JP2000174165A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JP2000174165A
JP2000174165A JP10349109A JP34910998A JP2000174165A JP 2000174165 A JP2000174165 A JP 2000174165A JP 10349109 A JP10349109 A JP 10349109A JP 34910998 A JP34910998 A JP 34910998A JP 2000174165 A JP2000174165 A JP 2000174165A
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
semiconductor element
manufacturing
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10349109A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000174165A5 (https=
Inventor
Tsukasa Shiraishi
司 白石
Yoshihiro Bessho
芳宏 別所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10349109A priority Critical patent/JP2000174165A/ja
Publication of JP2000174165A publication Critical patent/JP2000174165A/ja
Publication of JP2000174165A5 publication Critical patent/JP2000174165A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP10349109A 1998-12-08 1998-12-08 半導体装置及びその製造方法 Withdrawn JP2000174165A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10349109A JP2000174165A (ja) 1998-12-08 1998-12-08 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10349109A JP2000174165A (ja) 1998-12-08 1998-12-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2000174165A true JP2000174165A (ja) 2000-06-23
JP2000174165A5 JP2000174165A5 (https=) 2005-12-02

Family

ID=18401556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10349109A Withdrawn JP2000174165A (ja) 1998-12-08 1998-12-08 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2000174165A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7268430B2 (en) 2004-08-30 2007-09-11 Renesas Technology Corp. Semiconductor device and process for manufacturing the same
JP2007281269A (ja) * 2006-04-10 2007-10-25 Nec Corp 電子部品の実装構造およびその製造方法
JP7624059B2 (ja) 2021-03-18 2025-01-29 株式会社Fuji 電子部品装着方法、および電子部品装着装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7268430B2 (en) 2004-08-30 2007-09-11 Renesas Technology Corp. Semiconductor device and process for manufacturing the same
US7776735B2 (en) 2004-08-30 2010-08-17 Renesas Technology Corp. Semiconductor device and process for manufacturing the same
JP2007281269A (ja) * 2006-04-10 2007-10-25 Nec Corp 電子部品の実装構造およびその製造方法
JP7624059B2 (ja) 2021-03-18 2025-01-29 株式会社Fuji 電子部品装着方法、および電子部品装着装置

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