JP2000516035A - マトリックス装置構成のledアレイ - Google Patents

マトリックス装置構成のledアレイ

Info

Publication number
JP2000516035A
JP2000516035A JP10507475A JP50747598A JP2000516035A JP 2000516035 A JP2000516035 A JP 2000516035A JP 10507475 A JP10507475 A JP 10507475A JP 50747598 A JP50747598 A JP 50747598A JP 2000516035 A JP2000516035 A JP 2000516035A
Authority
JP
Japan
Prior art keywords
led array
conductive layer
layer
led
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10507475A
Other languages
English (en)
Japanese (ja)
Inventor
ニルシュル エルンスト
ヴェークライター ヴァルター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2000516035A publication Critical patent/JP2000516035A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP10507475A 1996-08-07 1997-07-31 マトリックス装置構成のledアレイ Pending JP2000516035A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19631907A DE19631907A1 (de) 1996-08-07 1996-08-07 LED-Array in Matrixanordnung
DE19631907.2 1996-08-07
PCT/DE1997/001625 WO1998006134A1 (de) 1996-08-07 1997-07-31 Led-array in matrixanordnung

Publications (1)

Publication Number Publication Date
JP2000516035A true JP2000516035A (ja) 2000-11-28

Family

ID=7802052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10507475A Pending JP2000516035A (ja) 1996-08-07 1997-07-31 マトリックス装置構成のledアレイ

Country Status (5)

Country Link
EP (1) EP0917736A1 (de)
JP (1) JP2000516035A (de)
CN (1) CN1231769A (de)
DE (1) DE19631907A1 (de)
WO (1) WO1998006134A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10011318A1 (de) * 2000-03-13 2001-09-20 Visicontrol Ges Fuer Elektroni Vorrichtung zur Prüfung und/oder Vermessung von Prüflingen
GB0302580D0 (en) 2003-02-05 2003-03-12 Univ Strathclyde MICRO LEDs
US7994524B1 (en) * 2007-09-12 2011-08-09 David Yaunien Chung Vertically structured LED array light source
CN103700682A (zh) * 2012-05-04 2014-04-02 奇力光电科技股份有限公司 发光二极管结构及其制造方法
TW201347141A (zh) * 2012-05-04 2013-11-16 Chi Mei Lighting Tech Corp 發光二極體結構及其製造方法
CN104218133B (zh) * 2014-08-26 2017-04-26 华灿光电股份有限公司 一种发光二极管芯片及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0011418A1 (de) * 1978-11-20 1980-05-28 THE GENERAL ELECTRIC COMPANY, p.l.c. Verfahren zur Herstellung von Leuchtanzeigevorrichtungen
US5160492A (en) * 1989-04-24 1992-11-03 Hewlett-Packard Company Buried isolation using ion implantation and subsequent epitaxial growth
JPH04336260A (ja) * 1991-05-14 1992-11-24 Eastman Kodak Japan Kk 発光ダイオードプリンタヘッド
US5449926A (en) * 1994-05-09 1995-09-12 Motorola, Inc. High density LED arrays with semiconductor interconnects

Also Published As

Publication number Publication date
WO1998006134A1 (de) 1998-02-12
CN1231769A (zh) 1999-10-13
EP0917736A1 (de) 1999-05-26
DE19631907A1 (de) 1998-02-12

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