JP2001234395A - ウェハーめっき装置 - Google Patents

ウェハーめっき装置

Info

Publication number
JP2001234395A
JP2001234395A JP2000050949A JP2000050949A JP2001234395A JP 2001234395 A JP2001234395 A JP 2001234395A JP 2000050949 A JP2000050949 A JP 2000050949A JP 2000050949 A JP2000050949 A JP 2000050949A JP 2001234395 A JP2001234395 A JP 2001234395A
Authority
JP
Japan
Prior art keywords
wafer
plating
support
periphery
target surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000050949A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001234395A5 (enExample
Inventor
Yoshiyuki Harima
喜之 播磨
Hirobumi Ishida
博文 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd, Tokyo Electron Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP2000050949A priority Critical patent/JP2001234395A/ja
Priority to US09/791,840 priority patent/US6736945B2/en
Publication of JP2001234395A publication Critical patent/JP2001234395A/ja
Publication of JP2001234395A5 publication Critical patent/JP2001234395A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000050949A 2000-02-28 2000-02-28 ウェハーめっき装置 Pending JP2001234395A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000050949A JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置
US09/791,840 US6736945B2 (en) 2000-02-28 2001-02-26 Wafer plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000050949A JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Publications (2)

Publication Number Publication Date
JP2001234395A true JP2001234395A (ja) 2001-08-31
JP2001234395A5 JP2001234395A5 (enExample) 2007-04-19

Family

ID=18572670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000050949A Pending JP2001234395A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Country Status (2)

Country Link
US (1) US6736945B2 (enExample)
JP (1) JP2001234395A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157862A (ja) * 2015-02-25 2016-09-01 住友精密工業株式会社 液状物充填装置
KR102092089B1 (ko) * 2020-01-30 2020-03-23 이성한 회전 타입 기판용 도금장치 및 이를 이용하는 기판 도금방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6695962B2 (en) 2001-05-01 2004-02-24 Nutool Inc. Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
US7195696B2 (en) * 2000-05-11 2007-03-27 Novellus Systems, Inc. Electrode assembly for electrochemical processing of workpiece
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
JP2006193822A (ja) * 2004-12-16 2006-07-27 Sharp Corp めっき装置、めっき方法、半導体装置、及び半導体装置の製造方法
TWI414640B (zh) * 2010-09-06 2013-11-11 Grand Plastic Technology Co Ltd 垂直懸臂式電鍍夾具
US8968533B2 (en) 2012-05-10 2015-03-03 Applied Materials, Inc Electroplating processor with geometric electrolyte flow path
CN112877741B (zh) * 2021-01-13 2022-05-03 硅密芯镀(海宁)半导体技术有限公司 气泡去除方法
KR102401521B1 (ko) * 2021-02-25 2022-05-24 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 장치의 기포 제거 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964841A (en) * 1974-09-18 1976-06-22 Sigma Lutin, Narodni Podnik Impeller blades
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
JPH05243235A (ja) 1992-03-02 1993-09-21 Fujitsu Ltd 半導体装置の製造装置
JP3377849B2 (ja) * 1994-02-02 2003-02-17 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用メッキ装置
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
KR100800531B1 (ko) * 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157862A (ja) * 2015-02-25 2016-09-01 住友精密工業株式会社 液状物充填装置
KR102092089B1 (ko) * 2020-01-30 2020-03-23 이성한 회전 타입 기판용 도금장치 및 이를 이용하는 기판 도금방법

Also Published As

Publication number Publication date
US20010017258A1 (en) 2001-08-30
US6736945B2 (en) 2004-05-18

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