JP2009147171A5 - - Google Patents

Download PDF

Info

Publication number
JP2009147171A5
JP2009147171A5 JP2007323872A JP2007323872A JP2009147171A5 JP 2009147171 A5 JP2009147171 A5 JP 2009147171A5 JP 2007323872 A JP2007323872 A JP 2007323872A JP 2007323872 A JP2007323872 A JP 2007323872A JP 2009147171 A5 JP2009147171 A5 JP 2009147171A5
Authority
JP
Japan
Prior art keywords
plasma processing
stage
processing apparatus
mask
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2007323872A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147171A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007323872A priority Critical patent/JP2009147171A/ja
Priority claimed from JP2007323872A external-priority patent/JP2009147171A/ja
Priority to CN2008101727183A priority patent/CN101459054B/zh
Priority to US12/331,596 priority patent/US20090151638A1/en
Priority to TW097148521A priority patent/TW200931573A/zh
Priority to KR1020080126788A priority patent/KR101048192B1/ko
Publication of JP2009147171A publication Critical patent/JP2009147171A/ja
Publication of JP2009147171A5 publication Critical patent/JP2009147171A5/ja
Ceased legal-status Critical Current

Links

JP2007323872A 2007-12-14 2007-12-14 プラズマ処理装置 Ceased JP2009147171A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007323872A JP2009147171A (ja) 2007-12-14 2007-12-14 プラズマ処理装置
CN2008101727183A CN101459054B (zh) 2007-12-14 2008-11-11 等离子体处理装置
US12/331,596 US20090151638A1 (en) 2007-12-14 2008-12-10 Plasma processing apparatus
TW097148521A TW200931573A (en) 2007-12-14 2008-12-12 Plasma processing apparatus
KR1020080126788A KR101048192B1 (ko) 2007-12-14 2008-12-12 플라즈마 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007323872A JP2009147171A (ja) 2007-12-14 2007-12-14 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2009147171A JP2009147171A (ja) 2009-07-02
JP2009147171A5 true JP2009147171A5 (enExample) 2010-12-09

Family

ID=40751566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007323872A Ceased JP2009147171A (ja) 2007-12-14 2007-12-14 プラズマ処理装置

Country Status (5)

Country Link
US (1) US20090151638A1 (enExample)
JP (1) JP2009147171A (enExample)
KR (1) KR101048192B1 (enExample)
CN (1) CN101459054B (enExample)
TW (1) TW200931573A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885939B2 (ja) * 2010-07-20 2016-03-16 東京エレクトロン株式会社 シールド部材及びシールド部材を備えた基板載置台
TWI449080B (zh) * 2012-07-25 2014-08-11 Au Optronics Corp 電漿反應機台
CN103132016B (zh) * 2013-02-22 2015-05-13 京东方科技集团股份有限公司 一种膜边调整器
CN103730318B (zh) * 2013-11-15 2016-04-06 中微半导体设备(上海)有限公司 一种晶圆边缘保护环及减少晶圆边缘颗粒的方法
CN104073776A (zh) * 2014-07-04 2014-10-01 深圳市华星光电技术有限公司 一种化学气相沉积设备
JP5941971B2 (ja) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 リング状シールド部材及びリング状シールド部材を備えた基板載置台
JP6054470B2 (ja) * 2015-05-26 2016-12-27 株式会社日本製鋼所 原子層成長装置
JP6689965B2 (ja) * 2016-04-28 2020-04-28 株式会社アルバック 成膜用マスク及び成膜装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5803977A (en) * 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
US5352294A (en) * 1993-01-28 1994-10-04 White John M Alignment of a shadow frame and large flat substrates on a support
US6033480A (en) * 1994-02-23 2000-03-07 Applied Materials, Inc. Wafer edge deposition elimination
US5632873A (en) * 1995-05-22 1997-05-27 Stevens; Joseph J. Two piece anti-stick clamp ring
KR100434790B1 (ko) * 1997-05-20 2004-06-07 동경 엘렉트론 주식회사 처리 장치
US6186092B1 (en) * 1997-08-19 2001-02-13 Applied Materials, Inc. Apparatus and method for aligning and controlling edge deposition on a substrate
US6589352B1 (en) * 1999-12-10 2003-07-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US20050196971A1 (en) * 2004-03-05 2005-09-08 Applied Materials, Inc. Hardware development to reduce bevel deposition

Similar Documents

Publication Publication Date Title
JP2009147171A5 (enExample)
JP2012129566A5 (ja) 露光装置、及びデバイス製造方法
KR101978166B1 (ko) 보호필름 부착장치
JP5695520B2 (ja) ウエハリングのアライメント方法
JP2012195444A5 (enExample)
SG157327A1 (en) Substrate table, lithographic apparatus and device manufacturing method
TW200625504A (en) Substrate holder, stage device and exposure device
TW200717695A (en) Substrate loading mechanism and substrate processing apparatus
TW200943468A (en) Plasma processing device
JP2012069635A5 (enExample)
CN105027697B (zh) 支撑销及支撑销自动更换系统
JP2014203860A5 (ja) ホルダ、ステージ装置、リソグラフィ装置及び物品の製造方法
JP2012506789A5 (enExample)
TW200723431A (en) Substrate processing apparatus
JP6185268B2 (ja) 基板収納容器
CN103517629B (zh) 吸嘴储存器以及电子部件搭载装置
JP2010073753A5 (enExample)
JP2001234395A5 (enExample)
US20130277902A1 (en) Worktable Assembly With A Magnetic Workpiece Support
TW200725121A (en) Apparatus for rubbing alignment layer
JP2003071585A5 (enExample)
JP2006216583A5 (enExample)
CN204039452U (zh) 环形件的淬火装置
KR101963400B1 (ko) 기판 처리장치
JP6747960B6 (ja) プラズマ処理装置