CA2254883A1 - Adhesive compositions and methods of use - Google Patents
Adhesive compositions and methods of use Download PDFInfo
- Publication number
- CA2254883A1 CA2254883A1 CA002254883A CA2254883A CA2254883A1 CA 2254883 A1 CA2254883 A1 CA 2254883A1 CA 002254883 A CA002254883 A CA 002254883A CA 2254883 A CA2254883 A CA 2254883A CA 2254883 A1 CA2254883 A1 CA 2254883A1
- Authority
- CA
- Canada
- Prior art keywords
- adhesive
- screen
- acrylate
- composition
- polyepoxide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 259
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 258
- 239000000203 mixture Substances 0.000 title claims abstract description 250
- 238000000034 method Methods 0.000 title claims description 73
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 175
- 229920005989 resin Polymers 0.000 claims abstract description 141
- 239000011347 resin Substances 0.000 claims abstract description 141
- 239000002313 adhesive film Substances 0.000 claims abstract description 112
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 22
- 125000005250 alkyl acrylate group Chemical group 0.000 claims abstract description 16
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 80
- 239000000178 monomer Substances 0.000 claims description 75
- 239000002245 particle Substances 0.000 claims description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- 229920000642 polymer Polymers 0.000 claims description 30
- 239000011258 core-shell material Substances 0.000 claims description 27
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical group C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 25
- 239000003431 cross linking reagent Substances 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 18
- 150000001412 amines Chemical class 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 229920006126 semicrystalline polymer Polymers 0.000 claims description 14
- 229920001169 thermoplastic Polymers 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 229920003986 novolac Polymers 0.000 claims description 9
- 229920001897 terpolymer Polymers 0.000 claims description 9
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical group C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 8
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 8
- 239000002954 polymerization reaction product Substances 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000004386 diacrylate group Chemical group 0.000 claims description 6
- 239000004609 Impact Modifier Substances 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- CGPRUXZTHGTMKW-UHFFFAOYSA-N ethene;ethyl prop-2-enoate Chemical group C=C.CCOC(=O)C=C CGPRUXZTHGTMKW-UHFFFAOYSA-N 0.000 claims description 5
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000013008 thixotropic agent Substances 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229920001519 homopolymer Polymers 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 238000000113 differential scanning calorimetry Methods 0.000 claims 2
- 150000003509 tertiary alcohols Chemical class 0.000 claims 2
- 239000002390 adhesive tape Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 description 61
- 239000006188 syrup Substances 0.000 description 32
- 235000020357 syrup Nutrition 0.000 description 32
- 238000012360 testing method Methods 0.000 description 26
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 26
- 239000000463 material Substances 0.000 description 24
- -1 n-dodecyl Chemical group 0.000 description 24
- 238000000576 coating method Methods 0.000 description 22
- 238000004026 adhesive bonding Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 19
- 238000002156 mixing Methods 0.000 description 15
- 238000007650 screen-printing Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 239000000523 sample Substances 0.000 description 14
- 230000007613 environmental effect Effects 0.000 description 13
- 239000003999 initiator Substances 0.000 description 13
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 12
- 239000011257 shell material Substances 0.000 description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 10
- 230000035882 stress Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 230000032683 aging Effects 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 7
