JP2001176765A - 膜形成装置 - Google Patents
膜形成装置Info
- Publication number
- JP2001176765A JP2001176765A JP36099099A JP36099099A JP2001176765A JP 2001176765 A JP2001176765 A JP 2001176765A JP 36099099 A JP36099099 A JP 36099099A JP 36099099 A JP36099099 A JP 36099099A JP 2001176765 A JP2001176765 A JP 2001176765A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- solvent
- container
- concentration
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002904 solvent Substances 0.000 claims abstract description 98
- 239000007788 liquid Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims description 56
- 239000011248 coating agent Substances 0.000 claims description 55
- 230000007246 mechanism Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 84
- 239000010408 film Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36099099A JP2001176765A (ja) | 1999-12-20 | 1999-12-20 | 膜形成装置 |
| US09/734,877 US6676757B2 (en) | 1999-12-17 | 2000-12-13 | Coating film forming apparatus and coating unit |
| TW089126783A TW509987B (en) | 1999-12-17 | 2000-12-14 | Coating film forming apparatus and coating unit |
| KR1020000076709A KR100755796B1 (ko) | 1999-12-17 | 2000-12-14 | 도포막형성장치 및 도포유니트 |
| US10/728,768 US6936107B2 (en) | 1999-12-17 | 2003-12-08 | Coating film forming apparatus and coating unit |
| US11/080,756 US7087118B2 (en) | 1999-12-17 | 2005-03-16 | Coating film forming apparatus and coating unit |
| KR1020070013949A KR100739209B1 (ko) | 1999-12-17 | 2007-02-09 | 도포막형성장치 및 도포유니트 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36099099A JP2001176765A (ja) | 1999-12-20 | 1999-12-20 | 膜形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001176765A true JP2001176765A (ja) | 2001-06-29 |
| JP2001176765A5 JP2001176765A5 (enrdf_load_stackoverflow) | 2005-08-18 |
Family
ID=18471735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36099099A Pending JP2001176765A (ja) | 1999-12-17 | 1999-12-20 | 膜形成装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001176765A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6800569B2 (en) | 2002-01-30 | 2004-10-05 | Kabushiki Kaisha Toshiba | Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus |
| JP2006015302A (ja) * | 2004-07-05 | 2006-01-19 | Seiko Epson Corp | 液滴吐出装置、および電気光学装置の製造方法 |
| CN100402163C (zh) * | 2001-07-05 | 2008-07-16 | 东京毅力科创株式会社 | 液体处理装置和液体处理方法 |
| JP2019201075A (ja) * | 2018-05-15 | 2019-11-21 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
1999
- 1999-12-20 JP JP36099099A patent/JP2001176765A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100402163C (zh) * | 2001-07-05 | 2008-07-16 | 东京毅力科创株式会社 | 液体处理装置和液体处理方法 |
| US6800569B2 (en) | 2002-01-30 | 2004-10-05 | Kabushiki Kaisha Toshiba | Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus |
| US7312018B2 (en) | 2002-01-30 | 2007-12-25 | Kabushiki Kaisha Toshiba | Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus |
| US7604832B2 (en) | 2002-01-30 | 2009-10-20 | Kabushiki Kaisha Toshiba | Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus |
| US8071157B2 (en) | 2002-01-30 | 2011-12-06 | Kabushiki Kaisha Toshiba | Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus |
| JP2006015302A (ja) * | 2004-07-05 | 2006-01-19 | Seiko Epson Corp | 液滴吐出装置、および電気光学装置の製造方法 |
| JP2019201075A (ja) * | 2018-05-15 | 2019-11-21 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP7090468B2 (ja) | 2018-05-15 | 2022-06-24 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
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