JP2001319776A - Ｅｌパネルの作製方法 - Google Patents
Ｅｌパネルの作製方法Info
- Publication number
- JP2001319776A JP2001319776A JP2000140722A JP2000140722A JP2001319776A JP 2001319776 A JP2001319776 A JP 2001319776A JP 2000140722 A JP2000140722 A JP 2000140722A JP 2000140722 A JP2000140722 A JP 2000140722A JP 2001319776 A JP2001319776 A JP 2001319776A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- panel
- light
- cover material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 91
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000003566 sealing material Substances 0.000 claims abstract description 37
- 230000001678 irradiating effect Effects 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000006866 deterioration Effects 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 11
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 115
- 238000012546 transfer Methods 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 230000005525 hole transport Effects 0.000 description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000000609 carbazolyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- -1 polyparaphenylene vinylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000140722A JP2001319776A (ja) | 2000-05-12 | 2000-05-12 | Ｅｌパネルの作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000140722A JP2001319776A (ja) | 2000-05-12 | 2000-05-12 | Ｅｌパネルの作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001319776A true JP2001319776A (ja) | 2001-11-16 |
| JP2001319776A5 JP2001319776A5 (enExample) | 2007-06-14 |
Family
ID=18647967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000140722A Withdrawn JP2001319776A (ja) | 2000-05-12 | 2000-05-12 | Ｅｌパネルの作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001319776A (enExample) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003217844A (ja) * | 2002-01-24 | 2003-07-31 | Seiko Epson Corp | 発光装置の製造装置、発光装置の製造方法、電子装置の製造装置、電気光学装置、並びに電子機器 |
| WO2004068910A1 (ja) * | 2003-01-24 | 2004-08-12 | Semiconductor Energy Laboratory Co. Ltd. | 発光装置及びその製造方法、並びに前記発光装置を用いた電気機器 |
| JP2006165497A (ja) * | 2004-12-07 | 2006-06-22 | Lg Electron Inc | ガラスキャップ接着方法及び封止剤硬化用マスク |
| KR100595309B1 (ko) * | 2002-02-22 | 2006-07-03 | 엘지.필립스 엘시디 주식회사 | 마스크 고정장치 및 그를 이용한 ｕｖ조사장치 |
| KR100682762B1 (ko) | 2004-12-15 | 2007-02-15 | 엘지전자 주식회사 | 실란트 경화용 마스크 |
| KR100705315B1 (ko) * | 2004-03-22 | 2007-04-10 | 엘지전자 주식회사 | 마스크장치와 이를 이용한 유기전계발광소자의 제조방법및 제조장치 |
| KR100717325B1 (ko) * | 2005-04-28 | 2007-05-15 | 엘지전자 주식회사 | 평판 표시소자의 제조장치 |
| KR100727613B1 (ko) | 2006-06-29 | 2007-06-14 | 주식회사 대우일렉트로닉스 | 유기 발광 소자 패널 |
| JP2008084599A (ja) * | 2006-09-26 | 2008-04-10 | Fujifilm Corp | 有機ｅｌ発光装置、及び有機ｅｌ発光装置の製造方法 |
| US7453426B2 (en) | 2004-01-14 | 2008-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic apparatus |
| US7566902B2 (en) | 2003-05-16 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electronic device |
| JP2010272542A (ja) * | 2006-12-13 | 2010-12-02 | Samsung Mobile Display Co Ltd | 有機電界発光表示装置 |
| US20110159773A1 (en) * | 2009-12-28 | 2011-06-30 | Samsung Mobile Display Co., Ltd. | Method of encapsulating organic light emitting display device |
