JP2000063788A5 - - Google Patents

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Publication number
JP2000063788A5
JP2000063788A5 JP1998229199A JP22919998A JP2000063788A5 JP 2000063788 A5 JP2000063788 A5 JP 2000063788A5 JP 1998229199 A JP1998229199 A JP 1998229199A JP 22919998 A JP22919998 A JP 22919998A JP 2000063788 A5 JP2000063788 A5 JP 2000063788A5
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JP
Japan
Prior art keywords
formula
unit represented
structural unit
structural units
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998229199A
Other languages
English (en)
Japanese (ja)
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JP2000063788A (ja
JP3950560B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP22919998A priority Critical patent/JP3950560B2/ja
Priority claimed from JP22919998A external-priority patent/JP3950560B2/ja
Priority to KR1019990033076A priority patent/KR100360048B1/ko
Priority to US09/373,606 priority patent/US6187874B1/en
Publication of JP2000063788A publication Critical patent/JP2000063788A/ja
Priority to US09/643,743 priority patent/US6329050B1/en
Publication of JP2000063788A5 publication Critical patent/JP2000063788A5/ja
Application granted granted Critical
Publication of JP3950560B2 publication Critical patent/JP3950560B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP22919998A 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ Expired - Fee Related JP3950560B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP22919998A JP3950560B2 (ja) 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ
KR1019990033076A KR100360048B1 (ko) 1998-08-14 1999-08-12 전자부품용 접착제 및 전자부품용 접착 테이프
US09/373,606 US6187874B1 (en) 1998-08-14 1999-08-13 Adhesive for electronic parts and adhesive tape for electronic parts
US09/643,743 US6329050B1 (en) 1998-08-14 2000-08-23 Adhesive for electronic parts and adhesive tape for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22919998A JP3950560B2 (ja) 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ

Publications (3)

Publication Number Publication Date
JP2000063788A JP2000063788A (ja) 2000-02-29
JP2000063788A5 true JP2000063788A5 (https=) 2005-07-21
JP3950560B2 JP3950560B2 (ja) 2007-08-01

Family

ID=16888375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22919998A Expired - Fee Related JP3950560B2 (ja) 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ

Country Status (3)

Country Link
US (2) US6187874B1 (https=)
JP (1) JP3950560B2 (https=)
KR (1) KR100360048B1 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
US6492030B1 (en) * 1999-02-03 2002-12-10 Tomoegawa Paper Co., Ltd. Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same
KR20010046265A (ko) * 1999-11-11 2001-06-15 한형수 전자부품용 폴리이미드 접착제 및 이를 이용한접착테이프의 제조방법
JP2001226656A (ja) * 2000-02-16 2001-08-21 Tomoegawa Paper Co Ltd 半導体製造装置またはエッチング装置用接着剤、該装置用接着シート及びそれらを用いた構造部品
US6645632B2 (en) * 2000-03-15 2003-11-11 Shin-Etsu Chemical Co., Ltd. Film-type adhesive for electronic components, and electronic components bonded therewith
JP4748292B2 (ja) * 2000-03-15 2011-08-17 信越化学工業株式会社 フィルム状電子部品用接着剤及び電子部品
JP2001311055A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd 接着剤組成物
JP2001311053A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd フィルム状接合部材
JP3979792B2 (ja) * 2000-05-25 2007-09-19 株式会社巴川製紙所 静電チャック装置用接着シート及び静電チャック装置
JP2002003795A (ja) * 2000-06-26 2002-01-09 Kanegafuchi Chem Ind Co Ltd 新規接着剤組成物及びそれを用いた接合部材
JP2002080815A (ja) * 2000-09-05 2002-03-22 Kanegafuchi Chem Ind Co Ltd ポリイミド系接着剤溶液およびそれを用いて得られるフィルム状積層部材
KR20020065723A (ko) * 2001-02-07 2002-08-14 (주)새한마이크로닉스 전자부품용 접착제 및 이를 이용한 접착테이프
JPWO2003076515A1 (ja) * 2002-03-08 2005-07-07 株式会社カネカ 熱硬化性樹脂組成物、それを用いてなる積層体および回路基板
WO2003081653A1 (en) 2002-03-27 2003-10-02 Mitsui Chemicals, Inc. Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
US7220490B2 (en) * 2003-12-30 2007-05-22 E. I. Du Pont De Nemours And Company Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
CN1325595C (zh) * 2004-05-11 2007-07-11 日立化成工业株式会社 粘合薄膜、带粘合薄膜的引线框架及使用它们的半导体器件
TWI294904B (en) * 2004-05-11 2008-03-21 Hitachi Chemical Co Ltd Adhesive film, lead frame with adhesive film, and semiconductor device using same
US8399573B2 (en) 2006-11-22 2013-03-19 Sabic Innovative Plastics Ip B.V. Polymer blend compositions
US8268934B2 (en) * 2006-11-22 2012-09-18 Sabic Innovative Plastics Ip B.V. Methods of making polymer blend compositions
US20090099299A1 (en) * 2006-11-22 2009-04-16 Robert Russell Gallucci Polymer blend compositions
US8492474B2 (en) * 2006-11-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Methods of making polymer blend compositions
US20080119616A1 (en) 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
JP4548855B2 (ja) * 2007-09-05 2010-09-22 信越化学工業株式会社 熱硬化性ポリイミドシリコーン樹脂組成物及びその硬化皮膜
WO2012050400A2 (ko) 2010-10-14 2012-04-19 주식회사 엘지화학 용융 가공용 수지 혼합물
JP5738428B2 (ja) * 2011-07-22 2015-06-24 エルジー・ケム・リミテッド 熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板
WO2015107990A1 (ja) * 2014-01-15 2015-07-23 東レ株式会社 接着組成物ならびにそれを有する接着フィルム、接着組成物付き基板、半導体装置およびその製造方法
JP6593649B2 (ja) * 2015-03-31 2019-10-23 荒川化学工業株式会社 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板
KR101953369B1 (ko) * 2015-12-04 2019-02-28 주식회사 엘지화학 중합성 조성물
JP7114983B2 (ja) * 2017-03-29 2022-08-09 荒川化学工業株式会社 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
KR102462940B1 (ko) * 2017-11-03 2022-11-04 삼성전자주식회사 폴리이미드, 폴리이미드 제조용 조성물, 폴리이미드를 포함하는 성형품 및 표시 장치
WO2025173474A1 (ja) * 2024-02-13 2025-08-21 ナミックス株式会社 熱硬化性絶縁フィルムおよび多層絶縁シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252703A (en) * 1990-06-01 1993-10-12 Ube Industries, Ltd. Polyimidosiloxane resin and composition thereof and method of applying same
JP2952868B2 (ja) * 1990-11-30 1999-09-27 宇部興産株式会社 耐熱性の接着剤
JP2998858B2 (ja) * 1990-11-30 2000-01-17 宇部興産株式会社 耐熱性樹脂接着剤
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
JP3689518B2 (ja) * 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物

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