JP2001196409A - 半導体デバイス - Google Patents
半導体デバイスInfo
- Publication number
- JP2001196409A JP2001196409A JP2000387813A JP2000387813A JP2001196409A JP 2001196409 A JP2001196409 A JP 2001196409A JP 2000387813 A JP2000387813 A JP 2000387813A JP 2000387813 A JP2000387813 A JP 2000387813A JP 2001196409 A JP2001196409 A JP 2001196409A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal portion
- tin
- semiconductor device
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 abstract description 21
- 238000002844 melting Methods 0.000 abstract description 8
- 230000005496 eutectics Effects 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 61
- 239000000758 substrate Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000004907 flux Effects 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000005272 metallurgy Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 2
- 241000723346 Cinnamomum camphora Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229960000846 camphor Drugs 0.000 description 2
- 229930008380 camphor Natural products 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Abstract
上に載置するように形成される。導電性バンプ32は一
般に、低減された濃度の鉛を有し、260℃を超えない
温度でフローし、アルファ粒子に関わる問題を低減し
た。1つの実施例では、導電性バンプ32は、主に錫2
0を含み、比較的薄い鉛の層30を有する。鉛30と、
錫の一部分20とが相互に作用して、鉛と錫の共晶点に
近い、比較的低い融点の半田を形成する。錫20のほと
んどは、未反応のまま残され、半導体ダイ11とパッケ
ージング基板42との間に、スタンドオフを形成でき
る。他の金属および不純物も、導電性バンプ32の機械
特性または電気特性を向上するのに使用できる。
Description
関し、さらに詳しくは、導電パンプを有する半導体デバ
イスとその形成方法に関する。
たは健康上の問題は一般に、鉛の使用に対する懸念を提
起する。導電性バンプを有する現在のフリップ・チップ
方式の多くは一般に、バンプ内部での鉛の比率が比較的
高い。Controlled Collapsed Chip Connection(C4)
と呼ばれる特定のタイプのバンプでは、バンプは一般に
約97重量パーセントの鉛と、約3重量パーセントの錫
を有する。これらのバンプは、3つの異なる問題を生じ
る。第1に、多くの顧客が希望する以上に鉛を有する。
第2に、バンプをフローさせる(flow)のに比較的高温
が必要であり、第3に、鉛の使用は一般に、半導体デバ
イスのアルファ粒子の生成を生じる。
Extended Eutecticバンプ(E3)が、フロー温度を低
下するのに用いられた。この特定の実施例では、バンプ
は一般に、比較的厚い、主に鉛から成る層の下に比較的
薄い錫層を含み、比較的薄い錫層によって覆われる。フ
ロー工程の間、錫と鉛は、ダイから遠位の点において、
約200℃を超えない温度で、比較的容易にフローし
て、比較的低温で良好なチップ接続を行なう。E3バン
プの問題は、依然鉛が多すぎることであり、アルファ粒
子に関する問題を有することである。
低減しようと、2つの異なるタイプの鉛を使用するアイ
デアが生まれた。下方の鉛層は不純物がほとんどなく、
一般的な商業用の鉛層によって被覆される。これについ
ての問題は、加熱とフローの間、商業用層からの鉛の一
部と不純物が、下方の鉛層に移動するおそれがあること
である。したがって、アルファ粒子の低減の度合いがそ
れほどでなくなる可能性がある。さらに、鉛が多すぎ
る、フロー温度が高すぎるなど、C4バンプに関する問
題と同じ2つの問題点がある。
