JP2001165799A - 物理センサの構成装置 - Google Patents

物理センサの構成装置

Info

Publication number
JP2001165799A
JP2001165799A JP2000328153A JP2000328153A JP2001165799A JP 2001165799 A JP2001165799 A JP 2001165799A JP 2000328153 A JP2000328153 A JP 2000328153A JP 2000328153 A JP2000328153 A JP 2000328153A JP 2001165799 A JP2001165799 A JP 2001165799A
Authority
JP
Japan
Prior art keywords
filter
cavity
housing
physical
sensor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000328153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001165799A5 (enExample
Inventor
Slobodan Petrovic
スロボダン・ペトロビック
Holly Jean Miller
ホリー・ジーン・ミラー
David J Monk
デイビッド・ジェイ・モンク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JP2001165799A publication Critical patent/JP2001165799A/ja
Publication of JP2001165799A5 publication Critical patent/JP2001165799A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
JP2000328153A 1999-10-28 2000-10-27 物理センサの構成装置 Pending JP2001165799A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/429,099 US6453749B1 (en) 1999-10-28 1999-10-28 Physical sensor component
US09/429099 1999-10-28

Publications (2)

Publication Number Publication Date
JP2001165799A true JP2001165799A (ja) 2001-06-22
JP2001165799A5 JP2001165799A5 (enExample) 2007-11-01

Family

ID=23701802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000328153A Pending JP2001165799A (ja) 1999-10-28 2000-10-27 物理センサの構成装置

Country Status (4)

Country Link
US (1) US6453749B1 (enExample)
EP (1) EP1096243B1 (enExample)
JP (1) JP2001165799A (enExample)
DE (1) DE60022719T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006234481A (ja) * 2005-02-23 2006-09-07 Bridgestone Corp センサモジュール及びセンサモジュールを備えた空気入りタイヤ
JP2011005986A (ja) * 2009-06-26 2011-01-13 Yokohama Rubber Co Ltd:The タイヤ状態取得装置及びタイヤ状態監視システム

