JP2001110719A5 - - Google Patents

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Publication number
JP2001110719A5
JP2001110719A5 JP1999292782A JP29278299A JP2001110719A5 JP 2001110719 A5 JP2001110719 A5 JP 2001110719A5 JP 1999292782 A JP1999292782 A JP 1999292782A JP 29278299 A JP29278299 A JP 29278299A JP 2001110719 A5 JP2001110719 A5 JP 2001110719A5
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JP
Japan
Prior art keywords
pattern
divided
exposure
manufacturing
semiconductor device
Prior art date
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Pending
Application number
JP1999292782A
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English (en)
Japanese (ja)
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JP2001110719A (ja
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Publication date
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Priority to JP29278299A priority Critical patent/JP2001110719A/ja
Priority claimed from JP29278299A external-priority patent/JP2001110719A/ja
Publication of JP2001110719A publication Critical patent/JP2001110719A/ja
Publication of JP2001110719A5 publication Critical patent/JP2001110719A5/ja
Pending legal-status Critical Current

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JP29278299A 1999-10-14 1999-10-14 露光方法 Pending JP2001110719A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29278299A JP2001110719A (ja) 1999-10-14 1999-10-14 露光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29278299A JP2001110719A (ja) 1999-10-14 1999-10-14 露光方法

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2006206429A Division JP2006319369A (ja) 2006-07-28 2006-07-28 半導体集積回路装置の製造方法
JP2006206428A Division JP2006319368A (ja) 2006-07-28 2006-07-28 半導体集積回路装置の製造方法
JP2006206430A Division JP2006303541A (ja) 2006-07-28 2006-07-28 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001110719A JP2001110719A (ja) 2001-04-20
JP2001110719A5 true JP2001110719A5 (enExample) 2004-09-24

Family

ID=17786275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29278299A Pending JP2001110719A (ja) 1999-10-14 1999-10-14 露光方法

Country Status (1)

Country Link
JP (1) JP2001110719A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6821689B2 (en) * 2002-09-16 2004-11-23 Numerical Technologies Using second exposure to assist a PSM exposure in printing a tight space adjacent to large feature
JP4886169B2 (ja) * 2003-02-21 2012-02-29 キヤノン株式会社 マスク及びその設計方法、露光方法、並びに、デバイス製造方法
WO2004077162A1 (en) * 2003-02-27 2004-09-10 The University Of Hong Kong Multiple exposure method for circuit performance improvement
JP4684584B2 (ja) * 2003-07-23 2011-05-18 キヤノン株式会社 マスク及びその製造方法、並びに、露光方法
JP5106747B2 (ja) * 2004-10-27 2012-12-26 ルネサスエレクトロニクス株式会社 パターン形成方法、半導体装置の製造方法及び露光用マスクセット
KR100688723B1 (ko) 2006-02-17 2007-03-02 삼성전기주식회사 인쇄회로기판의 노광 방법
US20080299499A1 (en) * 2007-05-30 2008-12-04 Naomasa Shiraishi Exposure method, method of manufacturing plate for flat panel display, and exposure apparatus
US7919231B2 (en) 2007-09-04 2011-04-05 Hitachi Global Storage Technologies Netherlands B.V. Photolithographic method and mask devices utilized for multiple exposures in the field of a feature
CN102880012A (zh) * 2012-09-17 2013-01-16 上海华力微电子有限公司 一种可提高工艺套准精度的曝光方法

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