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- 230000009974 thixotropic effect Effects 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 239000002671 adjuvant Substances 0.000 description 6
- 239000012986 chain transfer agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910021485 fumed silica Inorganic materials 0.000 description 6
- 238000005065 mining Methods 0.000 description 6
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 108091092920 SmY RNA Proteins 0.000 description 5
- 241001237710 Smyrna Species 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 229920001634 Copolyester Polymers 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 4
- 238000007707 calorimetry Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000012777 electrically insulating material Substances 0.000 description 4
- 150000002118 epoxides Chemical group 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920000205 poly(isobutyl methacrylate) Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- RREANTFLPGEWEN-MBLPBCRHSA-N 7-[4-[[(3z)-3-[4-amino-5-[(3,4,5-trimethoxyphenyl)methyl]pyrimidin-2-yl]imino-5-fluoro-2-oxoindol-1-yl]methyl]piperazin-1-yl]-1-cyclopropyl-6-fluoro-4-oxoquinoline-3-carboxylic acid Chemical compound COC1=C(OC)C(OC)=CC(CC=2C(=NC(\N=C/3C4=CC(F)=CC=C4N(CN4CCN(CC4)C=4C(=CC=5C(=O)C(C(O)=O)=CN(C=5C=4)C4CC4)F)C\3=O)=NC=2)N)=C1 RREANTFLPGEWEN-MBLPBCRHSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- KMPSMFOILCQMCK-UHFFFAOYSA-N NCCC1=NC(=NC(=N1)N)C(=O)C1(N=CC=N1)C Chemical compound NCCC1=NC(=NC(=N1)N)C(=O)C1(N=CC=N1)C KMPSMFOILCQMCK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 125000005233 alkylalcohol group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012949 free radical photoinitiator Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ZMAMKNPVAMKIIC-UHFFFAOYSA-N (5-benzyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC=1N=C(C=2C=CC=CC=2)NC=1CC1=CC=CC=C1 ZMAMKNPVAMKIIC-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Chemical class C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- ZSQNWXGSUBTAJV-UHFFFAOYSA-N C(=O)(NC)NC.C(=O)(NC)NC.C1(=CC=CC=C1)C Chemical compound C(=O)(NC)NC.C(=O)(NC)NC.C1(=CC=CC=C1)C ZSQNWXGSUBTAJV-UHFFFAOYSA-N 0.000 description 1
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- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64878796A | 1996-05-16 | 1996-05-16 | |
| US08/648,787 | 1996-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2254883A1 true CA2254883A1 (en) | 1997-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002254883A Abandoned CA2254883A1 (en) | 1996-05-16 | 1996-11-12 | Adhesive compositions and methods of use |
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| Country | Link |
|---|---|
| EP (1) | EP0898603B1 (enExample) |
| JP (1) | JP4154513B2 (enExample) |
| AU (1) | AU711287B2 (enExample) |
| CA (1) | CA2254883A1 (enExample) |
| DE (1) | DE69635929D1 (enExample) |
| WO (1) | WO1997043352A1 (enExample) |
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| DE19852720A1 (de) * | 1998-11-16 | 2000-05-18 | Fischer Artur Werke Gmbh | Zweikomponentenmasse für chemische Befestigungen |
| JP4516632B2 (ja) * | 1999-04-20 | 2010-08-04 | 日東電工株式会社 | アクリル系感圧性接着剤組成物とその接着シ―ト類 |
| JP2001081438A (ja) * | 1999-09-14 | 2001-03-27 | Sony Chem Corp | 接続材料 |
| JP4607270B2 (ja) * | 1999-11-24 | 2011-01-05 | 日東電工株式会社 | 熱硬化型接着剤とその接着シ―ト類 |
| US6867539B1 (en) | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
| JP2002129127A (ja) * | 2000-10-20 | 2002-05-09 | Shin Etsu Polymer Co Ltd | 絶縁性接着剤、異方導電接着剤、ヒートシールコネクタ、及びヒートシールコネクタの製造方法 |
| US6936131B2 (en) | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| JP5111711B2 (ja) * | 2002-01-31 | 2013-01-09 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
| US6919504B2 (en) | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
| US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
| EP2044163B1 (en) * | 2006-07-24 | 2012-04-25 | 3M Innovative Properties Company | Electrically conductive pressure sensitive adhesives |
| JP2007284676A (ja) * | 2007-04-02 | 2007-11-01 | Hitachi Chem Co Ltd | 電極接続用接着剤 |
| US9207373B2 (en) | 2007-04-10 | 2015-12-08 | Stoncor Group, Inc. | Methods for fabrication and highway marking usage of agglomerated retroreflective beads |
