JP2001269966A5 - - Google Patents

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Publication number
JP2001269966A5
JP2001269966A5 JP2000083496A JP2000083496A JP2001269966A5 JP 2001269966 A5 JP2001269966 A5 JP 2001269966A5 JP 2000083496 A JP2000083496 A JP 2000083496A JP 2000083496 A JP2000083496 A JP 2000083496A JP 2001269966 A5 JP2001269966 A5 JP 2001269966A5
Authority
JP
Japan
Prior art keywords
mold
disc
pair
heat
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000083496A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001269966A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000083496A priority Critical patent/JP2001269966A/ja
Priority claimed from JP2000083496A external-priority patent/JP2001269966A/ja
Priority to US09/810,228 priority patent/US6881051B2/en
Priority to EP01302561A priority patent/EP1136223A3/en
Publication of JP2001269966A publication Critical patent/JP2001269966A/ja
Publication of JP2001269966A5 publication Critical patent/JP2001269966A5/ja
Pending legal-status Critical Current

Links

JP2000083496A 2000-03-24 2000-03-24 ディスク基板の射出成形用金型 Pending JP2001269966A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000083496A JP2001269966A (ja) 2000-03-24 2000-03-24 ディスク基板の射出成形用金型
US09/810,228 US6881051B2 (en) 2000-03-24 2001-03-19 Mold for injection molding of disc substrate
EP01302561A EP1136223A3 (en) 2000-03-24 2001-03-20 Mold for injection molding of disc substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000083496A JP2001269966A (ja) 2000-03-24 2000-03-24 ディスク基板の射出成形用金型

Publications (2)

Publication Number Publication Date
JP2001269966A JP2001269966A (ja) 2001-10-02
JP2001269966A5 true JP2001269966A5 (enExample) 2005-06-09

Family

ID=18600121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000083496A Pending JP2001269966A (ja) 2000-03-24 2000-03-24 ディスク基板の射出成形用金型

Country Status (3)

Country Link
US (1) US6881051B2 (enExample)
EP (1) EP1136223A3 (enExample)
JP (1) JP2001269966A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002240101A (ja) * 2000-12-15 2002-08-28 Sony Corp ディスク基板及びそれを射出成形する金型装置とディスク基板取出し用ロボット
SE523999C2 (sv) * 2001-10-10 2004-06-15 Nolato Ab System för formtemperering av formsprutningsverktyg, innefattande formsprutningsaggretat och formsprutningsverktyg
EP1508423A3 (en) * 2003-07-24 2005-04-27 Fuji Photo Film Co., Ltd. Process for producing an optical disc substrate
JP4318992B2 (ja) * 2003-09-02 2009-08-26 株式会社名機製作所 ディスク基板成形用金型
TWI310942B (en) * 2005-12-19 2009-06-11 Daxon Technology Inc Disc injection mold and related cooling system capable of reducing tracking errors
KR101273591B1 (ko) 2007-01-22 2013-06-11 삼성전자주식회사 사출성형장치
EP2527125B1 (en) * 2011-05-25 2018-05-09 LG Electronics Inc. Mold apparatus
DE102012008939A1 (de) * 2012-05-08 2013-11-14 Zahoransky Formenbau Gmbh Spritzgießmaschine

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666396A (en) * 1982-11-22 1987-05-19 Shaw Richard J Thermally insulated heated sprue bushing in plastic molding apparatus
US4622001A (en) * 1985-03-12 1986-11-11 Electra Form, Inc. Cavity cooling system
CA1327110C (en) * 1988-04-28 1994-02-22 Tatsuzi Nakagawa Mold assembly, and methods of mounting and removing insert thereof, and ejecting the insert
US5683630A (en) * 1994-06-20 1997-11-04 Matsushita Electric Industrial Co., Ltd. Process for making optical disk substrates
JP3140309B2 (ja) * 1994-09-26 2001-03-05 株式会社名機製作所 ディスク成形金型装置
JP3240877B2 (ja) * 1995-04-17 2001-12-25 三菱マテリアル株式会社 射出圧縮成形装置
WO2000046008A1 (de) 1999-02-04 2000-08-10 Stern Christian R Verfahren zur wärmeleitung in einer düse

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