ダイの上に載置されるように形成される。導電性バンプ
は一般に、鉛の濃度が低く、260℃を超えない温度で
フローし、アルファ粒子に関連する問題を低減した。1
つの実施例で、導電性バンプは、主に錫を含み、比較的
薄い鉛の層を有する。鉛と、錫の一部分は相互作用を起
こして、鉛と錫の共晶点に近い、比較的低温で溶融する
半田を形成する。錫のほとんどは未反応のまま残り、半
導体ダイとパッケージング基板との間に、スタンドオフ
を形成できる。他の金属および不純物も、導電性バンプ
の機械特性または電気特性を改善するのに使用できる。
本発明は、添付請求の範囲によって定義され、実施例の
説明を読むと、さらに理解が深まる。
む。図1に示されるように、半導体ダイ11は、絶縁層
10を含む。絶縁層10は、窒化物,酸化物,酸化窒化
物,またはその混合物を含む。絶縁層10内に形成され
るのが、半導体ダイ相互接続パッド12である。パッド
12は、主に、アルミニウム,銅,タングステンなどを
含む導電性の充填材料を有する。ここで用いられる「主
に」とは、少なくとも半分として定義される。また、接
着層または障壁層も形成されるが、相互接続パッド12
とともに示されず、これは一般に導電性の充填材料を堆
積する前に形成される。相互接続パッド12を形成した
後、ついで、パッシベーション層14が、絶縁層10と
パッド12の上に形成される。開口部が、パッシベーシ
ョン層14を貫通して形成されて、ダイ相互接続パッド
12の一部を露出する開口部を形成する。
護またはアルファ保護層16が、パッシベーション層1
4の上に形成される。層16は一般に、ポリイミドなど
の材料を含む。ついで、バンプ下冶金層(underbump me
tallurgy)18が、パッシベーション層14のポリイミ
ド層部分の上に形成され、これは、ダイ相互接続パッド
12と接触する。バンプ下冶金層18は一般に、クロー
ム,銅,チタン,タンタル,金,プラチナ,パラジウ
ム,ニッケル,コバルト,鉄,これらの合金,および他
の異なる金属との組合せなどから成る複数の膜を含む。
また、必要な場合には、障壁特性を向上させるために、
窒化金属を含むこともできる。バンプ下冶金層の膜厚は
一般に、約1ミクロンを超えない。
冶金層18の上に形成される。バンプの主たる部分は、
図2に示される第1金属層20を含む。この特定の実施
例では、層20は、全部またはほとんどが錫であり、約
25から75ミクロンの範囲の膜厚を有する。層20を
形成する方法は、PVD法,蒸着,メッキ(電解メッキ
または無電解メッキ)などを含むことができる。錫のほ
かに、アルミニウムなど別の材料も使用できる。第1金
属層20は、材料の機械特性または電気特性を改善する
ために、不純物を含むことができる。不純物の例は、
銅,銀,インジウム,ビスマス,アンチモン,亜鉛など
を含む。別の実施例では、第1金属層20は、導電性の
合金を含むことができ、この合金は、少なくとも2つの
異なる導電要素を含む。鉛に関する問題を回避するた
め、第1金属層20は、鉛を含むべきではない。
るように、第1金属層20の上に形成される。第2金属
層30は、第1金属層20について記載される任意の方
法を用いて形成できる。ただし、第1および第2金属層
20,30は、異なる方法を用いて形成してもよい。図
3に戻り、この特定の実施例では、第2金属層30は、
全部またはほとんど鉛を含み、約1から25ミクロンの
範囲の膜厚を有する。鉛の他に、金,ビスマス,インジ
ウム,銀,ガリウムなど、別の金属も使用できる。
れ、これは、第1金属層(第1部分)20と、第2金属
層(第2部分)30とを含む。この特定の実施例では、
導電性バンプ32は、幾つかの興味深い特徴を有する。
導電性バンプ32は、少なくとも2重量パーセントの鉛
を有し、一般的には、約25重量パーセントを超えない
鉛である。明らかに、導電性バンプ32は、鉛よりも錫
のほうが多い。第1金属層20は、第2金属層30の少
なくとも約3倍の膜厚である。第2金属層30は、半導
体ダイ11から最も遠い位置にある層である。
4から図6に示されるパッケージング基板に付着され
る。図4を見て、絶縁層10,14,16(図1から図
3)は、1つの基準素子40により示され、この半導体
ダイも、前述されるように、半導体ダイ相互接続パッド
12とバンプ32とを含む。パッケージング基板42は
一般に、少なくとも一部分が有機材料である。1つの実
施例では、パッケージング基板は、パッケージング基板
相互接続パッド44と、パッケージング基板42内部の
他の相互接続(図示されず)以外、ほとんどが有機材料
である。別の実施例では、パッケージング基板は、主に
セラミックの基板を含み、この基板は、半導体ダイ11
に面する露出表面の上に、比較的薄い有機層を有する。
有機層は、当該有機膜の露出端部に沿って、配線パッド
または他のパッドと、相互接続とを有する。
設置する前に、一般には、パッケージング基板42とパ
ッケージ・パッド44が、フラックスに露出される。こ
のフラックスは一般に、有機酸を含み、有機酸は、パッ