| US8536567B2 (en) | 2006-11-10 | 2013-09-17 | Samsung Display Co., Ltd. | Organic light emitting display and fabrication method thereof |
| KR101331878B1 (ko) | 2013-04-05 | 2013-11-21 | 유진디스컴 주식회사 | 터치 디스플레이 패널 합착용 접착재 경화 장치 |
| US8598780B2 (en) | 2006-11-10 | 2013-12-03 | Samsung Display Co., Ltd. | Organic light emitting display and fabrication method thereof |
| US8670092B2 (en) | 2011-06-13 | 2014-03-11 | Au Optronics Corp. | Display device and method for manufacturing the same |
| CN105098092A (zh) * | 2015-06-17 | 2015-11-25 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
| US9236418B2 (en) | 2002-01-24 | 2016-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310273A (ja) * | 1993-04-21 | 1994-11-04 | Seikosha Co Ltd | Ｅｌ素子の製造方法 |
| JPH10275682A (ja) * | 1997-02-03 | 1998-10-13 | Nec Corp | 有機ｅｌ素子 |
| JPH11185956A (ja) * | 1997-12-18 | 1999-07-09 | Tdk Corp | 有機ｅｌ素子の製造方法および有機ｅｌ素子 |
| JP2000150145A (ja) * | 1998-11-02 | 2000-05-30 | Toyota Motor Corp | Ｅｌ素子の密封方法 |
| JP2000164354A (ja) * | 1998-11-25 | 2000-06-16 | Toyota Motor Corp | Ｅｌ素子の密封方法及びｅｌ素子密封装置 |
| JP2000194290A (ja) * | 1998-12-28 | 2000-07-14 | Toyota Motor Corp | 表示パネル及びその製造方法 |
| JP2001155855A (ja) * | 1999-11-24 | 2001-06-08 | Toyota Motor Corp | 有機ｅｌ素子の封止方法 |
| JP2001185349A (ja) * | 1999-12-28 | 2001-07-06 | Nec Corp | 有機ｅｌ表示パネル及びその製造方法 |
-
2000
- 2000-05-12 JP JP2000140722A patent/JP2001319776A/ja not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310273A (ja) * | 1993-04-21 | 1994-11-04 | Seikosha Co Ltd | Ｅｌ素子の製造方法 |
| JPH10275682A (ja) * | 1997-02-03 | 1998-10-13 | Nec Corp | 有機ｅｌ素子 |
| JPH11185956A (ja) * | 1997-12-18 | 1999-07-09 | Tdk Corp | 有機ｅｌ素子の製造方法および有機ｅｌ素子 |
| JP2000150145A (ja) * | 1998-11-02 | 2000-05-30 | Toyota Motor Corp | Ｅｌ素子の密封方法 |
| JP2000164354A (ja) * | 1998-11-25 | 2000-06-16 | Toyota Motor Corp | Ｅｌ素子の密封方法及びｅｌ素子密封装置 |
| JP2000194290A (ja) * | 1998-12-28 | 2000-07-14 | Toyota Motor Corp | 表示パネル及びその製造方法 |
| JP2001155855A (ja) * | 1999-11-24 | 2001-06-08 | Toyota Motor Corp | 有機ｅｌ素子の封止方法 |
| JP2001185349A (ja) * | 1999-12-28 | 2001-07-06 | Nec Corp | 有機ｅｌ表示パネル及びその製造方法 |
Cited By (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9653519B2 (en) | 2002-01-24 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device, method of preparing the same and device for fabricating the same |
| US9236418B2 (en) | 2002-01-24 | 2016-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP2003217844A (ja) * | 2002-01-24 | 2003-07-31 | Seiko Epson Corp | 発光装置の製造装置、発光装置の製造方法、電子装置の製造装置、電気光学装置、並びに電子機器 |
| KR100595309B1 (ko) * | 2002-02-22 | 2006-07-03 | 엘지.필립스 엘시디 주식회사 | 마스크 고정장치 및 그를 이용한 ｕｖ조사장치 |
| US8860011B2 (en) | 2003-01-24 | 2014-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and electronic book including double-sided light emitting display panel |
| US8084081B2 (en) | 2003-01-24 | 2011-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Lighting emitting device, manufacturing method of the same, electronic apparatus having the same |
