JP2001042545A5 - - Google Patents

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Publication number
JP2001042545A5
JP2001042545A5 JP1999216670A JP21667099A JP2001042545A5 JP 2001042545 A5 JP2001042545 A5 JP 2001042545A5 JP 1999216670 A JP1999216670 A JP 1999216670A JP 21667099 A JP21667099 A JP 21667099A JP 2001042545 A5 JP2001042545 A5 JP 2001042545A5
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JP
Japan
Prior art keywords
pattern
mask
exposure
manufacturing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999216670A
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English (en)
Japanese (ja)
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JP2001042545A (ja
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Publication date
Application filed filed Critical
Priority to JP11216670A priority Critical patent/JP2001042545A/ja
Priority claimed from JP11216670A external-priority patent/JP2001042545A/ja
Publication of JP2001042545A publication Critical patent/JP2001042545A/ja
Publication of JP2001042545A5 publication Critical patent/JP2001042545A5/ja
Pending legal-status Critical Current

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JP11216670A 1999-07-30 1999-07-30 半導体装置の製造方法 Pending JP2001042545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11216670A JP2001042545A (ja) 1999-07-30 1999-07-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11216670A JP2001042545A (ja) 1999-07-30 1999-07-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001042545A JP2001042545A (ja) 2001-02-16
JP2001042545A5 true JP2001042545A5 (https=) 2004-09-24

Family

ID=16692094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11216670A Pending JP2001042545A (ja) 1999-07-30 1999-07-30 半導体装置の製造方法

Country Status (1)

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JP (1) JP2001042545A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4641799B2 (ja) * 2003-02-27 2011-03-02 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2005227666A (ja) 2004-02-16 2005-08-25 Toshiba Corp マスクデータ補正方法と半導体装置の製造方法
KR100675882B1 (ko) 2004-12-22 2007-02-02 주식회사 하이닉스반도체 다중투과 위상 마스크 및 이를 이용한 노광 방법
JP2006301184A (ja) * 2005-04-19 2006-11-02 Sony Corp 位相シフトマスクの製造方法、近接効果補正装置およびプログラム
US7829246B2 (en) 2005-11-08 2010-11-09 Nec Electronics Corporation Method of forming pattern
US8399183B2 (en) * 2009-05-13 2013-03-19 Synopsys, Inc. Patterning a single integrated circuit layer using automatically-generated masks and multiple masking layers
JP2015025917A (ja) * 2013-07-25 2015-02-05 瑞晶電子股ふん有限公司 二重露光のマスク構造及び露光現像の方法

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