JP2000507174A5 - - Google Patents

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Publication number
JP2000507174A5
JP2000507174A5 JP1997534255A JP53425597A JP2000507174A5 JP 2000507174 A5 JP2000507174 A5 JP 2000507174A5 JP 1997534255 A JP1997534255 A JP 1997534255A JP 53425597 A JP53425597 A JP 53425597A JP 2000507174 A5 JP2000507174 A5 JP 2000507174A5
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JP
Japan
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JP1997534255A
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English (en)
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JP3863188B2 (ja
JP2000507174A (ja
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Priority claimed from PCT/JP1997/001042 external-priority patent/WO1997035720A1/en
Publication of JP2000507174A publication Critical patent/JP2000507174A/ja
Publication of JP2000507174A5 publication Critical patent/JP2000507174A5/ja
Application granted granted Critical
Publication of JP3863188B2 publication Critical patent/JP3863188B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Figure 2000507174
Figure 2000507174
Figure 2000507174
Figure 2000507174
JP53425597A 1996-03-28 1997-03-27 基板の貼り合わせ方法 Expired - Fee Related JP3863188B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP7353696 1996-03-28
JP8/73536 1996-03-28
JP8924396 1996-04-11
JP8/89243 1996-04-11
PCT/JP1997/001042 WO1997035720A1 (en) 1996-03-28 1997-03-27 Method and apparatus for laminating boards

Publications (3)

Publication Number Publication Date
JP2000507174A JP2000507174A (ja) 2000-06-13
JP2000507174A5 true JP2000507174A5 (ja) 2004-12-02
JP3863188B2 JP3863188B2 (ja) 2006-12-27

Family

ID=26414682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53425597A Expired - Fee Related JP3863188B2 (ja) 1996-03-28 1997-03-27 基板の貼り合わせ方法

Country Status (6)

Country Link
US (1) US6231705B1 (ja)
JP (1) JP3863188B2 (ja)
CN (1) CN1088008C (ja)
AU (1) AU706524B2 (ja)
TW (1) TW428170B (ja)
WO (1) WO1997035720A1 (ja)

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EP1164004A3 (en) * 1997-11-12 2005-01-26 STEAG HamaTech, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
ES2195420T3 (es) * 1997-11-12 2003-12-01 Steag Hamatech Inc Sistema y metodo para entregar una resina entnre sustratos de un disco de almacenamiento unido.
US6106657A (en) * 1998-05-19 2000-08-22 First Light Technology, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
EP0970157B1 (en) * 1997-11-26 2004-06-23 Koninklijke Philips Electronics N.V. Method and device for bonding two plate-shaped objects
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TW543034B (en) 1998-08-05 2003-07-21 Matsushita Electric Ind Co Ltd Production process and apparatus of optical disk and production process of substrate
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DE69904015T2 (de) 1999-02-23 2003-10-09 Otb Group B.V., Eindhoven Ein Verfahren zur Herstellung einer Scheibe und eine so hergestellte Scheibe
WO2000057414A1 (fr) 1999-03-23 2000-09-28 Dainippon Ink And Chemicals, Inc. Dispositif de production de disque optique
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EP1256948A3 (en) * 2001-05-11 2006-05-24 Dainippon Ink And Chemicals, Inc. Method for maintaining flatness, flatness maintaining unit and device, and disc manufacturing method and device
AU2002305596A1 (en) 2001-05-14 2002-11-25 Aprilis, Inc. Method and apparatus for producing optical recording media with accurately parallel surfaces
US20040134603A1 (en) * 2002-07-18 2004-07-15 Hideo Kobayashi Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus
JP2005174375A (ja) * 2003-12-05 2005-06-30 Kitano Engineering Co Ltd 光ディスクの貼合わせ方法及び光ディスクの貼合わせ装置
US7829152B2 (en) * 2006-10-05 2010-11-09 Lam Research Corporation Electroless plating method and apparatus
CN100565682C (zh) * 2004-11-04 2009-12-02 4M技术控股有限公司 倾斜操纵装置及方法
DE102005005925B4 (de) * 2005-02-09 2009-01-15 Steag Hamatech Ag Verfahren und Vorrichtung zum Zusammenfügen von Substratscheiben eines optischen Datenträgers
JP4042778B2 (ja) * 2005-09-29 2008-02-06 ダイキン工業株式会社 冷凍装置のケーシング構造およびそのケーシングのシーリング方法
TWI307505B (en) * 2006-03-08 2009-03-11 Ind Tech Res Inst Apparatus for fabricating coverlayer of optical information storage media and operating method of the same
CN102625943B (zh) * 2009-09-04 2014-10-29 迪睿合电子材料有限公司 填充装置
TWI533942B (zh) 2009-09-04 2016-05-21 Dexerials Corp Filling device
US9080081B2 (en) * 2009-10-13 2015-07-14 Dexerials Corporation Method for manufacturing display device, and transparent resin filler
JP2011222087A (ja) * 2010-04-09 2011-11-04 Mitsubishi Kagaku Media Co Ltd 光記録媒体の製造方法及びその製造装置
US8512491B2 (en) * 2010-12-21 2013-08-20 Tessera, Inc. Dual wafer spin coating
JP5486704B1 (ja) * 2013-01-30 2014-05-07 オリジン電気株式会社 部材貼り合わせ装置
CN104411789B (zh) * 2013-01-30 2016-11-09 欧利生电气株式会社 构件粘贴装置
JP6247995B2 (ja) * 2014-04-22 2017-12-13 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
DE102014017149A1 (de) * 2014-11-17 2016-05-19 Kienle + Spiess Gmbh Verfahren zur Herstellung von Lamellenpaketen und Anlage zur Durchführung des Verfahrens
US10638847B2 (en) * 2016-03-11 2020-05-05 Innotec Motion GmbH Footrest chassis for attachment to a seating furniture chassis
CN105711018B (zh) * 2016-04-14 2017-10-27 保定华翼风电叶片研究开发有限公司 一种环氧树脂浇注体平板制备方法及装置

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