JP2001234395A5 - - Google Patents

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Publication number
JP2001234395A5
JP2001234395A5 JP2000050949A JP2000050949A JP2001234395A5 JP 2001234395 A5 JP2001234395 A5 JP 2001234395A5 JP 2000050949 A JP2000050949 A JP 2000050949A JP 2000050949 A JP2000050949 A JP 2000050949A JP 2001234395 A5 JP2001234395 A5 JP 2001234395A5
Authority
JP
Japan
Prior art keywords
wafer
plating
target surface
support
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000050949A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001234395A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000050949A priority Critical patent/JP2001234395A/ja
Priority claimed from JP2000050949A external-priority patent/JP2001234395A/ja
Priority to US09/791,840 priority patent/US6736945B2/en
Publication of JP2001234395A publication Critical patent/JP2001234395A/ja
Publication of JP2001234395A5 publication Critical patent/JP2001234395A5/ja
Pending legal-status Critical Current

Links

JP2000050949A 2000-02-28 2000-02-28 ウェハーめっき装置 Pending JP2001234395A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000050949A JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置
US09/791,840 US6736945B2 (en) 2000-02-28 2001-02-26 Wafer plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000050949A JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Publications (2)

Publication Number Publication Date
JP2001234395A JP2001234395A (ja) 2001-08-31
JP2001234395A5 true JP2001234395A5 (enExample) 2007-04-19

Family

ID=18572670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000050949A Pending JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Country Status (2)

Country Link
US (1) US6736945B2 (enExample)
JP (1) JP2001234395A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6695962B2 (en) 2001-05-01 2004-02-24 Nutool Inc. Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
US6478936B1 (en) 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US7195696B2 (en) * 2000-05-11 2007-03-27 Novellus Systems, Inc. Electrode assembly for electrochemical processing of workpiece
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
JP2006193822A (ja) * 2004-12-16 2006-07-27 Sharp Corp めっき装置、めっき方法、半導体装置、及び半導体装置の製造方法
TWI414640B (zh) * 2010-09-06 2013-11-11 Grand Plastic Technology Co Ltd 垂直懸臂式電鍍夾具
US8968533B2 (en) 2012-05-10 2015-03-03 Applied Materials, Inc Electroplating processor with geometric electrolyte flow path
JP6404745B2 (ja) * 2015-02-25 2018-10-17 住友精密工業株式会社 液状物充填装置
KR102092089B1 (ko) * 2020-01-30 2020-03-23 이성한 회전 타입 기판용 도금장치 및 이를 이용하는 기판 도금방법
CN112877741B (zh) * 2021-01-13 2022-05-03 硅密芯镀(海宁)半导体技术有限公司 气泡去除方法
KR102401521B1 (ko) * 2021-02-25 2022-05-24 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 장치의 기포 제거 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964841A (en) * 1974-09-18 1976-06-22 Sigma Lutin, Narodni Podnik Impeller blades
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
JPH05243235A (ja) 1992-03-02 1993-09-21 Fujitsu Ltd 半導体装置の製造装置
JP3377849B2 (ja) * 1994-02-02 2003-02-17 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用メッキ装置
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6709563B2 (en) * 2000-06-30 2004-03-23 Ebara Corporation Copper-plating liquid, plating method and plating apparatus

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