JP2000049272A5 - - Google Patents

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Publication number
JP2000049272A5
JP2000049272A5 JP1998216837A JP21683798A JP2000049272A5 JP 2000049272 A5 JP2000049272 A5 JP 2000049272A5 JP 1998216837 A JP1998216837 A JP 1998216837A JP 21683798 A JP21683798 A JP 21683798A JP 2000049272 A5 JP2000049272 A5 JP 2000049272A5
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JP
Japan
Prior art keywords
semiconductor chip
die pad
lead
leads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998216837A
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English (en)
Japanese (ja)
Other versions
JP3716101B2 (ja
JP2000049272A (ja
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Publication date
Application filed filed Critical
Priority to JP21683798A priority Critical patent/JP3716101B2/ja
Priority claimed from JP21683798A external-priority patent/JP3716101B2/ja
Publication of JP2000049272A publication Critical patent/JP2000049272A/ja
Publication of JP2000049272A5 publication Critical patent/JP2000049272A5/ja
Application granted granted Critical
Publication of JP3716101B2 publication Critical patent/JP3716101B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP21683798A 1998-07-31 1998-07-31 リードフレーム及びそれを用いた半導体装置の製造方法並びに半導体装置 Expired - Fee Related JP3716101B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21683798A JP3716101B2 (ja) 1998-07-31 1998-07-31 リードフレーム及びそれを用いた半導体装置の製造方法並びに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21683798A JP3716101B2 (ja) 1998-07-31 1998-07-31 リードフレーム及びそれを用いた半導体装置の製造方法並びに半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005085161A Division JP2005223352A (ja) 2005-03-24 2005-03-24 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000049272A JP2000049272A (ja) 2000-02-18
JP2000049272A5 true JP2000049272A5 (enExample) 2005-02-10
JP3716101B2 JP3716101B2 (ja) 2005-11-16

Family

ID=16694688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21683798A Expired - Fee Related JP3716101B2 (ja) 1998-07-31 1998-07-31 リードフレーム及びそれを用いた半導体装置の製造方法並びに半導体装置

Country Status (1)

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JP (1) JP3716101B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
US6856075B1 (en) * 2001-06-22 2005-02-15 Hutchinson Technology Incorporated Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension
JP4055158B2 (ja) 2003-05-28 2008-03-05 ヤマハ株式会社 リードフレーム及びリードフレームを備えた半導体装置
JP2005286355A (ja) * 2005-06-23 2005-10-13 Renesas Technology Corp 半導体装置
JP2010109234A (ja) * 2008-10-31 2010-05-13 Renesas Technology Corp 半導体装置

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