiconductor radiation detector with thin film platinum alloyed electrode |
US20130292008A1 (en) * | 2010-12-09 | 2013-11-07 | Tokuriki Honten Co., Ltd. | Material for Electrical/Electronic Use |
JPWO2013099682A1 (ja) * | 2011-12-27 | 2015-05-07 | 株式会社徳力本店 | 電気・電子機器用のPd合金 |
US9804198B2 (en) | 2012-08-03 | 2017-10-31 | Yamamoto Precious Metal Co., Ltd. | Alloy material, contact probe, and connection terminal |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
US10385424B2 (en) | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
CH714594A1 (fr) * | 2018-01-26 | 2019-07-31 | Richemont Int Sa | Axe de pivotement d'un organe réglant de mouvement mécanique horloger. |
EP3800511B1 (fr) * | 2019-10-02 | 2022-05-18 | Nivarox-FAR S.A. | Axe de pivotement d'un organe réglant |
EP3960890A1 (de) | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
JP7072126B1 (ja) * | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
EP4234733A1 (de) | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-legeriung |
EP4325227A1 (de) | 2022-08-16 | 2024-02-21 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
CN117604361B (zh) * | 2023-11-23 | 2024-06-07 | 浙江金连接科技股份有限公司 | 一种芯片测试探针套筒用钯合金棒及其制造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1935897A (en) * | 1929-01-28 | 1933-11-21 | Int Nickel Co | Precious metal alloy |
US2138599A (en) * | 1937-07-14 | 1938-11-29 | Mallory & Co Inc P R | Contact element |
US2222544A (en) * | 1938-10-19 | 1940-11-19 | Chemical Marketing Company Inc | Formed piece of silver palladium alloys |
JPS59107047A (ja) * | 1982-12-09 | 1984-06-21 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
JPS59107048A (ja) * | 1982-12-09 | 1984-06-21 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
JPS59113144A (ja) * | 1982-12-20 | 1984-06-29 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
JPS59113151A (ja) * | 1982-12-20 | 1984-06-29 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
JPS59179740A (ja) * | 1983-03-31 | 1984-10-12 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
JPS59182932A (ja) * | 1983-03-31 | 1984-10-17 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
US5000779A (en) * | 1988-05-18 | 1991-03-19 | Leach & Garner | Palladium based powder-metal alloys and method for making same |
US4980245A (en) * | 1989-09-08 | 1990-12-25 | Precision Concepts, Inc. | Multi-element metallic composite article |
US5484569A (en) * | 1994-08-12 | 1996-01-16 | The J. M. Ney Company | Silver palladium alloy |
-
1997
- 1997-04-10 US US08/835,665 patent/US5833774A/en not_active Expired - Lifetime
-
1998
- 1998-04-07 EP EP98914606A patent/EP0975817A4/en not_active Withdrawn
- 1998-04-07 JP JP54308598A patent/JP4226661B2/ja not_active Expired - Fee Related
- 1998-04-07 WO PCT/US1998/006981 patent/WO1998045489A1/en not_active Application Discontinuation
- 1998-04-07 AU AU68923/98A patent/AU6892398A/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019130511A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社徳力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
JPWO2019130511A1 (ja) * | 2017-12-27 | 2020-12-24 | 株式会社徳力本店 | 析出硬化型Ag−Pd−Cu−In−B系合金 |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0975817A4 (en) | 2001-11-07 |
JP4226661B2 (ja) | 2009-02-18 |
EP0975817A1 (en) | 2000-02-02 |
AU6892398A (en) | 1998-10-30 |
WO1998045489A1 (en) | 1998-10-15 |
US5833774A (en) | 1998-11-10 |
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