JP2001345292A5 - - Google Patents

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Publication number
JP2001345292A5
JP2001345292A5 JP2000166682A JP2000166682A JP2001345292A5 JP 2001345292 A5 JP2001345292 A5 JP 2001345292A5 JP 2000166682 A JP2000166682 A JP 2000166682A JP 2000166682 A JP2000166682 A JP 2000166682A JP 2001345292 A5 JP2001345292 A5 JP 2001345292A5
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JP
Japan
Prior art keywords
polishing
layer
semiconductor wafer
turntable
barrier metal
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JP2000166682A
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English (en)
Japanese (ja)
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JP3916375B2 (ja
JP2001345292A (ja
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Priority to JP2000166682A priority Critical patent/JP3916375B2/ja
Priority claimed from JP2000166682A external-priority patent/JP3916375B2/ja
Priority to US09/870,479 priority patent/US6663469B2/en
Publication of JP2001345292A publication Critical patent/JP2001345292A/ja
Publication of JP2001345292A5 publication Critical patent/JP2001345292A5/ja
Application granted granted Critical
Publication of JP3916375B2 publication Critical patent/JP3916375B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000166682A 2000-06-02 2000-06-02 ポリッシング方法および装置 Expired - Lifetime JP3916375B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000166682A JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置
US09/870,479 US6663469B2 (en) 2000-06-02 2001-06-01 Polishing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000166682A JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置

Publications (3)

Publication Number Publication Date
JP2001345292A JP2001345292A (ja) 2001-12-14
JP2001345292A5 true JP2001345292A5 (https=) 2005-07-14
JP3916375B2 JP3916375B2 (ja) 2007-05-16

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JP2000166682A Expired - Lifetime JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置

Country Status (2)

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US (1) US6663469B2 (https=)
JP (1) JP3916375B2 (https=)

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