ATE368240T1 - Phasenschiebermaske für die euv-lithographie mit glatter oberfläche (damascene-struktur) - Google Patents
Phasenschiebermaske für die euv-lithographie mit glatter oberfläche (damascene-struktur)Info
- Publication number
- ATE368240T1 ATE368240T1 AT02752674T AT02752674T ATE368240T1 AT E368240 T1 ATE368240 T1 AT E368240T1 AT 02752674 T AT02752674 T AT 02752674T AT 02752674 T AT02752674 T AT 02752674T AT E368240 T1 ATE368240 T1 AT E368240T1
- Authority
- AT
- Austria
- Prior art keywords
- phase shifter
- smooth surface
- euv lithography
- damascene structure
- substrate
- Prior art date
Links
- 238000001900 extreme ultraviolet lithography Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000206 photolithography Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/938,625 US6607862B2 (en) | 2001-08-24 | 2001-08-24 | Damascene extreme ultraviolet lithography alternative phase shift photomask and method of making |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE368240T1 true ATE368240T1 (de) | 2007-08-15 |
Family
ID=25471694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02752674T ATE368240T1 (de) | 2001-08-24 | 2002-08-01 | Phasenschiebermaske für die euv-lithographie mit glatter oberfläche (damascene-struktur) |
Country Status (7)
Country | Link |
---|---|
US (1) | US6607862B2 (de) |
EP (1) | EP1421443B1 (de) |
CN (1) | CN100474105C (de) |
AT (1) | ATE368240T1 (de) |
DE (1) | DE60221404T2 (de) |
TW (1) | TW559886B (de) |
WO (1) | WO2003019291A2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4212025B2 (ja) * | 2002-07-04 | 2009-01-21 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク並びに反射型マスクの製造方法 |
US6986971B2 (en) * | 2002-11-08 | 2006-01-17 | Freescale Semiconductor, Inc. | Reflective mask useful for transferring a pattern using extreme ultraviolet (EUV) radiation and method of making the same |
DE10259331B4 (de) * | 2002-12-18 | 2005-02-10 | Infineon Technologies Ag | Herstellungsverfahren für eine Photomaske für eine integrierte Schaltung und entsprechende Photomaske |
US6998202B2 (en) * | 2003-07-31 | 2006-02-14 | Intel Corporation | Multilayer reflective extreme ultraviolet lithography mask blanks |
US6986974B2 (en) * | 2003-10-16 | 2006-01-17 | Freescale Semiconductor, Inc. | Attenuated phase shift mask for extreme ultraviolet lithography and method therefore |
CN100352001C (zh) * | 2003-12-30 | 2007-11-28 | 旺宏电子股份有限公司 | 应用于微影制程的结构及半导体元件的制造方法 |
JP2005321564A (ja) * | 2004-05-07 | 2005-11-17 | Canon Inc | 多層膜が形成された光学素子の製造方法 |
US7198872B2 (en) * | 2004-05-25 | 2007-04-03 | International Business Machines Corporation | Light scattering EUVL mask |
DE102004031079B4 (de) * | 2004-06-22 | 2008-11-13 | Qimonda Ag | Verfahren zur Herstellung einer Reflexionsmaske |
SG124407A1 (en) * | 2005-02-03 | 2006-08-30 | Asml Netherlands Bv | Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
KR100604938B1 (ko) * | 2005-05-27 | 2006-07-28 | 삼성전자주식회사 | 극자외선 노광용 반사마스크 및 그 제조방법 |
JP4703353B2 (ja) * | 2005-10-14 | 2011-06-15 | Hoya株式会社 | 多層反射膜付き基板、その製造方法、反射型マスクブランクおよび反射型マスク |
JP4703354B2 (ja) * | 2005-10-14 | 2011-06-15 | Hoya株式会社 | 多層反射膜付き基板、その製造方法、反射型マスクブランクおよび反射型マスク |
EP1857876A1 (de) * | 2006-05-15 | 2007-11-21 | Advanced Mask Technology Center GmbH & Co. KG | Methode zur Herstellung einer Phasenschiebermaske |
