JP1686546S - - Google Patents

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Publication number
JP1686546S
JP1686546S JPD2020-23667F JP2020023667F JP1686546S JP 1686546 S JP1686546 S JP 1686546S JP 2020023667 F JP2020023667 F JP 2020023667F JP 1686546 S JP1686546 S JP 1686546S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JPD2020-23667F
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Japanese (ja)
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JPD2020-23667F 2020-05-13 2020-11-02 Active JP1686546S (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202030216324 2020-05-13

Publications (1)

Publication Number Publication Date
JP1686546S true JP1686546S (show.php) 2021-05-31

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ID=76084296

Family Applications (1)

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JPD2020-23667F Active JP1686546S (show.php) 2020-05-13 2020-11-02

Country Status (2)

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US (1) USD986840S1 (show.php)
JP (1) JP1686546S (show.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1011204S1 (en) * 2019-12-03 2024-01-16 Jelly Drops Ltd. Packaging for foodstuffs
USD1016017S1 (en) * 2021-05-13 2024-02-27 Mississippi State University Electrical enclosure with magnetic cable spooling management
JP1725479S (show.php) * 2022-01-05 2022-09-22
JP1725480S (show.php) * 2022-01-05 2022-09-22

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USD345963S (en) * 1991-10-30 1994-04-12 Sanyo Electric Co., Ltd. Hybrid integrated circuit
JP2814966B2 (ja) * 1995-09-29 1998-10-27 日本電気株式会社 半導体装置
JP3201353B2 (ja) * 1998-08-04 2001-08-20 日本電気株式会社 半導体装置とその製造方法
USD455751S1 (en) * 2001-08-14 2002-04-16 Intec, Inc. Electronic memory card
TWI261045B (en) * 2002-12-30 2006-09-01 Ind Tech Res Inst Composite nanofibers and their fabrications
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JP3879853B2 (ja) * 2003-10-10 2007-02-14 セイコーエプソン株式会社 半導体装置、回路基板及び電子機器
TWD110202S1 (zh) * 2004-10-14 2006-04-11 東芝照明技術股份有限公司 照明用發光體
TWD113251S1 (zh) * 2005-02-28 2006-10-01 東芝照明技術股份有限公司 照明用發光二極體燈
KR20070019475A (ko) * 2005-08-12 2007-02-15 삼성전자주식회사 인쇄회로보드, 및 이를 이용한 반도체 패키지 및 멀티스택반도체 패키지
TWI339914B (en) * 2006-12-29 2011-04-01 Ind Tech Res Inst Active layer utilized in solar cell and fabrication method thereof
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TWI354529B (en) * 2007-11-23 2011-12-11 Ind Tech Res Inst Metal thermal interface material and thermal modul
JP5543086B2 (ja) * 2008-06-25 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP5168160B2 (ja) * 2009-01-15 2013-03-21 ソニー株式会社 半導体装置及び半導体装置の製造方法
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TWI737065B (zh) * 2019-12-05 2021-08-21 財團法人工業技術研究院 隔音構件

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USD986840S1 (en) 2023-05-23

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