ド44の表面に沿って形成する酸化物と反応し得る。一
例が、カルボキシル酸で、アジピン酸,クエン酸,マレ
イン酸,アビエチン酸などを含む。1つの特定の実施例
では、無洗浄(no−clean)フラックスも使用できる。
無洗浄フラックスを用いることにより、比較的薄いフラ
ックス層が、ダイ11をパッケージング基板42に接合
させた後で洗浄を実施する段階を必要とせずに塗布でき
る。1つの特定の実施例では、樟脳などの接着促進剤
が、バンプ32と、パッケージング基板42のパッドと
の間の接着を改善するのに使用できる。フラックスが塗
布された後、ついで、ダイ11がパッケージング基板4
2の上に設置されて、バンプ32がパッド44と接触す
るようにする。少量の圧力が加えられて、バンプ32
が、パッケージ・パッド44により良く接着できるよう
にする。一般には、0.07から0.10ニュートンの
力が加えられて十分な接着を可能にし、ダイとパッケー
ジング基板42とが、ルーチンの取り扱い中に容易に分
離しないようにする。
後、ついで、結合アセンブリは熱サイクルの下に置か
れ、これにより、半田が形成され、バンプ32をパッド
44と結合させる。図5に示されるように、熱は全体
が、矢印52によって示され、一般には、少なくとも約
183℃の温度で実施される。この動作は、約201度
を超えない温度で実施されることが多い。しかしなが
ら、他の実施例では、より高温も使用できる。錫の融点
は約231℃である。したがって、錫がフローする可能
性を低減するために、フローは、約231℃を上回る温
度で実施すべきではない。有機基板が存在することによ
り、第1および第2金属層に他の材料が使用される場合
には、フロー温度は一般に、約260℃を超えない。
る場所の近傍では、温度により、これらの層内の鉛と錫
との相互作用が可能になり、錫と鉛の共晶点付近に抑制
された(suppressed)融点を有する材料を形成でき、組
成が、約63重量パーセントの錫と、約37重量パーセ
ントの鉛であるときには、この共晶点は約183℃であ
る(約180から190℃の範囲内にある)。図5に示
されるように、抑制された融点部分と、第1金属層20
の残りとの境界が、破線54によって示される。これ
は、2つの部分の間の明確に識別可能、すなわち離散的
な変わり目ではないが、境界が概ねどこにあるかを示
す。この特定の実施例では、半田は、パッド44の上部
へと、また側面に沿って流れるが、第1金属層の非溶融
部分により、引き続きスタンドオフ・ギャップを設け
る。
60の層が、ダイ基板40と、パッケージング基板42
との間に配置される。これは横方向に、バンプ50の周
囲を囲み、組み立てられた部材の機械的完全性を向上で
きるようにする。アンダフィル材料は一般に、エポキシ
混合物内にアルミニウム,シリカなどを含む。
着動作中、他の実施態様も考えられる。例えば、接合を
行なうのに、フラックスが不要であり、同様に、樟脳な
どの接着促進剤の使用も不要である。
されない利点を含む。さらに詳しくは、少なくとも幾つ
かの実施例では、第1および第2金属層の鉛錫材料は、
鉛と錫の共晶点により近い、比較的低い融点の材料を形
成できるようにし、これにより、ほぼ200℃の上下付
近の温度で、フロー段階を実施できる。一部の実施例で
は、第1金属層の融点が共晶組成の溶融温度を上回る場
合には、フロー温度は、より高いポイントに引き上げら
れる。第2に、鉛の量が大幅に低減される。一般に、導
電性バンプ内部には、約25重量パーセントを超えない
鉛が存在する。さらに、鉛は、半導体ダイ基板から遠く
に離されるので、アルファ粒子の問題を生じる可能性が
大幅に低減される。第1金属層20は、フロー動作の
間、スタンドオフとなる。フロー動作の温度は一般に、
第1金属層の融点を下回る温度で実施されるので、第1
金属層20は、バンプの半田部分を形成する部分を除き
溶融しない。フロー動作後でも、パッケージング相互接
続パッド44の表面(側面または上部)の法線方向で、
半田部分の膜厚が測定される場合には、第1金属層20
の残りの部分は依然、半田部分の膜厚の約3倍の膜厚で
ある。
を参照して説明した。しかしながら、当業者は種々の変
形および変更を、添付請求の範囲に定められる本発明の
範囲から逸脱せずに実施できることを理解する。したが
って、本明細書と図面は、限定的意味ではなく、説明の
ためと見なされ、かかるすべての変形は、本発明の範囲
内に包含されることが意図される。
解決策を、特定の実施例に関して説明してきた。しかし
ながら、利点,長所,問題の解決策,および利点,長所
または解決策を生じる可能性のあるいずれの要素も、す
べての請求項の重要,必要または不可欠な特徴もしくは
要素と解釈すべきではない。本明細書で用いられる「構
成される」,「構成する」または他の語形変化は、非排
他的な包含を対象とすることを意図し、一連の要素によ
って構成される工程,方法,物品または装置は、これら
の要素を含むのみならず、明示に列挙されない、すなわ
ち、かかる工程,方法,物品または装置に固有の他の要
素を含む。
