DE60022719T2 - Halbleiterdruckwandler mit Filter - Google Patents

Halbleiterdruckwandler mit Filter Download PDF

Info

Publication number
DE60022719T2
DE60022719T2 DE60022719T DE60022719T DE60022719T2 DE 60022719 T2 DE60022719 T2 DE 60022719T2 DE 60022719 T DE60022719 T DE 60022719T DE 60022719 T DE60022719 T DE 60022719T DE 60022719 T2 DE60022719 T2 DE 60022719T2
Authority
DE
Germany
Prior art keywords
filter
cavity
component
housing
sensor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60022719T
Other languages
German (de)
English (en)
Other versions
DE60022719D1 (de
Inventor
Slobodan Scottsdale Petrovic
Holly Jean Scottsdale Miller
David J. Monk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE60022719D1 publication Critical patent/DE60022719D1/de
Application granted granted Critical
Publication of DE60022719T2 publication Critical patent/DE60022719T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
DE60022719T 1999-10-28 2000-10-23 Halbleiterdruckwandler mit Filter Expired - Fee Related DE60022719T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/429,099 US6453749B1 (en) 1999-10-28 1999-10-28 Physical sensor component
US429099 1999-10-28

Publications (2)

Publication Number Publication Date
DE60022719D1 DE60022719D1 (de) 2006-02-02
DE60022719T2 true DE60022719T2 (de) 2006-04-27

Family

ID=23701802

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60022719T Expired - Fee Related DE60022719T2 (de) 1999-10-28 2000-10-23 Halbleiterdruckwandler mit Filter

Country Status (4)

Country Link
US (1) US6453749B1 (enExample)
EP (1) EP1096243B1 (enExample)
JP (1) JP2001165799A (enExample)
DE (1) DE60022719T2 (enExample)

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US20050001316A1 (en) * 2003-07-01 2005-01-06 Motorola, Inc. Corrosion-resistant bond pad and integrated device
US7078796B2 (en) * 2003-07-01 2006-07-18 Freescale Semiconductor, Inc. Corrosion-resistant copper bond pad and integrated device
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US7231829B2 (en) * 2005-03-31 2007-06-19 Medtronic, Inc. Monolithic integrated circuit/pressure sensor on pacing lead
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JP2007064837A (ja) * 2005-08-31 2007-03-15 Denso Corp 圧力センサ
JP2007114001A (ja) * 2005-10-19 2007-05-10 Denso Corp 圧力センサ
US7528468B2 (en) * 2006-09-25 2009-05-05 Freescale Semiconductor, Inc. Capacitor assembly with shielded connections and method for forming the same
US8887944B2 (en) 2007-12-11 2014-11-18 Tokitae Llc Temperature-stabilized storage systems configured for storage and stabilization of modular units
US8215835B2 (en) * 2007-12-11 2012-07-10 Tokitae Llc Temperature-stabilized medicinal storage systems
US9140476B2 (en) 2007-12-11 2015-09-22 Tokitae Llc Temperature-controlled storage systems
US8377030B2 (en) * 2007-12-11 2013-02-19 Tokitae Llc Temperature-stabilized storage containers for medicinals
US8215518B2 (en) * 2007-12-11 2012-07-10 Tokitae Llc Temperature-stabilized storage containers with directed access
US8069680B2 (en) 2007-12-11 2011-12-06 Tokitae Llc Methods of manufacturing temperature-stabilized storage containers
US20110127273A1 (en) * 2007-12-11 2011-06-02 TOKITAE LLC, a limited liability company of the State of Delaware Temperature-stabilized storage systems including storage structures configured for interchangeable storage of modular units
US9205969B2 (en) * 2007-12-11 2015-12-08 Tokitae Llc Temperature-stabilized storage systems
US20090145912A1 (en) * 2007-12-11 2009-06-11 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Temperature-stabilized storage containers
US9174791B2 (en) * 2007-12-11 2015-11-03 Tokitae Llc Temperature-stabilized storage systems
US7591185B1 (en) * 2008-04-23 2009-09-22 Medtronic, Inc. Pressure sensor configurations for implantable medical electrical leads
JP4737727B2 (ja) * 2009-06-26 2011-08-03 横浜ゴム株式会社 タイヤ状態取得装置及びタイヤ状態監視システム
US9372016B2 (en) 2013-05-31 2016-06-21 Tokitae Llc Temperature-stabilized storage systems with regulated cooling
US9447995B2 (en) 2010-02-08 2016-09-20 Tokitac LLC Temperature-stabilized storage systems with integral regulated cooling
US9625333B2 (en) * 2013-03-15 2017-04-18 President And Fellows Of Harvard College Tactile sensor
US20150090030A1 (en) * 2013-09-27 2015-04-02 Infineon Technologies Ag Transducer arrangement comprising a transducer die and method of covering a transducer die
US10053269B2 (en) * 2015-02-09 2018-08-21 The Boeing Company Multi-functional fiber optic fuel sensor system having a photonic membrane
US9799580B2 (en) * 2016-03-24 2017-10-24 Nxp Usa, Inc. Semiconductor device package and methods of manufacture thereof
CN107290096A (zh) * 2016-04-11 2017-10-24 飞思卡尔半导体公司 具有膜片的压力感测集成电路器件
US11745549B2 (en) * 2017-08-21 2023-09-05 Sram. Llc Pressure sensing assembly for a bicycle wheel
US11837513B2 (en) * 2019-07-17 2023-12-05 Texas Instruments Incorporated O-ring seals for fluid sensing
US11408788B2 (en) * 2020-03-31 2022-08-09 Toyota Research Institute, Inc. Variable geometry and stiffness control for fluid filled sensor
US20230183880A1 (en) * 2021-12-15 2023-06-15 Texas Instruments Incorporated Fluid sensor package

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Also Published As

Publication number Publication date
EP1096243A2 (en) 2001-05-02
JP2001165799A (ja) 2001-06-22
US20020050170A1 (en) 2002-05-02
EP1096243B1 (en) 2005-09-21
DE60022719D1 (de) 2006-02-02
US6453749B1 (en) 2002-09-24
EP1096243A3 (en) 2002-06-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee