JP2001334219A - スピン処理装置及びスピン処理方法 - Google Patents

スピン処理装置及びスピン処理方法

Info

Publication number
JP2001334219A
JP2001334219A JP2000160232A JP2000160232A JP2001334219A JP 2001334219 A JP2001334219 A JP 2001334219A JP 2000160232 A JP2000160232 A JP 2000160232A JP 2000160232 A JP2000160232 A JP 2000160232A JP 2001334219 A JP2001334219 A JP 2001334219A
Authority
JP
Japan
Prior art keywords
substrate
cup
processing
nozzle
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000160232A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001334219A5 (https=
Inventor
Hideki Sueyoshi
秀樹 末吉
Yukinobu Nishibe
幸伸 西部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2000160232A priority Critical patent/JP2001334219A/ja
Publication of JP2001334219A publication Critical patent/JP2001334219A/ja
Publication of JP2001334219A5 publication Critical patent/JP2001334219A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000160232A 2000-05-30 2000-05-30 スピン処理装置及びスピン処理方法 Pending JP2001334219A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000160232A JP2001334219A (ja) 2000-05-30 2000-05-30 スピン処理装置及びスピン処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000160232A JP2001334219A (ja) 2000-05-30 2000-05-30 スピン処理装置及びスピン処理方法

Publications (2)

Publication Number Publication Date
JP2001334219A true JP2001334219A (ja) 2001-12-04
JP2001334219A5 JP2001334219A5 (https=) 2007-07-12

Family

ID=18664452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000160232A Pending JP2001334219A (ja) 2000-05-30 2000-05-30 スピン処理装置及びスピン処理方法

Country Status (1)

Country Link
JP (1) JP2001334219A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000641A (ja) * 2011-06-15 2013-01-07 Tokyo Ohka Kogyo Co Ltd 基板収容装置
WO2014050941A1 (ja) * 2012-09-27 2014-04-03 大日本スクリーン製造株式会社 処理液供給装置、基板処理装置、処理液供給方法、基板処理方法、処理液処理装置および処理液処理方法
JP2014082471A (ja) * 2012-09-27 2014-05-08 Dainippon Screen Mfg Co Ltd 処理液供給装置、基板処理装置、処理液供給方法および基板処理方法
CN104662644A (zh) * 2012-09-27 2015-05-27 斯克林集团公司 处理液供给装置及方法、处理液及基板处理装置及方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000641A (ja) * 2011-06-15 2013-01-07 Tokyo Ohka Kogyo Co Ltd 基板収容装置
WO2014050941A1 (ja) * 2012-09-27 2014-04-03 大日本スクリーン製造株式会社 処理液供給装置、基板処理装置、処理液供給方法、基板処理方法、処理液処理装置および処理液処理方法
JP2014082471A (ja) * 2012-09-27 2014-05-08 Dainippon Screen Mfg Co Ltd 処理液供給装置、基板処理装置、処理液供給方法および基板処理方法
CN104662644A (zh) * 2012-09-27 2015-05-27 斯克林集团公司 处理液供给装置及方法、处理液及基板处理装置及方法
US10133173B2 (en) 2012-09-27 2018-11-20 SCREEN Holdings Co., Ltd. Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing method
CN104662644B (zh) * 2012-09-27 2018-11-27 斯克林集团公司 处理液供给装置及方法、处理液及基板处理装置及方法
US10761422B2 (en) 2012-09-27 2020-09-01 SCREEN Holdings Co., Ltd. Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing method

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