JP2000264761A5 - - Google Patents
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- Publication number
- JP2000264761A5 JP2000264761A5 JP1999070510A JP7051099A JP2000264761A5 JP 2000264761 A5 JP2000264761 A5 JP 2000264761A5 JP 1999070510 A JP1999070510 A JP 1999070510A JP 7051099 A JP7051099 A JP 7051099A JP 2000264761 A5 JP2000264761 A5 JP 2000264761A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- film
- vacuum
- fine particles
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051099A JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051099A JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000264761A JP2000264761A (ja) | 2000-09-26 |
| JP2000264761A5 true JP2000264761A5 (https=) | 2005-02-24 |
Family
ID=13433612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7051099A Pending JP2000264761A (ja) | 1999-03-16 | 1999-03-16 | セラミックス基材メッキ用表面処理剤および該処理剤を用いたメッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000264761A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002091736A1 (en) | 2001-04-27 | 2002-11-14 | Honda Giken Kogyo Kabushiki Kaisha | Output correction unit of image sensor |
| CN100480423C (zh) * | 2004-09-27 | 2009-04-22 | 株式会社村田制作所 | 无电镀方法和形成镀膜的非导电性被镀物 |
| TWI546409B (zh) * | 2011-11-14 | 2016-08-21 | Ishihara Chemical Co Ltd | Electroless copper plating solution and electroless copper plating method |
| CN103184440B (zh) * | 2011-12-27 | 2015-12-02 | 比亚迪股份有限公司 | 一种表面选择性金属化的制品及其制备方法 |
| JP6047711B2 (ja) * | 2012-02-08 | 2016-12-21 | 石原ケミカル株式会社 | 無電解ニッケル及びニッケル合金メッキ方法、並びに当該メッキ用の前処理液 |
| JP6177670B2 (ja) * | 2013-11-21 | 2017-08-09 | 東京エレクトロン株式会社 | めっきの前処理方法、無電解めっき方法および記憶媒体 |
| JP2022067838A (ja) * | 2020-10-21 | 2022-05-09 | 旭化成株式会社 | 導電性パターン付構造体の製造方法 |
-
1999
- 1999-03-16 JP JP7051099A patent/JP2000264761A/ja active Pending
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