JP2001345482A - 蛍光表示装置 - Google Patents

蛍光表示装置

Info

Publication number
JP2001345482A
JP2001345482A JP2000164691A JP2000164691A JP2001345482A JP 2001345482 A JP2001345482 A JP 2001345482A JP 2000164691 A JP2000164691 A JP 2000164691A JP 2000164691 A JP2000164691 A JP 2000164691A JP 2001345482 A JP2001345482 A JP 2001345482A
Authority
JP
Japan
Prior art keywords
light
phosphor
film
light emitting
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000164691A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001345482A5 (https=
Inventor
Chisato Furukawa
千里 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Development and Engineering Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP2000164691A priority Critical patent/JP2001345482A/ja
Publication of JP2001345482A publication Critical patent/JP2001345482A/ja
Publication of JP2001345482A5 publication Critical patent/JP2001345482A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2000164691A 2000-06-01 2000-06-01 蛍光表示装置 Pending JP2001345482A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000164691A JP2001345482A (ja) 2000-06-01 2000-06-01 蛍光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000164691A JP2001345482A (ja) 2000-06-01 2000-06-01 蛍光表示装置

Publications (2)

Publication Number Publication Date
JP2001345482A true JP2001345482A (ja) 2001-12-14
JP2001345482A5 JP2001345482A5 (https=) 2005-08-25

Family

ID=18668276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000164691A Pending JP2001345482A (ja) 2000-06-01 2000-06-01 蛍光表示装置

Country Status (1)

Country Link
JP (1) JP2001345482A (https=)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (ja) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd 両面発光ｌｅｄパッケージ
WO2003100873A1 (en) * 2002-05-28 2003-12-04 Matsushita Electric Works, Ltd. Light emitting element, light emitting device and surface emission illuminating device using it
WO2004001862A1 (ja) * 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
WO2004032251A1 (ja) * 2002-09-30 2004-04-15 Toyoda Gosei Co., Ltd. 白色発光装置
JP2004172578A (ja) * 2002-09-02 2004-06-17 Matsushita Electric Ind Co Ltd 発光装置
JP2004266134A (ja) * 2003-03-03 2004-09-24 Kanegafuchi Chem Ind Co Ltd ダイボンディング用樹脂ペースト及びそれを用いた発光ダイオード
JP2004292779A (ja) * 2002-04-26 2004-10-21 Kanegafuchi Chem Ind Co Ltd 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
WO2005053041A1 (ja) * 2003-11-25 2005-06-09 Matsushita Electric Works, Ltd. 発光ダイオードチップを用いた発光装置
JP2005166734A (ja) * 2003-11-28 2005-06-23 Matsushita Electric Works Ltd 発光装置
US7078737B2 (en) 2002-09-02 2006-07-18 Matsushita Electric Industrial Co., Ltd. Light-emitting device
JP2007067449A (ja) * 2002-06-19 2007-03-15 Sanken Electric Co Ltd 半導体発光装置
JP2007081430A (ja) * 2002-06-19 2007-03-29 Sanken Electric Co Ltd 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
JP2007227935A (ja) * 2006-02-24 2007-09-06 Osram Opto Semiconductors Gmbh 電子モジュールおよび電子モジュールをカプセル化する方法
US7345318B2 (en) 2004-07-05 2008-03-18 Citizen Electronics Co., Ltd. Light-emitting diode
CN100416874C (zh) * 2003-11-25 2008-09-03 松下电工株式会社 采用发光二极管芯片的发光器件
JP2008235945A (ja) * 2008-07-03 2008-10-02 Sharp Corp 発光素子
JP2008277438A (ja) * 2007-04-26 2008-11-13 Ricoh Microelectronics Co Ltd 電子部品、基板、並びに、電子部品及び基板の製造方法
JP2009530437A (ja) * 2006-03-15 2009-08-27 エルジー イノテック カンパニー リミテッド 蓄光シート
US7645062B2 (en) 2003-08-20 2010-01-12 Stanley Electric Co., Ltd. Light source and vehicle lamp
JP2010171465A (ja) * 2005-09-22 2010-08-05 Toshiba Lighting & Technology Corp 発光装置
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2011082568A (ja) 2002-06-13 2011-04-21 Cree Inc 飽和変換材料を有するエミッタパッケージ
JP2012062459A (ja) * 2010-08-18 2012-03-29 Covalent Materials Corp セラミックス複合体
KR101181112B1 (ko) * 2005-10-27 2012-09-14 엘지이노텍 주식회사 발광 다이오드, 발광 다이오드 제조 방법 및 발광 다이오드 모듈
CN104425689A (zh) * 2013-08-19 2015-03-18 人科机械有限公司 供膜及贴膜装置、具有该装置的半导体芯片封装件制造装置以及半导体芯片封装件制造方法
KR101511294B1 (ko) * 2013-08-12 2015-04-13 (주)피엔티 필름이 부착된 반도체 칩 패키지 제조 장치 및 제조 방법
JP2017147290A (ja) * 2016-02-16 2017-08-24 岩崎電気株式会社 Ｌｅｄユニット、及び照明装置

