JP2001296326A - 欠陥検査方法及び装置 - Google Patents
欠陥検査方法及び装置Info
- Publication number
- JP2001296326A JP2001296326A JP2000116180A JP2000116180A JP2001296326A JP 2001296326 A JP2001296326 A JP 2001296326A JP 2000116180 A JP2000116180 A JP 2000116180A JP 2000116180 A JP2000116180 A JP 2000116180A JP 2001296326 A JP2001296326 A JP 2001296326A
- Authority
- JP
- Japan
- Prior art keywords
- detection electrode
- conductive pattern
- pattern
- defect inspection
- potential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 50
- 230000007547 defect Effects 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims description 90
- 230000001360 synchronised effect Effects 0.000 claims description 13
- 238000005070 sampling Methods 0.000 claims description 4
- 230000005284 excitation Effects 0.000 claims description 2
- 230000005684 electric field Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000007667 floating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005339 levitation Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000116180A JP2001296326A (ja) | 2000-04-18 | 2000-04-18 | 欠陥検査方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000116180A JP2001296326A (ja) | 2000-04-18 | 2000-04-18 | 欠陥検査方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001296326A true JP2001296326A (ja) | 2001-10-26 |
| JP2001296326A5 JP2001296326A5 (enExample) | 2007-06-07 |
Family
ID=18627674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000116180A Pending JP2001296326A (ja) | 2000-04-18 | 2000-04-18 | 欠陥検査方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001296326A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002101398A1 (fr) * | 2001-05-24 | 2002-12-19 | Oht Inc. | Appareil d'inspection de schema de circuit, procede d'inspection de schema de circuit et support d'enregistrement |
| WO2004057350A1 (ja) * | 2002-11-30 | 2004-07-08 | Oht Inc. | 回路パターン検査装置及びパターン検査方法 |
| JP2005030850A (ja) * | 2003-07-10 | 2005-02-03 | Chi Mei Electronics Corp | 電気的接続部の非接触検査方法及び非接触検査装置 |
| JP2006337073A (ja) * | 2005-05-31 | 2006-12-14 | Advantest Corp | 試験装置、及びデバイス製造方法 |
| JP2007298277A (ja) * | 2006-04-27 | 2007-11-15 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
| CN103487960A (zh) * | 2013-10-21 | 2014-01-01 | 京东方科技集团股份有限公司 | 光栅基板短路检测方法 |
| JP2015043369A (ja) * | 2013-08-26 | 2015-03-05 | 大日本印刷株式会社 | 膜検査方法、インプリント方法、パターン構造体の製造方法、インプリント用のモールド、インプリント用の転写基板、および、インプリント装置 |
| KR102132860B1 (ko) * | 2020-03-17 | 2020-07-10 | 주식회사 나노시스 | 기판 검사 시스템 |
-
2000
- 2000-04-18 JP JP2000116180A patent/JP2001296326A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002101398A1 (fr) * | 2001-05-24 | 2002-12-19 | Oht Inc. | Appareil d'inspection de schema de circuit, procede d'inspection de schema de circuit et support d'enregistrement |
| US6995566B2 (en) | 2001-05-24 | 2006-02-07 | Oht, Inc. | Circuit pattern inspection apparatus, circuit pattern inspection method, and recording medium |
| WO2004057350A1 (ja) * | 2002-11-30 | 2004-07-08 | Oht Inc. | 回路パターン検査装置及びパターン検査方法 |
| US7088107B2 (en) | 2002-11-30 | 2006-08-08 | Oht Inc. | Circuit pattern inspection instrument and pattern inspection method |
| JP2005030850A (ja) * | 2003-07-10 | 2005-02-03 | Chi Mei Electronics Corp | 電気的接続部の非接触検査方法及び非接触検査装置 |
| JP2006337073A (ja) * | 2005-05-31 | 2006-12-14 | Advantest Corp | 試験装置、及びデバイス製造方法 |
| JP2007298277A (ja) * | 2006-04-27 | 2007-11-15 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
| JP2015043369A (ja) * | 2013-08-26 | 2015-03-05 | 大日本印刷株式会社 | 膜検査方法、インプリント方法、パターン構造体の製造方法、インプリント用のモールド、インプリント用の転写基板、および、インプリント装置 |
| CN103487960A (zh) * | 2013-10-21 | 2014-01-01 | 京东方科技集团股份有限公司 | 光栅基板短路检测方法 |
| WO2015058528A1 (zh) * | 2013-10-21 | 2015-04-30 | 京东方科技集团股份有限公司 | 光栅基板短路检测方法 |
| KR102132860B1 (ko) * | 2020-03-17 | 2020-07-10 | 주식회사 나노시스 | 기판 검사 시스템 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070416 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070416 |
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| A977 | Report on retrieval |
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Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090609 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091020 |