JP2000509425A5 - - Google Patents

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Publication number
JP2000509425A5
JP2000509425A5 JP1997540837A JP54083797A JP2000509425A5 JP 2000509425 A5 JP2000509425 A5 JP 2000509425A5 JP 1997540837 A JP1997540837 A JP 1997540837A JP 54083797 A JP54083797 A JP 54083797A JP 2000509425 A5 JP2000509425 A5 JP 2000509425A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997540837A
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English (en)
Japanese (ja)
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JP4154513B2 (ja
JP2000509425A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US1996/018311 external-priority patent/WO1997043352A1/en
Publication of JP2000509425A publication Critical patent/JP2000509425A/ja
Publication of JP2000509425A5 publication Critical patent/JP2000509425A5/ja
Application granted granted Critical
Publication of JP4154513B2 publication Critical patent/JP4154513B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP54083797A 1996-05-16 1996-11-12 接着剤組成物と使用方法 Expired - Fee Related JP4154513B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64878796A 1996-05-16 1996-05-16
US08/648,787 1996-05-16
PCT/US1996/018311 WO1997043352A1 (en) 1996-05-16 1996-11-12 Adhesive compositions and methods of use

Publications (3)

Publication Number Publication Date
JP2000509425A JP2000509425A (ja) 2000-07-25
JP2000509425A5 true JP2000509425A5 (enExample) 2004-10-28
JP4154513B2 JP4154513B2 (ja) 2008-09-24

Family

ID=24602241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54083797A Expired - Fee Related JP4154513B2 (ja) 1996-05-16 1996-11-12 接着剤組成物と使用方法

Country Status (6)

Country Link
EP (1) EP0898603B1 (enExample)
JP (1) JP4154513B2 (enExample)
AU (1) AU711287B2 (enExample)
CA (1) CA2254883A1 (enExample)
DE (1) DE69635929D1 (enExample)
WO (1) WO1997043352A1 (enExample)

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DE19852720A1 (de) * 1998-11-16 2000-05-18 Fischer Artur Werke Gmbh Zweikomponentenmasse für chemische Befestigungen
JP4516632B2 (ja) * 1999-04-20 2010-08-04 日東電工株式会社 アクリル系感圧性接着剤組成物とその接着シ―ト類
JP2001081438A (ja) * 1999-09-14 2001-03-27 Sony Chem Corp 接続材料
JP4607270B2 (ja) * 1999-11-24 2011-01-05 日東電工株式会社 熱硬化型接着剤とその接着シ―ト類
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
JP2002129127A (ja) * 2000-10-20 2002-05-09 Shin Etsu Polymer Co Ltd 絶縁性接着剤、異方導電接着剤、ヒートシールコネクタ、及びヒートシールコネクタの製造方法
JP5111711B2 (ja) * 2002-01-31 2013-01-09 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US6919504B2 (en) 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
JP2009544815A (ja) * 2006-07-24 2009-12-17 スリーエム イノベイティブ プロパティズ カンパニー 導電性感圧性接着剤
JP2007284676A (ja) * 2007-04-02 2007-11-01 Hitachi Chem Co Ltd 電極接続用接着剤
US9207373B2 (en) 2007-04-10 2015-12-08 Stoncor Group, Inc. Methods for fabrication and highway marking usage of agglomerated retroreflective beads
KR20100009538A (ko) * 2007-10-05 2010-01-27 히다치 가세고교 가부시끼가이샤 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
JP2010121007A (ja) * 2008-11-18 2010-06-03 Sumitomo Electric Ind Ltd 異方導電性フィルム
JP5728804B2 (ja) * 2009-10-07 2015-06-03 デクセリアルズ株式会社 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
TWI443166B (zh) * 2010-11-23 2014-07-01 Lg Chemical Ltd 黏著劑組成物
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
US9346992B2 (en) * 2013-07-31 2016-05-24 E I Du Pont De Nemours And Company Thermally conductive dielectric for thermoformable circuits
KR20150069593A (ko) * 2013-12-13 2015-06-24 (주)엘지하우시스 접착력이 향상된 단열재용 접착제 조성물
RU2561201C1 (ru) * 2014-01-20 2015-08-27 Открытое акционерное общество "Композит" (ОАО "Композит") Композиция для теплопроводного клеевого состава
JP6355954B2 (ja) * 2014-04-07 2018-07-11 デクセリアルズ株式会社 接着フィルム及びその製造方法
WO2017134282A1 (en) * 2016-02-05 2017-08-10 Technische Universität München Joining of components by means of energetically activated reactive particles
WO2017199562A1 (ja) 2016-05-19 2017-11-23 三菱ケミカル株式会社 マクロモノマー共重合体およびその製造方法
US11431234B2 (en) * 2018-03-20 2022-08-30 Johnson Electric International AG Rotor assembly for DC motor
CN110591583A (zh) * 2019-09-20 2019-12-20 上海精珅新材料有限公司 一种uv增粘后可高温降粘的制程用的过程膜生产方法及其产品
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法
CN112300712A (zh) * 2020-11-18 2021-02-02 江苏皇冠新材料科技有限公司 紫外光固化胶黏剂及紫外光固化保护膜
EP4071222A4 (en) * 2021-02-15 2023-01-25 DIC Corporation Two-component curing adhesive, laminated film, device for producing laminated film, and method for producing laminated film
JP7136363B1 (ja) * 2021-02-15 2022-09-13 Dic株式会社 二液硬化型接着剤、積層フィルム、積層フィルム製造装置、積層フィルムの製造方法
WO2022181564A1 (ja) * 2021-02-24 2022-09-01 東亞合成株式会社 ゴムと金属用の二液型接着剤及びこれを用いた接着方法
TWM621431U (zh) * 2021-07-26 2021-12-21 英豪科技股份有限公司 柔性扁平電纜
CN114231186B (zh) * 2021-12-15 2023-04-18 武汉市科达云石护理材料有限公司 一种快速固化改性干挂胶及其制备方法与应用
CN114539954B (zh) * 2022-03-31 2023-09-12 四川中久国峰科技有限公司 可丝网印刷的丙烯酸酯类压敏胶黏剂、制备方法及应用
TWM633612U (zh) * 2022-04-29 2022-11-01 英豪科技股份有限公司 柔性扁平電纜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825050A (enExample) * 1971-08-02 1973-04-02
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor
DE3565993D1 (en) * 1984-04-29 1988-12-08 Nitto Electric Ind Co Method of adhering metal alloy to metal sheet with resin composition
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
CA2009566A1 (en) * 1989-03-09 1990-09-09 Shinobu Sato Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
US5283007A (en) * 1992-04-28 1994-02-01 E. I. Du Pont De Nemours And Company Conductive polymer compositions
WO1992020073A2 (en) * 1991-05-01 1992-11-12 E.I. Du Pont De Nemours And Company Conductive polymer compositions
JP3408301B2 (ja) * 1993-12-16 2003-05-19 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜

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