JP4372178B2 (ja) * | 2007-04-27 | 2009-11-25 | 株式会社東芝 | 光反射型マスクと光反射型マスクの作製方法及び半導体装置の製造方法 |
US20080280539A1 (en) * | 2007-05-11 | 2008-11-13 | Asml Holding N.V. | Optical component fabrication using amorphous oxide coated substrates |
US20080318066A1 (en) * | 2007-05-11 | 2008-12-25 | Asml Holding N.V. | Optical Component Fabrication Using Coated Substrates |
US8110321B2 (en) * | 2007-05-16 | 2012-02-07 | International Business Machines Corporation | Method of manufacture of damascene reticle |
WO2011068223A1 (ja) | 2009-12-04 | 2011-06-09 | 旭硝子株式会社 | Euvリソグラフィ用光学部材およびeuvリソグラフィ用反射層付基板の製造方法 |
KR20130007533A (ko) | 2009-12-09 | 2013-01-18 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 광학 부재 |
CN102687071B (zh) | 2009-12-09 | 2013-12-11 | 旭硝子株式会社 | 带反射层的euv光刻用衬底、euv光刻用反射型掩模坯料、euv光刻用反射型掩模、和该带反射层的衬底的制造方法 |
JP5750951B2 (ja) | 2011-03-14 | 2015-07-22 | 富士通株式会社 | エッチングする方法及びエッチング装置 |
US8795931B2 (en) * | 2012-01-30 | 2014-08-05 | SK Hynix Inc. | Reflection-type photomasks and methods of fabricating the same |
US9310675B2 (en) | 2013-03-15 | 2016-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof |
DE102013108872B4 (de) * | 2013-03-15 | 2018-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fotomasken für extrem ultraviolettes Licht (EUV) sowie Herstellungsverfahren dieser |
US9091947B2 (en) * | 2013-07-19 | 2015-07-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet light (EUV) photomasks and fabrication methods thereof |
US9341940B2 (en) * | 2014-05-15 | 2016-05-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle and method of fabricating the same |
KR102246876B1 (ko) | 2014-10-22 | 2021-04-30 | 삼성전자 주식회사 | 극자외선 리소그래피 장치용 반사형 마스크 및 그 제조방법 |
US9709884B2 (en) | 2014-11-26 | 2017-07-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV mask and manufacturing method by using the same |
KR102520797B1 (ko) | 2015-10-15 | 2023-04-12 | 삼성전자주식회사 | 반사형 포토마스크 및 그 제조 방법 |
CN106169416B (zh) * | 2016-08-29 | 2019-11-12 | 复旦大学 | 一种极紫外掩模的制造方法 |
TWI712849B (zh) * | 2017-02-17 | 2020-12-11 | 聯華電子股份有限公司 | 一種極紫外線光罩 |
US20190056651A1 (en) * | 2017-08-21 | 2019-02-21 | Globalfoundries Inc. | Euv patterning using photomask substrate topography |
EP3486721A1 (de) | 2017-11-17 | 2019-05-22 | IMEC vzw | Maske für extrem-uv-lithographie und verfahren zur deren herstellung |
US11429027B2 (en) * | 2018-08-17 | 2022-08-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photolithography method and apparatus |
WO2020076431A1 (en) * | 2018-10-11 | 2020-04-16 | Applied Materials, Inc. | Photomask cleaning |
SG11202103911SA (en) * | 2018-10-17 | 2021-05-28 | Astrileux Corp | Photomask having reflective layer with non-reflective regions |
JP7447812B2 (ja) * | 2019-01-21 | 2024-03-12 | Agc株式会社 | 反射型マスクブランク、反射型マスク、および反射型マスクブランクの製造方法 |
CN113267956A (zh) * | 2020-05-29 | 2021-08-17 | 台湾积体电路制造股份有限公司 | Euv光掩模及其制造方法 |
DE102020210553A1 (de) * | 2020-08-20 | 2022-03-24 | Carl Zeiss Smt Gmbh | Reflektierendes optisches Element, Beleuchtungsoptik, Projektionsbelichtungsanlage und Verfahren zum Bilden einer Schutzschicht |
US20230032950A1 (en) * | 2021-07-30 | 2023-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Euv photo masks and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3153230B2 (ja) | 1990-09-10 | 2001-04-03 | 株式会社日立製作所 | パタン形成方法 |
