JP2000228581A5 - - Google Patents
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- Publication number
- JP2000228581A5 JP2000228581A5 JP1999343710A JP34371099A JP2000228581A5 JP 2000228581 A5 JP2000228581 A5 JP 2000228581A5 JP 1999343710 A JP1999343710 A JP 1999343710A JP 34371099 A JP34371099 A JP 34371099A JP 2000228581 A5 JP2000228581 A5 JP 2000228581A5
- Authority
- JP
- Japan
- Prior art keywords
- base film
- resin composition
- support base
- film
- composition layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 description 10
- 239000002313 adhesive film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34371099A JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34241398 | 1998-12-02 | ||
| JP10-342413 | 1998-12-02 | ||
| JP34371099A JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005367788A Division JP2006173638A (ja) | 1998-12-02 | 2005-12-21 | 接着フィルムの真空積層法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000228581A JP2000228581A (ja) | 2000-08-15 |
| JP2000228581A5 true JP2000228581A5 (https=) | 2006-02-16 |
| JP3861537B2 JP3861537B2 (ja) | 2006-12-20 |
Family
ID=26577256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34371099A Expired - Lifetime JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3861537B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030056819A (ko) * | 2001-12-28 | 2003-07-04 | 삼성전기주식회사 | 필름형태의 절연재를 적층하는 방법 |
| KR100514610B1 (ko) * | 2002-06-24 | 2005-09-13 | 삼신써키트 주식회사 | 양면 노출형 연성 인쇄 회로기판 제조 방법 |
| JP4577613B2 (ja) * | 2005-06-22 | 2010-11-10 | 株式会社名機製作所 | ビルドアップ基板を積層成形するための積層成形装置および積層成形方法 |
| KR101530868B1 (ko) | 2007-09-11 | 2015-06-23 | 아지노모토 가부시키가이샤 | 다층 프린트 배선판의 제조 방법 |
| TWI535355B (zh) * | 2007-09-14 | 2016-05-21 | Ajinomoto Kk | Manufacturing method of multilayer printed circuit board |
-
1999
- 1999-12-02 JP JP34371099A patent/JP3861537B2/ja not_active Expired - Lifetime
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