| US7199520B2 (en) | 2003-01-24 | 2007-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Lighting emitting device and electronic apparatus having the same |
| WO2004068910A1 (ja) * | 2003-01-24 | 2004-08-12 | Semiconductor Energy Laboratory Co. Ltd. | 発光装置及びその製造方法、並びに前記発光装置を用いた電気機器 |
| US9324773B2 (en) | 2003-01-24 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Display panel including a plurality of lighting emitting elements |
| JPWO2004068910A1 (ja) * | 2003-01-24 | 2006-05-25 | 株式会社半導体エネルギー研究所 | 発光装置及びその製造方法、並びに前記発光装置を用いた電気機器 |
| US7566902B2 (en) | 2003-05-16 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electronic device |
| US7453426B2 (en) | 2004-01-14 | 2008-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic apparatus |
| US8907868B2 (en) | 2004-01-14 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic apparatus |
| KR100705315B1 (ko) * | 2004-03-22 | 2007-04-10 | 엘지전자 주식회사 | 마스크장치와 이를 이용한 유기전계발광소자의 제조방법및 제조장치 |
| US8303756B2 (en) | 2004-12-07 | 2012-11-06 | Lg Display Co., Ltd. | Method for bonding a glass cap and mask for curing sealant |
| JP2006165497A (ja) * | 2004-12-07 | 2006-06-22 | Lg Electron Inc | ガラスキャップ接着方法及び封止剤硬化用マスク |
| KR100682762B1 (ko) | 2004-12-15 | 2007-02-15 | 엘지전자 주식회사 | 실란트 경화용 마스크 |
| KR100717325B1 (ko) * | 2005-04-28 | 2007-05-15 | 엘지전자 주식회사 | 평판 표시소자의 제조장치 |
| KR100727613B1 (ko) | 2006-06-29 | 2007-06-14 | 주식회사 대우일렉트로닉스 | 유기 발광 소자 패널 |
| JP2008084599A (ja) * | 2006-09-26 | 2008-04-10 | Fujifilm Corp | 有機ｅｌ発光装置、及び有機ｅｌ発光装置の製造方法 |
| US8030845B2 (en) * | 2006-09-26 | 2011-10-04 | Fujifilm Corporation | Organic electroluminescence device and method for manufacturing the same |
| US8536567B2 (en) | 2006-11-10 | 2013-09-17 | Samsung Display Co., Ltd. | Organic light emitting display and fabrication method thereof |
| US8598780B2 (en) | 2006-11-10 | 2013-12-03 | Samsung Display Co., Ltd. | Organic light emitting display and fabrication method thereof |
| JP2010272542A (ja) * | 2006-12-13 | 2010-12-02 | Samsung Mobile Display Co Ltd | 有機電界発光表示装置 |
| US8916852B2 (en) | 2006-12-13 | 2014-12-23 | Samsung Display Co., Ltd. | Organic light emitting display having a substrate support structure and fabricating method thereof |
| US20110159773A1 (en) * | 2009-12-28 | 2011-06-30 | Samsung Mobile Display Co., Ltd. | Method of encapsulating organic light emitting display device |
| US8439719B2 (en) * | 2009-12-28 | 2013-05-14 | Samsung Display Co., Ltd. | Method of encapsulating organic light emitting display device |
| US8797494B2 (en) | 2011-06-13 | 2014-08-05 | Au Optronics Corp. | Display device and method for manufacturing the same |
| US8670092B2 (en) | 2011-06-13 | 2014-03-11 | Au Optronics Corp. | Display device and method for manufacturing the same |
| KR101331878B1 (ko) | 2013-04-05 | 2013-11-21 | 유진디스컴 주식회사 | 터치 디스플레이 패널 합착용 접착재 경화 장치 |
| CN105098092A (zh) * | 2015-06-17 | 2015-11-25 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
| US10008696B2 (en) | 2015-06-17 | 2018-06-26 | Boe Technology Group Co., Ltd. | Packaging method, display panel and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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