JP2001152398A - 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法 - Google Patents

電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

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Publication number
JP2001152398A
JP2001152398A JP2000237548A JP2000237548A JP2001152398A JP 2001152398 A JP2001152398 A JP 2001152398A JP 2000237548 A JP2000237548 A JP 2000237548A JP 2000237548 A JP2000237548 A JP 2000237548A JP 2001152398 A JP2001152398 A JP 2001152398A
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Japan
Prior art keywords
plating solution
concentration
additive
plating
potential
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Pending
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JP2000237548A
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English (en)
Japanese (ja)
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JP2001152398A5 (enExample
Inventor
Hideki Kitada
秀樹 北田
Goji Kamiyoshi
剛司 神吉
Noriyoshi Shimizu
紀嘉 清水
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Fujitsu Ltd
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Fujitsu Ltd
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Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2000237548A priority Critical patent/JP2001152398A/ja
Publication of JP2001152398A publication Critical patent/JP2001152398A/ja
Publication of JP2001152398A5 publication Critical patent/JP2001152398A5/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2000237548A 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法 Pending JP2001152398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000237548A JP2001152398A (ja) 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP22261099 1999-08-05
JP11-260729 1999-09-14
JP11-222610 1999-09-14
JP26072999 1999-09-14
JP2000237548A JP2001152398A (ja) 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

Publications (2)

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JP2001152398A true JP2001152398A (ja) 2001-06-05
JP2001152398A5 JP2001152398A5 (enExample) 2006-10-05

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Country Link
JP (1) JP2001152398A (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368384A (ja) * 2001-06-11 2002-12-20 Toppan Printing Co Ltd 配線基板または半導体回路の製造方法
WO2004085715A1 (ja) * 2003-03-25 2004-10-07 Toppan Printing Co., Ltd. 電気銅めっき液の分析方法、その分析装置及び半導体製品の製造方法
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
JP2007220744A (ja) * 2006-02-14 2007-08-30 Nec Electronics Corp 半導体装置およびその製造方法
CN100351434C (zh) * 2002-12-19 2007-11-28 大日本网目版制造株式会社 电镀装置以及电镀方法
JP2008537782A (ja) * 2005-04-08 2008-09-25 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク めっき浴およびエッチング浴を監視する方法
WO2011105072A1 (ja) * 2010-02-24 2011-09-01 住友ベークライト株式会社 基板処理方法および基板処理装置
CN103388172A (zh) * 2013-07-22 2013-11-13 苏州昕皓新材料科技有限公司 一种快速判断电镀添加剂性能的方法
CN104233451A (zh) * 2013-06-14 2014-12-24 朗姆研究公司 利用场与特征对比的tsv 浴评估
JP2015010991A (ja) * 2013-07-01 2015-01-19 住友金属鉱山株式会社 めっき液に含まれる抑制剤の評価方法
WO2016174705A1 (ja) * 2015-04-27 2016-11-03 株式会社Ｊｃｕ 硫酸銅めっき液の管理方法
US9856574B2 (en) 2011-12-12 2018-01-02 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
KR20200022335A (ko) * 2018-08-22 2020-03-03 이씨아이 테크놀로지 인코포레이티드 전착 용액에서 첨가제 회전율의 제어 방법
JP2020193383A (ja) * 2019-05-30 2020-12-03 長野県 電気ニッケルめっき液中の添加剤濃度推定方法
WO2021202392A1 (en) * 2020-03-30 2021-10-07 Lam Research Corporation Leveling compound control

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368384A (ja) * 2001-06-11 2002-12-20 Toppan Printing Co Ltd 配線基板または半導体回路の製造方法
CN100351434C (zh) * 2002-12-19 2007-11-28 大日本网目版制造株式会社 电镀装置以及电镀方法
WO2004085715A1 (ja) * 2003-03-25 2004-10-07 Toppan Printing Co., Ltd. 電気銅めっき液の分析方法、その分析装置及び半導体製品の製造方法
JPWO2004085715A1 (ja) * 2003-03-25 2006-06-29 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置及び半導体製品の製造方法
JP4534983B2 (ja) * 2003-03-25 2010-09-01 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置
US7820535B2 (en) 2003-03-25 2010-10-26 Toppan Printing Co., Ltd. Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product
US8440555B2 (en) 2003-03-25 2013-05-14 Toppan Printing Co., Ltd. Method for analyzing electrolytic copper plating solution
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
JP2008537782A (ja) * 2005-04-08 2008-09-25 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク めっき浴およびエッチング浴を監視する方法
JP2007220744A (ja) * 2006-02-14 2007-08-30 Nec Electronics Corp 半導体装置およびその製造方法
WO2011105072A1 (ja) * 2010-02-24 2011-09-01 住友ベークライト株式会社 基板処理方法および基板処理装置
US9856574B2 (en) 2011-12-12 2018-01-02 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
US10508359B2 (en) 2013-06-14 2019-12-17 Lam Research Corporation TSV bath evaluation using field versus feature contrast
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
CN104233451B (zh) * 2013-06-14 2017-11-24 朗姆研究公司 利用场与特征对比的tsv浴评估
CN104233451A (zh) * 2013-06-14 2014-12-24 朗姆研究公司 利用场与特征对比的tsv 浴评估
JP2015010991A (ja) * 2013-07-01 2015-01-19 住友金属鉱山株式会社 めっき液に含まれる抑制剤の評価方法
CN103388172A (zh) * 2013-07-22 2013-11-13 苏州昕皓新材料科技有限公司 一种快速判断电镀添加剂性能的方法
CN103388172B (zh) * 2013-07-22 2016-06-22 苏州昕皓新材料科技有限公司 一种快速判断电镀添加剂性能的方法
US10774438B2 (en) 2015-04-13 2020-09-15 Lam Research Corporation Monitoring electrolytes during electroplating
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
JPWO2016174705A1 (ja) * 2015-04-27 2018-02-15 株式会社Ｊｃｕ 硫酸銅めっき液の管理方法
WO2016174705A1 (ja) * 2015-04-27 2016-11-03 株式会社Ｊｃｕ 硫酸銅めっき液の管理方法
KR20200022335A (ko) * 2018-08-22 2020-03-03 이씨아이 테크놀로지 인코포레이티드 전착 용액에서 첨가제 회전율의 제어 방법
KR102347903B1 (ko) 2018-08-22 2022-01-05 이씨아이 테크놀로지 인코포레이티드 전착 용액에서 첨가제 회전율의 제어 방법
JP2020193383A (ja) * 2019-05-30 2020-12-03 長野県 電気ニッケルめっき液中の添加剤濃度推定方法
JP7291911B2 (ja) 2019-05-30 2023-06-16 長野県 電気ニッケルめっき液中の添加剤濃度推定方法
WO2021202392A1 (en) * 2020-03-30 2021-10-07 Lam Research Corporation Leveling compound control

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