JP2001127022A5 - - Google Patents

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Publication number
JP2001127022A5
JP2001127022A5 JP2000248145A JP2000248145A JP2001127022A5 JP 2001127022 A5 JP2001127022 A5 JP 2001127022A5 JP 2000248145 A JP2000248145 A JP 2000248145A JP 2000248145 A JP2000248145 A JP 2000248145A JP 2001127022 A5 JP2001127022 A5 JP 2001127022A5
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JP
Japan
Prior art keywords
polishing
wafer
fixed abrasive
polished
dressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000248145A
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English (en)
Japanese (ja)
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JP2001127022A (ja
JP4090186B2 (ja
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Priority to JP2000248145A priority Critical patent/JP4090186B2/ja
Priority claimed from JP2000248145A external-priority patent/JP4090186B2/ja
Publication of JP2001127022A publication Critical patent/JP2001127022A/ja
Publication of JP2001127022A5 publication Critical patent/JP2001127022A5/ja
Application granted granted Critical
Publication of JP4090186B2 publication Critical patent/JP4090186B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000248145A 1999-08-18 2000-08-18 研磨方法及び研磨装置 Expired - Fee Related JP4090186B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000248145A JP4090186B2 (ja) 1999-08-18 2000-08-18 研磨方法及び研磨装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23192499 1999-08-18
JP11-231924 1999-08-18
JP2000248145A JP4090186B2 (ja) 1999-08-18 2000-08-18 研磨方法及び研磨装置

Publications (3)

Publication Number Publication Date
JP2001127022A JP2001127022A (ja) 2001-05-11
JP2001127022A5 true JP2001127022A5 (enExample) 2005-07-21
JP4090186B2 JP4090186B2 (ja) 2008-05-28

Family

ID=26530182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000248145A Expired - Fee Related JP4090186B2 (ja) 1999-08-18 2000-08-18 研磨方法及び研磨装置

Country Status (1)

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JP (1) JP4090186B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040248415A1 (en) 2002-02-20 2004-12-09 Yutaka Wada Polishing method and polishing liquid
JP2003318140A (ja) * 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
JP5671510B2 (ja) * 2012-06-27 2015-02-18 株式会社岡本工作機械製作所 半導体デバイス基板の研削方法
JP2024085517A (ja) * 2022-12-15 2024-06-27 株式会社荏原製作所 研磨装置

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