JP2000345392A - 銅めっき方法およびその装置 - Google Patents

銅めっき方法およびその装置

Info

Publication number
JP2000345392A
JP2000345392A JP2000016089A JP2000016089A JP2000345392A JP 2000345392 A JP2000345392 A JP 2000345392A JP 2000016089 A JP2000016089 A JP 2000016089A JP 2000016089 A JP2000016089 A JP 2000016089A JP 2000345392 A JP2000345392 A JP 2000345392A
Authority
JP
Japan
Prior art keywords
plating
substrate
copper
solution
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000016089A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000345392A5 (enExample
Inventor
Koji Mishima
浩二 三島
Mizuki Nagai
瑞樹 長井
Ryoichi Kimizuka
亮一 君塚
Tetsuro Matsuda
哲朗 松田
Hisafumi Kaneko
尚史 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP2000016089A priority Critical patent/JP2000345392A/ja
Publication of JP2000345392A publication Critical patent/JP2000345392A/ja
Publication of JP2000345392A5 publication Critical patent/JP2000345392A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2000016089A 1999-01-26 2000-01-25 銅めっき方法およびその装置 Pending JP2000345392A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000016089A JP2000345392A (ja) 1999-01-26 2000-01-25 銅めっき方法およびその装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP1720899 1999-01-26
JP11-17208 1999-04-01
JP11-94943 1999-04-01
JP9494399 1999-04-01
JP2000016089A JP2000345392A (ja) 1999-01-26 2000-01-25 銅めっき方法およびその装置

Publications (2)

Publication Number Publication Date
JP2000345392A true JP2000345392A (ja) 2000-12-12
JP2000345392A5 JP2000345392A5 (enExample) 2004-12-09

Family

ID=27281722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000016089A Pending JP2000345392A (ja) 1999-01-26 2000-01-25 銅めっき方法およびその装置

Country Status (1)

Country Link
JP (1) JP2000345392A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316866A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 半導体装置の製造方法および製造装置
JP2002256484A (ja) * 2001-03-05 2002-09-11 Ishihara Chem Co Ltd ボイドフリー銅メッキ方法
JP2009030167A (ja) * 2007-07-02 2009-02-12 Ebara Corp 基板処理方法及び基板処理装置
JP2018111863A (ja) * 2017-01-12 2018-07-19 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316866A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 半導体装置の製造方法および製造装置
JP2002256484A (ja) * 2001-03-05 2002-09-11 Ishihara Chem Co Ltd ボイドフリー銅メッキ方法
JP2009030167A (ja) * 2007-07-02 2009-02-12 Ebara Corp 基板処理方法及び基板処理装置
JP2018111863A (ja) * 2017-01-12 2018-07-19 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法

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