JP2001201844A5 - - Google Patents
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- Publication number
- JP2001201844A5 JP2001201844A5 JP2000013168A JP2000013168A JP2001201844A5 JP 2001201844 A5 JP2001201844 A5 JP 2001201844A5 JP 2000013168 A JP2000013168 A JP 2000013168A JP 2000013168 A JP2000013168 A JP 2000013168A JP 2001201844 A5 JP2001201844 A5 JP 2001201844A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- integrated circuit
- manufacturing
- position measurement
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims 33
- 230000007261 regionalization Effects 0.000 claims 12
- 229920002120 photoresistant polymer Polymers 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 8
- 230000010363 phase shift Effects 0.000 claims 6
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000005286 illumination Methods 0.000 claims 2
- 238000007687 exposure technique Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013168A JP2001201844A (ja) | 2000-01-21 | 2000-01-21 | 半導体集積回路装置の製造方法およびフォトマスクの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013168A JP2001201844A (ja) | 2000-01-21 | 2000-01-21 | 半導体集積回路装置の製造方法およびフォトマスクの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001201844A JP2001201844A (ja) | 2001-07-27 |
| JP2001201844A5 true JP2001201844A5 (enExample) | 2005-02-03 |
Family
ID=18540794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000013168A Pending JP2001201844A (ja) | 2000-01-21 | 2000-01-21 | 半導体集積回路装置の製造方法およびフォトマスクの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001201844A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5306391B2 (ja) | 2011-03-02 | 2013-10-02 | 株式会社東芝 | フォトマスク |
| JP6362716B2 (ja) * | 2017-02-03 | 2018-07-25 | ルネサスエレクトロニクス株式会社 | マスクおよび半導体装置 |
| DE102017219217B4 (de) * | 2017-10-26 | 2021-03-25 | Carl Zeiss Smt Gmbh | Masken für die Mikrolithographie, Verfahren zur Bestimmung von Kantenpositionen der Bilder der Strukturen einer derartigen Maske und System zur Durchführung eines derartigen Verfahrens |
| JP2023115863A (ja) * | 2022-02-08 | 2023-08-21 | 株式会社エスケーエレクトロニクス | Ｆｐｄ用のフォトマスク、ｆｐｄ用のフォトマスクにおける位置計測用マークの形成方法及びｆｐｄ用のフォトマスクの製造方法 |
| US12117735B2 (en) * | 2022-02-16 | 2024-10-15 | Nanya Technology Corporation | Method of determining overlay error during semiconductor fabrication |
-
2000
- 2000-01-21 JP JP2000013168A patent/JP2001201844A/ja active Pending
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