FR2686692B1 - Capteur de pression a base de semi-conducteur et procede de fabrication. - Google Patents

Capteur de pression a base de semi-conducteur et procede de fabrication.

Info

Publication number
FR2686692B1
FR2686692B1 FR9200897A FR9200897A FR2686692B1 FR 2686692 B1 FR2686692 B1 FR 2686692B1 FR 9200897 A FR9200897 A FR 9200897A FR 9200897 A FR9200897 A FR 9200897A FR 2686692 B1 FR2686692 B1 FR 2686692B1
Authority
FR
France
Prior art keywords
semiconductor
manufacturing
pressure sensor
based pressure
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9200897A
Other languages
English (en)
Other versions
FR2686692A1 (fr
Inventor
Francis Geslot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jaeger SA
Original Assignee
Jaeger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jaeger SA filed Critical Jaeger SA
Priority to FR9200897A priority Critical patent/FR2686692B1/fr
Publication of FR2686692A1 publication Critical patent/FR2686692A1/fr
Application granted granted Critical
Publication of FR2686692B1 publication Critical patent/FR2686692B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
FR9200897A 1992-01-28 1992-01-28 Capteur de pression a base de semi-conducteur et procede de fabrication. Expired - Fee Related FR2686692B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9200897A FR2686692B1 (fr) 1992-01-28 1992-01-28 Capteur de pression a base de semi-conducteur et procede de fabrication.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9200897A FR2686692B1 (fr) 1992-01-28 1992-01-28 Capteur de pression a base de semi-conducteur et procede de fabrication.

Publications (2)

Publication Number Publication Date
FR2686692A1 FR2686692A1 (fr) 1993-07-30
FR2686692B1 true FR2686692B1 (fr) 1996-08-23

Family

ID=9426054

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9200897A Expired - Fee Related FR2686692B1 (fr) 1992-01-28 1992-01-28 Capteur de pression a base de semi-conducteur et procede de fabrication.

Country Status (1)

Country Link
FR (1) FR2686692B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2730055B1 (fr) * 1995-01-30 1997-04-04 Sagem Capteur de pression de fluide
FR2764113B1 (fr) * 1997-05-28 2000-08-04 Motorola Semiconducteurs Dispositif capteur et son procede de fabrication
US6453749B1 (en) 1999-10-28 2002-09-24 Motorola, Inc. Physical sensor component
US6769319B2 (en) 2001-07-09 2004-08-03 Freescale Semiconductor, Inc. Component having a filter
JP2004198147A (ja) 2002-12-16 2004-07-15 Toyoda Mach Works Ltd 圧力センサ
JP2007532865A (ja) * 2004-02-09 2007-11-15 ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング 圧力センサのための腐食保護
US9863828B2 (en) * 2014-06-18 2018-01-09 Seiko Epson Corporation Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile object

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997029A (ja) * 1982-11-26 1984-06-04 Hitachi Ltd 絶対圧形半導体圧力センサ
US4732042A (en) * 1986-04-22 1988-03-22 Motorola Inc. Cast membrane protected pressure sensor
NL9000802A (nl) * 1990-04-05 1991-11-01 Texas Instruments Holland Sensor voor het meten van de druk van een medium, in het bijzonder voor het meten van de wisselende druk in een dieselinspuitpomp.

Also Published As

Publication number Publication date
FR2686692A1 (fr) 1993-07-30

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Legal Events

Date Code Title Description
ST Notification of lapse