様の参照番号は同様の要素を示す。
の図である。
板の断面図である。
属層を形成した後の図2の基板の断面図である。
間の、パッケージング基板と半導体ダイの一部分の断面
図である。
断面図である。
ンダフィル材料を形成した後の図5の基板の断面図であ
る。当業者は、図面内の要素が単純かつ明確を期すよう
に示されており、必ずしも、縮尺どおりに描かれていな
いことを理解する。例えば、図面内の要素の一部の寸法
は、他の素子に比べて大きめに描かれ、本発明の実施例
に対する理解を深める一助になるかもしれない。
Claims (5)
- 【請求項1】 半導体デバイスであって:ダイ相互接続
パッドを有する半導体ダイ;および前記ダイ相互接続パ
ッドと結合されて、第1金属部分と第2金属部分とを含
む導電性バンプであって:前記第1金属部分は、前記第
2金属部分に比べて、前記半導体ダイのより近傍に位置
し;前記第1金属部分は、前記第2金属部分より厚く;
前記第2金属部分は、前記導電性バンプの中で、前記半
導体ダイから最も遠い位置にある金属部分であり;かつ
前記第2金属部分は、鉛を含む導電性バンプ;によって
構成されることを特徴とする半導体デバイス。 - 【請求項2】 前記導電性バンプは、約25重量パーセ
ントを下回る鉛を含むことを特徴とする請求項1記載の
半導体デバイス。 - 【請求項3】 半導体デバイスであって:ダイ相互接続
パッドを有する半導体ダイ;および前記ダイ相互接続パ
ッドと結合され、第1金属部分と第2金属部分とを含む
導電性バンプであって:前記第1金属部分は、前記第2
金属部分に比べて、前記半導体ダイのより近傍に位置
し;かつ前記導電性バンプは、鉛を含むが、約25重量
パーセントを下回る鉛である導電性バンプ:によって構
成されることを特徴とする半導体デバイス。 - 【請求項4】 前記第1金属部分は主に錫を含むことを
特徴とする請求項3記載の半導体デバイス。 - 【請求項5】 前記第1金属部分は、前記第2金属部分
より厚く;前記第2金属部分は、前記半導体ダイから、
最も遠い位置にある導電性の金属部分であり;かつ前記
第2金属部分は、鉛を含むことを特徴とする請求項3記
載の半導体デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/476,810 US6346469B1 (en) | 2000-01-03 | 2000-01-03 | Semiconductor device and a process for forming the semiconductor device |
US476810 | 2000-01-03 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001196409A true JP2001196409A (ja) | 2001-07-19 |
JP2001196409A5 JP2001196409A5 (ja) | 2008-02-14 |
JP4698826B2 JP4698826B2 (ja) | 2011-06-08 |
Family
ID=23893346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000387813A Expired - Fee Related JP4698826B2 (ja) | 2000-01-03 | 2000-12-20 | 半導体デバイス及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6346469B1 (ja) |
JP (1) | JP4698826B2 (ja) |
KR (1) | KR100762111B1 (ja) |
CN (1) | CN100355065C (ja) |
HK (1) | HK1038439A1 (ja) |
SG (1) | SG90219A1 (ja) |
TW (1) | TW473956B (ja) |
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Also Published As
Publication number | Publication date |
---|---|
HK1038439A1 (zh) | 2002-03-15 |
KR20010070397A (ko) | 2001-07-25 |
TW473956B (en) | 2002-01-21 |
KR100762111B1 (ko) | 2007-10-02 |
JP4698826B2 (ja) | 2011-06-08 |
CN1303130A (zh) | 2001-07-11 |
US6346469B1 (en) | 2002-02-12 |
SG90219A1 (en) | 2002-07-23 |
CN100355065C (zh) | 2007-12-12 |
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