JPH11305417A (ja) | 1998-04-24 | 1999-11-05 | Hitachi Ltd | 露光方法および反射型マスク |
JP2004509871A (ja) | 2000-09-20 | 2004-04-02 | シェーリング コーポレイション | 二重ヒスタミンh1およびh3のアゴニストまたはアンタゴニストとしての置換イミダゾール |
US6656643B2 (en) * | 2001-02-20 | 2003-12-02 | Chartered Semiconductor Manufacturing Ltd. | Method of extreme ultraviolet mask engineering |
-
2001
- 2001-08-24 US US09/938,625 patent/US6607862B2/en not_active Expired - Fee Related
-
2002
- 2002-08-01 CN CN02812088.4A patent/CN100474105C/zh not_active Expired - Fee Related
- 2002-08-01 EP EP02752674A patent/EP1421443B1/de not_active Expired - Lifetime
- 2002-08-01 DE DE60221404T patent/DE60221404T2/de not_active Expired - Lifetime
- 2002-08-01 AT AT02752674T patent/ATE368240T1/de not_active IP Right Cessation
- 2002-08-01 WO PCT/US2002/024659 patent/WO2003019291A2/en active IP Right Grant
- 2002-08-05 TW TW091117564A patent/TW559886B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60221404T2 (de) | 2008-04-17 |
EP1421443A2 (de) | 2004-05-26 |
DE60221404D1 (de) | 2007-09-06 |
CN100474105C (zh) | 2009-04-01 |
US6607862B2 (en) | 2003-08-19 |
WO2003019291A2 (en) | 2003-03-06 |
US20030039894A1 (en) | 2003-02-27 |
CN1516827A (zh) | 2004-07-28 |
EP1421443B1 (de) | 2007-07-25 |
TW559886B (en) | 2003-11-01 |
WO2003019291A3 (en) | 2003-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE368240T1 (de) | Phasenschiebermaske für die euv-lithographie mit glatter oberfläche (damascene-struktur) | |
JP2002122976A5 (de) | ||
EP1801647A4 (de) | Fotomasken-rohling und fotomaske | |
KR960032087A (ko) | 위상 시프트 포토마스크 및 위상 시프트 포토마스크 드라이에칭 방법 | |
US6673524B2 (en) | Attenuating extreme ultraviolet (EUV) phase-shifting mask fabrication method | |
EP1586943A3 (de) | Herstellung einer Maske für die Photolithographie | |
JP2014135417A (ja) | パターンの形成方法、それを用いた物品の製造方法 | |
JP3912949B2 (ja) | フォトマスクの形成方法及び半導体装置の製造方法 | |
US5837426A (en) | Photolithographic process for mask programming of read-only memory devices | |
KR960015074A (ko) | 광학 리도그래픽 마스크 및 그의 제조방법 | |
TW200512545A (en) | Method for forming a photoresist pattern using an anti-optical proximity effect | |
TW362237B (en) | Method for fabricating phase shift mask by controlling an exposure dose | |
TW200514135A (en) | Photomask having an internal substantially transparent etch stop layer | |
US6589717B1 (en) | Photon assisted deposition of hard mask formation for use in manufacture of both devices and masks | |
TW201237545A (en) | High resolution phase shift mask | |
US7648806B2 (en) | Phase shift mask with two-phase clear feature | |
CN101634806A (zh) | 一种细线宽硅化物阻挡层图案形成方法 | |
TWI483087B (zh) | 雙重圖案化的方法 | |
DK1288721T3 (da) | Fotolitografi med substrat med flere niveauer | |
US20050008942A1 (en) | [photomask with internal assistant pattern forenhancing resolution of multi-dimension pattern] | |
JP2001201844A5 (de) | ||
TWI298420B (en) | Phase shift mask for ultra-small hole patterning | |
KR20040051912A (ko) | 미세 패턴 형성방법 | |
TW544768B (en) | Photolithography process with hybrid chromeless phase shift mask | |
TW200515104A (en) | An exposure method and an apparatus thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |