JP1725480S - - Google Patents

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Publication number
JP1725480S
JP1725480S JP2022000079F JP2022000079F JP1725480S JP 1725480 S JP1725480 S JP 1725480S JP 2022000079 F JP2022000079 F JP 2022000079F JP 2022000079 F JP2022000079 F JP 2022000079F JP 1725480 S JP1725480 S JP 1725480S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022000079F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022000079F priority Critical patent/JP1725480S/ja
Priority to US29/845,090 priority patent/USD1054389S1/en
Application granted granted Critical
Publication of JP1725480S publication Critical patent/JP1725480S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022000079F 2022-01-05 2022-01-05 Active JP1725480S (show.php)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022000079F JP1725480S (show.php) 2022-01-05 2022-01-05
US29/845,090 USD1054389S1 (en) 2022-01-05 2022-07-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022000079F JP1725480S (show.php) 2022-01-05 2022-01-05

Publications (1)

Publication Number Publication Date
JP1725480S true JP1725480S (show.php) 2022-09-22

Family

ID=83318672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022000079F Active JP1725480S (show.php) 2022-01-05 2022-01-05

Country Status (2)

Country Link
US (1) USD1054389S1 (show.php)
JP (1) JP1725480S (show.php)

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
JP2663928B2 (ja) * 1995-08-30 1997-10-15 日本電気株式会社 Ｔａｂテープ及びｔａｂテープを用いた半導体装置
JP3053010B2 (ja) * 1997-11-21 2000-06-19 日本電気株式会社 半導体装置
JP3214441B2 (ja) * 1998-04-10 2001-10-02 日本電気株式会社 半導体装置及びその製造方法
TWD101154S1 (zh) * 2002-07-10 2004-11-01 松下電器產業股份有限公司 資訊記憶用半導體元件
USD566060S1 (en) * 2005-04-13 2008-04-08 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD534133S1 (en) * 2005-04-18 2006-12-26 Murata Manufacturing Co., Ltd. Semiconductor module
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD540273S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD534134S1 (en) * 2005-11-02 2006-12-26 Supernova Optoelectronics Corp. Electrode layer
USD533847S1 (en) * 2005-11-02 2006-12-19 Supernova Optoelectronics Corp. Electrode layer
USD532756S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
USD534506S1 (en) * 2005-11-02 2007-01-02 Supernova Optoelectronics Corp. Electrode layer
USD532757S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
WO2008084841A1 (ja) * 2007-01-11 2008-07-17 Nec Corporation 半導体装置
JP5280024B2 (ja) * 2007-08-28 2013-09-04 ルネサスエレクトロニクス株式会社 半導体装置
WO2009048097A1 (ja) * 2007-10-10 2009-04-16 Nec Corporation 半導体装置
US8012868B1 (en) * 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US8217500B1 (en) * 2010-05-07 2012-07-10 Altera Corporation Semiconductor device package
US8796839B1 (en) * 2011-01-07 2014-08-05 Marvell International Ltd. Semiconductor package including a power plane and a ground plane
JP1581768S (show.php) * 2016-08-02 2017-07-24
JP1580899S (show.php) * 2016-11-15 2017-07-10
JP1577511S (show.php) * 2016-11-15 2017-05-29
JP1664282S (show.php) * 2019-07-24 2020-07-27
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
JP1686546S (show.php) * 2020-05-13 2021-05-31
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board
JP1696315S (ja) * 2021-03-23 2021-10-04 電力用半導体素子
TWI777756B (zh) * 2021-09-01 2022-09-11 豪傑長宏科技有限公司 用於半導體晶片封裝的複合式金屬蓋板
US12176222B2 (en) * 2021-11-29 2024-12-24 Infineon Technologies Ag Semiconductor package with metal posts from structured leadframe

Also Published As

Publication number Publication date
USD1054389S1 (en) 2024-12-17

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