JP1603358S - - Google Patents

Info

Publication number
JP1603358S
JP1603358S JPD2017-23166F JP2017023166F JP1603358S JP 1603358 S JP1603358 S JP 1603358S JP 2017023166 F JP2017023166 F JP 2017023166F JP 1603358 S JP1603358 S JP 1603358S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-23166F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-23166F priority Critical patent/JP1603358S/ja
Priority to US29/644,404 priority patent/USD853343S1/en
Application granted granted Critical
Publication of JP1603358S publication Critical patent/JP1603358S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-23166F 2017-10-19 2017-10-19 Active JP1603358S (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2017-23166F JP1603358S (zh) 2017-10-19 2017-10-19
US29/644,404 USD853343S1 (en) 2017-10-19 2018-04-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-23166F JP1603358S (zh) 2017-10-19 2017-10-19

Publications (1)

Publication Number Publication Date
JP1603358S true JP1603358S (zh) 2018-05-07

Family

ID=62066953

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-23166F Active JP1603358S (zh) 2017-10-19 2017-10-19

Country Status (2)

Country Link
US (1) USD853343S1 (zh)
JP (1) JP1603358S (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1593817S (zh) * 2017-03-28 2017-12-25
USD937231S1 (en) 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1682283S (zh) * 2020-07-31 2021-03-29
JP1680788S (zh) * 2020-07-31 2021-03-08
JP1725616S (ja) * 2022-02-25 2022-09-26 半導体モジュール

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357901S (en) * 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
KR100218368B1 (ko) * 1997-04-18 1999-09-01 구본준 리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
JP2000208690A (ja) * 1999-01-12 2000-07-28 Sony Corp リ―ドフレ―ム、樹脂封止型半導体装置およびその製造方法
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
KR100355794B1 (ko) * 1999-10-15 2002-10-19 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD473199S1 (en) * 2001-11-30 2003-04-15 Kabushiki Kaisha Toshiba Portion of semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
JP4294405B2 (ja) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ 半導体装置
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
JP1577511S (zh) * 2016-11-15 2017-05-29
JP1580899S (zh) * 2016-11-15 2017-07-10

Also Published As

Publication number Publication date
USD853343S1 (en) 2019-07-09

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