| WO2009044732A1 (ja) * | 2007-10-05 | 2009-04-09 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
| JP2010121007A (ja) * | 2008-11-18 | 2010-06-03 | Sumitomo Electric Ind Ltd | 異方導電性フィルム |
| JP5728804B2 (ja) * | 2009-10-07 | 2015-06-03 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
| US20110132537A1 (en) * | 2009-12-03 | 2011-06-09 | 3M Innovative Properties Company | Composition, tape, and use thereof |
| EP2644677B1 (en) * | 2010-11-23 | 2020-11-04 | LG Chem, Ltd. | Adhesive composition |
| US9056438B2 (en) | 2012-05-02 | 2015-06-16 | 3M Innovative Properties Company | Curable composition, articles comprising the curable composition, and method of making the same |
| US9346992B2 (en) * | 2013-07-31 | 2016-05-24 | E I Du Pont De Nemours And Company | Thermally conductive dielectric for thermoformable circuits |
| KR20150069593A (ko) * | 2013-12-13 | 2015-06-24 | (주)엘지하우시스 | 접착력이 향상된 단열재용 접착제 조성물 |
| RU2561201C1 (ru) * | 2014-01-20 | 2015-08-27 | Открытое акционерное общество "Композит" (ОАО "Композит") | Композиция для теплопроводного клеевого состава |
| JP6355954B2 (ja) * | 2014-04-07 | 2018-07-11 | デクセリアルズ株式会社 | 接着フィルム及びその製造方法 |
| WO2017134282A1 (en) * | 2016-02-05 | 2017-08-10 | Technische Universität München | Joining of components by means of energetically activated reactive particles |
| CN109153757B (zh) | 2016-05-19 | 2021-02-12 | 三菱化学株式会社 | 大分子单体共聚物以及其制造方法 |
| EP3753091A4 (en) * | 2018-03-20 | 2021-11-24 | Johnson Electric International AG | ROTOR ASSEMBLY FOR DIRECT CURRENT MOTOR |
| CN110591583A (zh) * | 2019-09-20 | 2019-12-20 | 上海精珅新材料有限公司 | 一种uv增粘后可高温降粘的制程用的过程膜生产方法及其产品 |
| JP7446095B2 (ja) * | 2019-12-03 | 2024-03-08 | デクセリアルズ株式会社 | フィルム巻装体及び接続体の製造方法 |
| CN112300712A (zh) * | 2020-11-18 | 2021-02-02 | 江苏皇冠新材料科技有限公司 | 紫外光固化胶黏剂及紫外光固化保护膜 |
| WO2022172448A1 (ja) * | 2021-02-15 | 2022-08-18 | Dic株式会社 | 二液硬化型接着剤、積層フィルム、積層フィルム製造装置、積層フィルムの製造方法 |
| US20220259460A1 (en) * | 2021-02-15 | 2022-08-18 | Dic Corporation | Two-component curing adhesive, laminated film, laminated film-manufacturing apparatus, and method for manufacturing laminated film |
| WO2022181564A1 (ja) * | 2021-02-24 | 2022-09-01 | 東亞合成株式会社 | ゴムと金属用の二液型接着剤及びこれを用いた接着方法 |
| TWM621431U (zh) * | 2021-07-26 | 2021-12-21 | 英豪科技股份有限公司 | 柔性扁平電纜 |
| CN114231186B (zh) * | 2021-12-15 | 2023-04-18 | 武汉市科达云石护理材料有限公司 | 一种快速固化改性干挂胶及其制备方法与应用 |
| CN114539954B (zh) * | 2022-03-31 | 2023-09-12 | 四川中久国峰科技有限公司 | 可丝网印刷的丙烯酸酯类压敏胶黏剂、制备方法及应用 |
| TWM633612U (zh) * | 2022-04-29 | 2022-11-01 | 英豪科技股份有限公司 | 柔性扁平電纜 |
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| JPS4825050A (enExample) * | 1971-08-02 | 1973-04-02 | ||
| US4535012A (en) * | 1983-09-30 | 1985-08-13 | Electro Materials Corp. Of America | Fast curing solderable conductor |
| DE3565993D1 (en) * | 1984-04-29 | 1988-12-08 | Nitto Electric Ind Co | Method of adhering metal alloy to metal sheet with resin composition |
| JPH0715087B2 (ja) * | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| CA2009566A1 (en) * | 1989-03-09 | 1990-09-09 | Shinobu Sato | Epoxy-acrylate blend pressure-sensitive thermosetting adhesives |
| US5283007A (en) * | 1992-04-28 | 1994-02-01 | E. I. Du Pont De Nemours And Company | Conductive polymer compositions |
| WO1992020073A2 (en) * | 1991-05-01 | 1992-11-12 | E.I. Du Pont De Nemours And Company | Conductive polymer compositions |
| JP3408301B2 (ja) * | 1993-12-16 | 2003-05-19 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
-
1996
- 1996-11-12 DE DE69635929T patent/DE69635929D1/de not_active Expired - Lifetime
- 1996-11-12 CA CA002254883A patent/CA2254883A1/en not_active Abandoned
- 1996-11-12 JP JP54083797A patent/JP4154513B2/ja not_active Expired - Fee Related
- 1996-11-12 EP EP96940461A patent/EP0898603B1/en not_active Expired - Lifetime
- 1996-11-12 WO PCT/US1996/018311 patent/WO1997043352A1/en not_active Ceased
- 1996-11-12 AU AU77340/96A patent/AU711287B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP0898603A1 (en) | 1999-03-03 |
| AU711287B2 (en) | 1999-10-07 |
| DE69635929D1 (de) | 2006-05-11 |
| WO1997043352A1 (en) | 1997-11-20 |
| AU7734096A (en) | 1997-12-05 |
| JP2000509425A (ja) | 2000-07-25 |
| EP0898603B1 (en) | 2006-03-15 |
| JP4154513B2 (ja) | 2008-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |