JP2001075628A5 - - Google Patents

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Publication number
JP2001075628A5
JP2001075628A5 JP1999247464A JP24746499A JP2001075628A5 JP 2001075628 A5 JP2001075628 A5 JP 2001075628A5 JP 1999247464 A JP1999247464 A JP 1999247464A JP 24746499 A JP24746499 A JP 24746499A JP 2001075628 A5 JP2001075628 A5 JP 2001075628A5
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JP
Japan
Prior art keywords
parameters
operating condition
memory
expanding
condition parameters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999247464A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001075628A (ja
JP4545252B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP24746499A external-priority patent/JP4545252B2/ja
Priority to JP24746499A priority Critical patent/JP4545252B2/ja
Priority to KR10-2001-7005297A priority patent/KR100453777B1/ko
Priority to PCT/JP2000/005611 priority patent/WO2001016659A1/ja
Priority to EP00953556A priority patent/EP1148402A4/en
Priority to TW089117213A priority patent/TW530428B/zh
Priority to US09/667,001 priority patent/US6514345B1/en
Publication of JP2001075628A publication Critical patent/JP2001075628A/ja
Publication of JP2001075628A5 publication Critical patent/JP2001075628A5/ja
Publication of JP4545252B2 publication Critical patent/JP4545252B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP24746499A 1999-09-01 1999-09-01 半導体製造装置 Expired - Fee Related JP4545252B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP24746499A JP4545252B2 (ja) 1999-09-01 1999-09-01 半導体製造装置
KR10-2001-7005297A KR100453777B1 (ko) 1999-09-01 2000-08-22 반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체
PCT/JP2000/005611 WO2001016659A1 (en) 1999-09-01 2000-08-22 Semiconductor manufacturing apparatus and method for controlling the operating condition parameter
EP00953556A EP1148402A4 (en) 1999-09-01 2000-08-22 DEVICE FOR PRODUCING SEMICONDUCTORS AND METHOD FOR CONTROLLING THE OPERATING PARAMETERS
TW089117213A TW530428B (en) 1999-09-01 2000-08-25 Semiconductor manufacturing apparatus and method for managing the operating condition parameter
US09/667,001 US6514345B1 (en) 1999-09-01 2000-09-21 Processing apparatus and managing method of operational condition parameter thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24746499A JP4545252B2 (ja) 1999-09-01 1999-09-01 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2001075628A JP2001075628A (ja) 2001-03-23
JP2001075628A5 true JP2001075628A5 (enExample) 2006-07-13
JP4545252B2 JP4545252B2 (ja) 2010-09-15

Family

ID=17163847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24746499A Expired - Fee Related JP4545252B2 (ja) 1999-09-01 1999-09-01 半導体製造装置

Country Status (6)

Country Link
US (1) US6514345B1 (enExample)
EP (1) EP1148402A4 (enExample)
JP (1) JP4545252B2 (enExample)
KR (1) KR100453777B1 (enExample)
TW (1) TW530428B (enExample)
WO (1) WO2001016659A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
KR100395697B1 (ko) * 2001-04-07 2003-08-25 (주)지우텍 반도체 공정 파라미터를 이용한 반도체 공정 장비 제어 방법
JP4126189B2 (ja) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ 検査条件設定プログラム、検査装置および検査システム
JP4277100B2 (ja) * 2002-11-14 2009-06-10 東京エレクトロン株式会社 搬送機構の基準位置補正装置及び基準位置補正方法
CN101283360B (zh) * 2005-02-25 2011-07-06 朗姆研究公司 用于群集工具的安全通用配置方法
US7353379B2 (en) * 2005-02-25 2008-04-01 Lam Research Corporation Methods for configuring a plasma cluster tool
US7162317B2 (en) * 2005-02-25 2007-01-09 Lam Research Corporation Methods and apparatus for configuring plasma cluster tools
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
JP4841183B2 (ja) * 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
TWI342058B (en) * 2005-12-20 2011-05-11 Applied Materials Inc Extended mainframe designs for semiconductor device manufacturing equipment
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP4697896B2 (ja) * 2007-03-24 2011-06-08 東京エレクトロン株式会社 半導体製造装置、装置動作パラメータの管理方法、およびプログラム
US20120016506A1 (en) * 2009-04-15 2012-01-19 Masahiro Yokogawa Manufacturing method and manufacturing system for product
JP6111980B2 (ja) 2013-10-29 2017-04-12 株式会社安川電機 産業機器管理システム、産業機器管理サーバ、産業機器管理方法、プログラム、及び情報記憶媒体
JP6806601B2 (ja) * 2017-03-17 2021-01-06 アズビル株式会社 機器情報管理システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844784A (ja) * 1981-09-11 1983-03-15 Nippon Sekigaisen Kogyo Kk レ−ザ装置
US4967381A (en) * 1985-04-30 1990-10-30 Prometrix Corporation Process control interface system for managing measurement data
US4951190A (en) * 1985-04-30 1990-08-21 Prometrix Corporation Multilevel menu and hierarchy for selecting items and performing tasks thereon in a computer system
US5469361A (en) * 1991-08-08 1995-11-21 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Generic cell controlling method and apparatus for computer integrated manufacturing system
JPH06222819A (ja) * 1993-01-26 1994-08-12 Fanuc Ltd Ｎｃ装置の加工プログラム実行方法
JPH08129407A (ja) * 1994-10-28 1996-05-21 Tokyo Electron Ltd 制御装置、制御装置のプログラムのロード方法および処理装置
JPH08161013A (ja) * 1994-12-09 1996-06-21 Canon Inc デバイス製造装置および方法
JPH0962323A (ja) * 1995-08-24 1997-03-07 Mitsubishi Electric Corp 数値制御装置のシステムパラメータ設定方法および数値制御装置
JP3393035B2 (ja) * 1997-05-06 2003-04-07 東京エレクトロン株式会社 制御装置及び半導体製造装置
US5838565A (en) 1997-05-15 1998-11-17 Vanguard International Semiconductor Corporation Manufacturing control method for IC plant batch sequential machine
JPH113117A (ja) * 1997-06-10 1999-01-06 Dainippon Screen Mfg Co Ltd 処理システムにおけるアラーム装置

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