JP2000264761A - セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 - Google Patents
セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法Info
- Publication number
- JP2000264761A JP2000264761A JP7051099A JP7051099A JP2000264761A JP 2000264761 A JP2000264761 A JP 2000264761A JP 7051099 A JP7051099 A JP 7051099A JP 7051099 A JP7051099 A JP 7051099A JP 2000264761 A JP2000264761 A JP 2000264761A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- fine particles
- ceramic substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 238000007747 plating Methods 0.000 title claims abstract description 50
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 239000010419 fine particle Substances 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000005751 Copper oxide Substances 0.000 claims abstract description 27
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 27
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 238000007772 electroless plating Methods 0.000 claims abstract description 22
- 238000010304 firing Methods 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 239000012298 atmosphere Substances 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims description 55
- 230000002776 aggregation Effects 0.000 claims description 9
- 239000011368 organic material Substances 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 5
- 238000005054 agglomeration Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 8
- 238000007788 roughening Methods 0.000 abstract description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- 238000001704 evaporation Methods 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 230000001235 sensitizing effect Effects 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 abstract 1
- 239000000463 material Substances 0.000 description 32
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- -1 carbitol Chemical compound 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920000571 Nylon 11 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 101150003085 Pdcl gene Proteins 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- XQZYPMVTSDWCCE-UHFFFAOYSA-N phthalonitrile Chemical compound N#CC1=CC=CC=C1C#N XQZYPMVTSDWCCE-UHFFFAOYSA-N 0.000 description 1
- 229920006391 phthalonitrile polymer Polymers 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051099A JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051099A JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000264761A true JP2000264761A (ja) | 2000-09-26 |
| JP2000264761A5 JP2000264761A5 (https=) | 2005-02-24 |
Family
ID=13433612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7051099A Pending JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000264761A (https=) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006035556A1 (ja) * | 2004-09-27 | 2006-04-06 | Murata Manufacturing Co., Ltd. | 無電解めっき方法、およびめっき皮膜が形成された非導電性被めっき物 |
| US7932947B2 (en) | 2001-04-27 | 2011-04-26 | Honda Giken Kogyo Kabushiki Kaisha | Output-compensating device and method of an image sensor |
| WO2013073277A1 (ja) * | 2011-11-14 | 2013-05-23 | 石原薬品株式会社 | 無電解銅メッキ用前処理液、及び無電解銅メッキ方法 |
| WO2013097728A1 (en) | 2011-12-27 | 2013-07-04 | Shenzhen Byd Auto R & D Company Limited | Method of metalizing surface and article obtainable |
| CN104105818A (zh) * | 2012-02-08 | 2014-10-15 | 石原化学株式会社 | 用于化学镀镍或化学镀镍合金的预处理液、以及镀膜方法 |
| KR20150059117A (ko) * | 2013-11-21 | 2015-05-29 | 도쿄엘렉트론가부시키가이샤 | 도금의 전처리 방법 및 기억 매체 |
| JP2022067838A (ja) * | 2020-10-21 | 2022-05-09 | 旭化成株式会社 | 導電性パターン付構造体の製造方法 |
-
1999
- 1999-03-16 JP JP7051099A patent/JP2000264761A/ja active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7932947B2 (en) | 2001-04-27 | 2011-04-26 | Honda Giken Kogyo Kabushiki Kaisha | Output-compensating device and method of an image sensor |
| KR100760254B1 (ko) * | 2004-09-27 | 2007-09-19 | 가부시키가이샤 무라타 세이사쿠쇼 | 무전해 도금방법, 및 도금피막이 형성된 비도전성 피도금물 |
| CN100480423C (zh) * | 2004-09-27 | 2009-04-22 | 株式会社村田制作所 | 无电镀方法和形成镀膜的非导电性被镀物 |
| WO2006035556A1 (ja) * | 2004-09-27 | 2006-04-06 | Murata Manufacturing Co., Ltd. | 無電解めっき方法、およびめっき皮膜が形成された非導電性被めっき物 |
| CN103781938B (zh) * | 2011-11-14 | 2016-07-06 | 石原化学株式会社 | 化学镀铜用预处理液及化学镀铜方法 |
| WO2013073277A1 (ja) * | 2011-11-14 | 2013-05-23 | 石原薬品株式会社 | 無電解銅メッキ用前処理液、及び無電解銅メッキ方法 |
| JP2013127110A (ja) * | 2011-11-14 | 2013-06-27 | Ishihara Chem Co Ltd | 無電解銅メッキ方法及び当該銅メッキ用の前処理液 |
| CN103781938A (zh) * | 2011-11-14 | 2014-05-07 | 石原化学株式会社 | 化学镀铜用预处理液及化学镀铜方法 |
| WO2013097728A1 (en) | 2011-12-27 | 2013-07-04 | Shenzhen Byd Auto R & D Company Limited | Method of metalizing surface and article obtainable |
| JP2015507698A (ja) * | 2011-12-27 | 2015-03-12 | シェンゼェン ビーワイディー オート アールアンドディー カンパニーリミテッド | 表面にメッキする方法及び得ることが可能な物品 |
| EP2798097B1 (en) * | 2011-12-27 | 2018-08-08 | Shenzhen BYD Auto R&D Company Limited | Method of metallizing a surface of an insulation substrate |
| US9512522B2 (en) | 2011-12-27 | 2016-12-06 | Shenzhen Byd Auto R&D Company Limited | Method of metalizing surface and article obtainable |
| CN104105818A (zh) * | 2012-02-08 | 2014-10-15 | 石原化学株式会社 | 用于化学镀镍或化学镀镍合金的预处理液、以及镀膜方法 |
| CN104105818B (zh) * | 2012-02-08 | 2016-05-25 | 石原化学株式会社 | 用于化学镀镍或化学镀镍合金的预处理液、以及镀膜方法 |
| JP2015101737A (ja) * | 2013-11-21 | 2015-06-04 | 東京エレクトロン株式会社 | めっきの前処理方法および記憶媒体 |
| US9653350B2 (en) | 2013-11-21 | 2017-05-16 | Tokyo Electron Limited | Pre-treatment method for plating and storage medium |
| KR20150059117A (ko) * | 2013-11-21 | 2015-05-29 | 도쿄엘렉트론가부시키가이샤 | 도금의 전처리 방법 및 기억 매체 |
| KR102384772B1 (ko) * | 2013-11-21 | 2022-04-08 | 도쿄엘렉트론가부시키가이샤 | 도금의 전처리 방법, 무전해 도금 방법 및 기억 매체 |
| JP2022067838A (ja) * | 2020-10-21 | 2022-05-09 | 旭化成株式会社 | 導電性パターン付構造体の製造方法 |
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