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DE10117296A1 (de) * 2001-04-06 2002-10-17 Krupp Uhde Gmbh Druckaufnehmer insbesondere für Wirbelschichtreaktoren
US6769319B2 (en) * 2001-07-09 2004-08-03 Freescale Semiconductor, Inc. Component having a filter
US6787897B2 (en) * 2001-12-20 2004-09-07 Agilent Technologies, Inc. Wafer-level package with silicon gasket
EP1497629A1 (en) * 2002-04-25 2005-01-19 Glaxo Group Limited Magnetoacoustic sensor system and associated method for sensing environmental conditions
US20050001316A1 (en) * 2003-07-01 2005-01-06 Motorola, Inc. Corrosion-resistant bond pad and integrated device
US7078796B2 (en) * 2003-07-01 2006-07-18 Freescale Semiconductor, Inc. Corrosion-resistant copper bond pad and integrated device
US7231829B2 (en) * 2005-03-31 2007-06-19 Medtronic, Inc. Monolithic integrated circuit/pressure sensor on pacing lead
DE102005015643A1 (de) * 2005-04-05 2006-11-02 Huf Hülsbeck & Fürst Gmbh & Co. Kg Betätigungsvorrichtung
JP2007064837A (ja) * 2005-08-31 2007-03-15 Denso Corp 圧力センサ
JP2007114001A (ja) * 2005-10-19 2007-05-10 Denso Corp 圧力センサ
US7528468B2 (en) * 2006-09-25 2009-05-05 Freescale Semiconductor, Inc. Capacitor assembly with shielded connections and method for forming the same
US8887944B2 (en) 2007-12-11 2014-11-18 Tokitae Llc Temperature-stabilized storage systems configured for storage and stabilization of modular units
US8215835B2 (en) * 2007-12-11 2012-07-10 Tokitae Llc Temperature-stabilized medicinal storage systems
US9140476B2 (en) 2007-12-11 2015-09-22 Tokitae Llc Temperature-controlled storage systems
US8377030B2 (en) * 2007-12-11 2013-02-19 Tokitae Llc Temperature-stabilized storage containers for medicinals
US8215518B2 (en) * 2007-12-11 2012-07-10 Tokitae Llc Temperature-stabilized storage containers with directed access
US8069680B2 (en) 2007-12-11 2011-12-06 Tokitae Llc Methods of manufacturing temperature-stabilized storage containers
US20110127273A1 (en) * 2007-12-11 2011-06-02 TOKITAE LLC, a limited liability company of the State of Delaware Temperature-stabilized storage systems including storage structures configured for interchangeable storage of modular units
US9205969B2 (en) * 2007-12-11 2015-12-08 Tokitae Llc Temperature-stabilized storage systems
US20090145912A1 (en) * 2007-12-11 2009-06-11 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Temperature-stabilized storage containers
US9174791B2 (en) * 2007-12-11 2015-11-03 Tokitae Llc Temperature-stabilized storage systems
US7591185B1 (en) * 2008-04-23 2009-09-22 Medtronic, Inc. Pressure sensor configurations for implantable medical electrical leads
US9372016B2 (en) 2013-05-31 2016-06-21 Tokitae Llc Temperature-stabilized storage systems with regulated cooling
US9447995B2 (en) 2010-02-08 2016-09-20 Tokitac LLC Temperature-stabilized storage systems with integral regulated cooling
US9625333B2 (en) * 2013-03-15 2017-04-18 President And Fellows Of Harvard College Tactile sensor
US20150090030A1 (en) * 2013-09-27 2015-04-02 Infineon Technologies Ag Transducer arrangement comprising a transducer die and method of covering a transducer die
US10053269B2 (en) * 2015-02-09 2018-08-21 The Boeing Company Multi-functional fiber optic fuel sensor system having a photonic membrane
US9799580B2 (en) * 2016-03-24 2017-10-24 Nxp Usa, Inc. Semiconductor device package and methods of manufacture thereof
CN107290096A (zh) * 2016-04-11 2017-10-24 飞思卡尔半导体公司 具有膜片的压力感测集成电路器件
US11745549B2 (en) * 2017-08-21 2023-09-05 Sram. Llc Pressure sensing assembly for a bicycle wheel
US11837513B2 (en) * 2019-07-17 2023-12-05 Texas Instruments Incorporated O-ring seals for fluid sensing
US11408788B2 (en) * 2020-03-31 2022-08-09 Toyota Research Institute, Inc. Variable geometry and stiffness control for fluid filled sensor
US20230183880A1 (en) * 2021-12-15 2023-06-15 Texas Instruments Incorporated Fluid sensor package

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JPS59224534A (ja) * 1983-06-03 1984-12-17 Citizen Watch Co Ltd 圧力電気変換器
JPS62194431A (ja) * 1986-02-21 1987-08-26 Citizen Watch Co Ltd 圧力センサユニツト
JPS62184447U (enExample) * 1986-05-15 1987-11-24
JPS6397833U (enExample) * 1986-12-15 1988-06-24
JPS6418036A (en) * 1987-07-14 1989-01-20 Mitsubishi Electric Corp Pressure sensor
JPH06186104A (ja) * 1992-12-22 1994-07-08 Fuji Electric Co Ltd 半導体圧力センサ
JPH112580A (ja) * 1997-06-13 1999-01-06 Matsushita Electric Works Ltd 半導体圧力センサ
JP2000513447A (ja) * 1996-06-28 2000-10-10 シーメンス アクチエンゲゼルシヤフト プリント配線板の実装表面へ実装するための圧力センサ装置

