JP2000508838A - 複合回路ボードの製造において組み立てラインでの剥離およびたわみを防止する方法および回路ボード・パネル - Google Patents

複合回路ボードの製造において組み立てラインでの剥離およびたわみを防止する方法および回路ボード・パネル

Info

Publication number
JP2000508838A
JP2000508838A JP10531973A JP53197398A JP2000508838A JP 2000508838 A JP2000508838 A JP 2000508838A JP 10531973 A JP10531973 A JP 10531973A JP 53197398 A JP53197398 A JP 53197398A JP 2000508838 A JP2000508838 A JP 2000508838A
Authority
JP
Japan
Prior art keywords
circuit board
channel
gouge
panel
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10531973A
Other languages
English (en)
Japanese (ja)
Inventor
フ，カイ・エックス
ディラード，ドン
モラル，レオナルド・ディー
イエ，チャオ―ピン
ドウ，クシンユ
ヤット，カール・ダブリュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JP2000508838A publication Critical patent/JP2000508838A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP10531973A 1997-01-29 1997-12-19 複合回路ボードの製造において組み立てラインでの剥離およびたわみを防止する方法および回路ボード・パネル Pending JP2000508838A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US79018997A 1997-01-29 1997-01-29
US08/790,189 1997-01-29
PCT/US1997/023550 WO1998033364A1 (en) 1997-01-29 1997-12-19 Method and circuit board for preventing delamination and sagging

Publications (1)

Publication Number Publication Date
JP2000508838A true JP2000508838A (ja) 2000-07-11

Family

ID=25149896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10531973A Pending JP2000508838A (ja) 1997-01-29 1997-12-19 複合回路ボードの製造において組み立てラインでの剥離およびたわみを防止する方法および回路ボード・パネル

Country Status (5)

Country Link
JP (1) JP2000508838A (zh)
CN (1) CN1212820A (zh)
FR (1) FR2762959B1 (zh)
TW (1) TW388193B (zh)
WO (1) WO1998033364A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19906209C2 (de) * 1999-02-15 2003-03-20 Possehl Electronic Gmbh Verfahren zum Heraustrennen einzelner Schaltkreis-Einheiten aus einem Panel
US7232957B2 (en) * 2003-09-25 2007-06-19 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and method of manufacturing the same
JP4896250B2 (ja) * 2010-05-19 2012-03-14 日本発條株式会社 金属ベース回路基板の連鎖品形成方法及び金属ベース回路基板の連鎖品
CN102537877A (zh) * 2010-12-16 2012-07-04 海洋王照明科技股份有限公司 一种led基板及包括该led基板的照明装置
CN103152990B (zh) * 2013-03-25 2016-03-23 乐健科技（珠海）有限公司 用于led安装的陶瓷基印刷电路板的制备方法
CN106163143A (zh) * 2016-07-13 2016-11-23 博罗县精汇电子科技有限公司 一种多层软硬结合板外层盲切的工艺
CN112580294B (zh) * 2020-12-30 2023-12-19 芯和半导体科技（上海）股份有限公司 一种pcb版图的切割方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1536471A (en) * 1976-01-02 1978-12-20 Standard Telephones Cables Ltd Printed circuits
JPS5440170U (zh) * 1977-08-24 1979-03-16
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
US4343084A (en) * 1980-02-08 1982-08-10 Rca Corporation Method for making printed circuit boards with connector terminals
FR2503977A1 (fr) * 1981-04-10 1982-10-15 Radiotechnique Compelec Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support
JPS61112345A (ja) * 1984-11-07 1986-05-30 Toshiba Corp 半導体装置の製造方法
US4604161A (en) * 1985-05-02 1986-08-05 Xerox Corporation Method of fabricating image sensor arrays
JPH0256987A (ja) * 1988-02-23 1990-02-26 Mitsubishi Electric Corp 混成集積回路の実装方法
JPH02119198A (ja) * 1988-10-28 1990-05-07 Tanaka Kikinzoku Kogyo Kk プリント基板の外形加工方法
JPH02197190A (ja) * 1989-01-26 1990-08-03 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
JP2791710B2 (ja) * 1990-06-22 1998-08-27 日本シイエムケイ株式会社 プリント配線板の製造方法
JPH0745916A (ja) * 1993-07-28 1995-02-14 Fuji Electric Co Ltd プリント配線基板

Also Published As

Publication number Publication date
FR2762959B1 (fr) 2001-03-30
TW388193B (en) 2000-04-21
CN1212820A (zh) 1999-03-31
WO1998033364A1 (en) 1998-07-30
FR2762959A1 (fr) 1998-11-06

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