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (ja) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd 両面発光ｌｅｄパッケージ
JP2004292779A (ja) * 2002-04-26 2004-10-21 Kanegafuchi Chem Ind Co Ltd 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
WO2003100873A1 (en) * 2002-05-28 2003-12-04 Matsushita Electric Works, Ltd. Light emitting element, light emitting device and surface emission illuminating device using it
CN100552987C (zh) * 2002-05-28 2009-10-21 松下电工株式会社 发光器件、使用该器件的照明装置及表面发光照明装置
JP2011082568A (ja) 2002-06-13 2011-04-21 Cree Inc 飽和変換材料を有するエミッタパッケージ
JP2007067449A (ja) * 2002-06-19 2007-03-15 Sanken Electric Co Ltd 半導体発光装置
WO2004001862A1 (ja) * 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
US7429757B2 (en) 2002-06-19 2008-09-30 Sanken Electric Co., Ltd. Semiconductor light emitting device capable of increasing its brightness
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
JP2007081430A (ja) * 2002-06-19 2007-03-29 Sanken Electric Co Ltd 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
US7078737B2 (en) 2002-09-02 2006-07-18 Matsushita Electric Industrial Co., Ltd. Light-emitting device
JP2004172578A (ja) * 2002-09-02 2004-06-17 Matsushita Electric Ind Co Ltd 発光装置
US7227190B2 (en) 2002-09-30 2007-06-05 Toyoda Gosei Co., Ltd. White light emitting device
WO2004032251A1 (ja) * 2002-09-30 2004-04-15 Toyoda Gosei Co., Ltd. 白色発光装置
CN100428505C (zh) * 2002-09-30 2008-10-22 丰田合成株式会社 白色发光装置
JP2004266134A (ja) * 2003-03-03 2004-09-24 Kanegafuchi Chem Ind Co Ltd ダイボンディング用樹脂ペースト及びそれを用いた発光ダイオード
US7645062B2 (en) 2003-08-20 2010-01-12 Stanley Electric Co., Ltd. Light source and vehicle lamp
US8506147B2 (en) 2003-08-20 2013-08-13 Stanley Electric Co., Ltd. Light source and vehicle lamp
CN100416874C (zh) * 2003-11-25 2008-09-03 松下电工株式会社 采用发光二极管芯片的发光器件
WO2005053041A1 (ja) * 2003-11-25 2005-06-09 Matsushita Electric Works, Ltd. 発光ダイオードチップを用いた発光装置
US7717589B2 (en) 2003-11-25 2010-05-18 Panasonic Electric Works Co., Ltd. Light emitting device using light emitting diode chip
JP2005166734A (ja) * 2003-11-28 2005-06-23 Matsushita Electric Works Ltd 発光装置
US7345318B2 (en) 2004-07-05 2008-03-18 Citizen Electronics Co., Ltd. Light-emitting diode
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2010171465A (ja) * 2005-09-22 2010-08-05 Toshiba Lighting & Technology Corp 発光装置
KR101181112B1 (ko) * 2005-10-27 2012-09-14 엘지이노텍 주식회사 발광 다이오드, 발광 다이오드 제조 방법 및 발광 다이오드 모듈
US8343784B2 (en) 2005-10-27 2013-01-01 Lg Innotek Co., Ltd. Light emitting diode device, manufacturing method of the light emitting diode device and mounting structure of the light emitting diode device
JP2007227935A (ja) * 2006-02-24 2007-09-06 Osram Opto Semiconductors Gmbh 電子モジュールおよび電子モジュールをカプセル化する方法
JP2009530437A (ja) * 2006-03-15 2009-08-27 エルジー イノテック カンパニー リミテッド 蓄光シート
US8723411B2 (en) 2006-03-15 2014-05-13 Lg Innotek Co., Ltd. Photoluminescent sheet
JP2008277438A (ja) * 2007-04-26 2008-11-13 Ricoh Microelectronics Co Ltd 電子部品、基板、並びに、電子部品及び基板の製造方法
JP2008235945A (ja) * 2008-07-03 2008-10-02 Sharp Corp 発光素子
JP2012062459A (ja) * 2010-08-18 2012-03-29 Covalent Materials Corp セラミックス複合体
KR101511294B1 (ko) * 2013-08-12 2015-04-13 (주)피엔티 필름이 부착된 반도체 칩 패키지 제조 장치 및 제조 방법
CN104425689A (zh) * 2013-08-19 2015-03-18 人科机械有限公司 供膜及贴膜装置、具有该装置的半导体芯片封装件制造装置以及半导体芯片封装件制造方法
JP2017147290A (ja) * 2016-02-16 2017-08-24 岩崎電気株式会社 Ｌｅｄユニット、及び照明装置

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