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US3619742A (en) * 1970-05-21 1971-11-09 Rosemount Eng Co Ltd Shielded capacitance pressure sensor
US4034609A (en) * 1976-01-02 1977-07-12 Fuller David L Digital sensing device
US4177496A (en) * 1976-03-12 1979-12-04 Kavlico Corporation Capacitive pressure transducer
US4571244A (en) * 1984-05-07 1986-02-18 Biogenesis, Inc. System for removing gas bubbles from liquids
US4686764A (en) * 1986-04-22 1987-08-18 Motorola, Inc. Membrane protected pressure sensor
US4909070A (en) * 1987-10-12 1990-03-20 Smith Jeffery B Moisture sensor
US4993265A (en) * 1988-03-03 1991-02-19 The Foxboro Company Protected pressure sensor and method of making
DE68918584T2 (de) 1988-03-03 1995-01-26 Foxboro Co Geschützter drucksensor.
FR2686692B1 (fr) 1992-01-28 1996-08-23 Jaeger Capteur de pression a base de semi-conducteur et procede de fabrication.
US5308939A (en) * 1992-07-21 1994-05-03 Fuji Koki Manufacturing Co., Ltd. Pressure equalizing mechanism for a pressure switch
JPH06132545A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp 圧力検出装置
JPH07120340A (ja) 1993-10-22 1995-05-12 Honda Motor Co Ltd 圧力センサ
DE4413274A1 (de) 1994-04-16 1995-10-19 Sel Alcatel Ag Drucksensor
WO1996003629A1 (de) 1994-07-21 1996-02-08 Siemens Aktiengesellschaft Schutzmembran für einen siliziumdrucksensor
SE9402720D0 (sv) * 1994-08-15 1994-08-15 Gambro Ab Insats för tryckgivare
JPH08178778A (ja) * 1994-12-27 1996-07-12 Mitsubishi Electric Corp 半導体圧力検出装置
US5889211A (en) 1995-04-03 1999-03-30 Motorola, Inc. Media compatible microsensor structure and methods of manufacturing and using the same
US5747694A (en) 1995-07-28 1998-05-05 Nippondenso Co., Ltd. Pressure sensor with barrier in a pressure chamber
US5600071A (en) 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
DE19626083C2 (de) * 1996-06-28 2000-03-23 Siemens Ag Sensor-Bauelement
DE19626086A1 (de) * 1996-06-28 1998-01-02 Siemens Ag Auf der Bestückungsoberfläche einer Leiterplatte montierbares Drucksensor-Bauelement
US6191359B1 (en) * 1998-10-13 2001-02-20 Intel Corporation Mass reflowable windowed package

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224534A (ja) * 1983-06-03 1984-12-17 Citizen Watch Co Ltd 圧力電気変換器
JPS62194431A (ja) * 1986-02-21 1987-08-26 Citizen Watch Co Ltd 圧力センサユニツト
JPS62184447U (enExample) * 1986-05-15 1987-11-24
JPS6397833U (enExample) * 1986-12-15 1988-06-24
JPS6418036A (en) * 1987-07-14 1989-01-20 Mitsubishi Electric Corp Pressure sensor
JPH06186104A (ja) * 1992-12-22 1994-07-08 Fuji Electric Co Ltd 半導体圧力センサ
JP2000513447A (ja) * 1996-06-28 2000-10-10 シーメンス アクチエンゲゼルシヤフト プリント配線板の実装表面へ実装するための圧力センサ装置
JPH112580A (ja) * 1997-06-13 1999-01-06 Matsushita Electric Works Ltd 半導体圧力センサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006234481A (ja) * 2005-02-23 2006-09-07 Bridgestone Corp センサモジュール及びセンサモジュールを備えた空気入りタイヤ
JP2011005986A (ja) * 2009-06-26 2011-01-13 Yokohama Rubber Co Ltd:The タイヤ状態取得装置及びタイヤ状態監視システム

Also Published As

Publication number Publication date
EP1096243A2 (en) 2001-05-02
US20020050170A1 (en) 2002-05-02
EP1096243B1 (en) 2005-09-21
DE60022719D1 (de) 2006-02-02
US6453749B1 (en) 2002-09-24
DE60022719T2 (de) 2006-04-27
EP1096243A3 (en) 2002-06-12

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