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1969-07-14 |
1971-08-31 |
Pulse Eng Inc |
Delay line
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US3762039A
(en)
*
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1971-09-10 |
1973-10-02 |
Mos Technology Inc |
Plastic encapsulation of microcircuits
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USD259782S
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*
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1978-07-28 |
1981-07-07 |
Hitachi, Ltd. |
Semiconductor
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USD259560S
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*
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1978-07-28 |
1981-06-16 |
Hitachi, Ltd. |
Semiconductor
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USD260091S
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*
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1978-08-25 |
1981-08-04 |
Hitachi, Ltd. |
Semiconductor
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1978-08-25 |
1981-07-07 |
Hitachi, Ltd. |
Semiconductor
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JPS60239043A
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1984-05-14 |
1985-11-27 |
Oki Electric Ind Co Ltd |
半導体装置用パツケ−ジの製造方法
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USD345731S
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1992-12-03 |
1994-04-05 |
Motorola, Inc. |
Semiconductor package
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1993-08-31 |
1996-09-17 |
Sgs-Thomson Microelectronics, Inc. |
Surface mountable integrated circuit package with detachable module
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1993-09-02 |
1995-06-06 |
Sgs-Thomson Microelectronics, Inc. |
Socketed integrated circuit package
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USD358806S
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1993-09-24 |
1995-05-30 |
Sgs-Thomson Microelectronics, Inc. |
Socketed integrated circuit package
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USD357901S
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1993-09-27 |
1995-05-02 |
Telefonaktiebolaget Lm Ericsson |
Power supply unit
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USD394244S
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1995-11-27 |
1998-05-12 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
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1996-06-28 |
1998-08-25 |
Kabushiki Kaisha Gotoh Seisakusho |
Plastic molded semiconductor package with thermal dissipation means
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1996-09-09 |
1998-07-21 |
Fuji Electric Co., Ltd. |
Integrated circuit device
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1996-09-09 |
1998-07-21 |
Fuji Electric Co., Ltd. |
Integrated circuit device
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1996-09-09 |
1998-07-21 |
Fuji Electric Co., Ltd. |
Integrated circuit device
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1996-10-17 |
1998-08-11 |
Matsushita Electronics Corporation |
Semiconductor device
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KR100218368B1
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1997-04-18 |
1999-09-01 |
구본준 |
리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법
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1998-11-19 |
2000-03-07 |
Honda Tsushin Kogyo Co., Ltd. |
Connector receptacle for IC card
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1999-01-12 |
2000-07-28 |
Sony Corp |
リ―ドフレ―ム、樹脂封止型半導体装置およびその製造方法
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USD427977S
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1999-06-18 |
2000-07-11 |
Fujikura Ltd. |
Piezoelectric conversion type semiconductor device
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KR100355794B1
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1999-10-15 |
2002-10-19 |
앰코 테크놀로지 코리아 주식회사 |
리드프레임 및 이를 이용한 반도체패키지
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USD432097S
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1999-11-20 |
2000-10-17 |
Samsung Electronics Co., Ltd. |
Semiconductor package
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2000-09-12 |
2001-10-02 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
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USD466485S1
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2001-05-23 |
2002-12-03 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package
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2001-10-31 |
2002-12-10 |
Siliconix Incorporated |
Semiconductor chip package
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2001-10-31 |
2003-04-01 |
Siliconix Incorporated |
Semiconductor chip package
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2001-11-30 |
2003-04-15 |
Kabushiki Kaisha Toshiba |
Portion of semiconductor device
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2001-11-30 |
2003-10-07 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2002-03-29 |
2003-07-08 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2003-07-28 |
2004-05-04 |
Semiconductor Components Industries, L.L.C. |
Packaged semiconductor device
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2003-07-31 |
2009-07-15 |
株式会社ルネサステクノロジ |
半導体装置
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2004-08-11 |
2005-10-18 |
Semiconductor Components Industries Llc |
Semiconductor device package
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2004-08-11 |
2005-05-10 |
Semiconductor Components Industries, Llc |
Semiconductor device package
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2006-04-17 |
2007-08-07 |
Kabushiki Kaisha Toshiba |
Semiconductor
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2006-04-17 |
2007-08-07 |
Kabushiki Kaisha Toshiba |
Semiconductor
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2006-08-22 |
2007-04-03 |
Kabushiki Kaisha Toshiba |
Semiconductor
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2012-09-20 |
2014-12-09 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
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2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
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2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
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2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
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2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
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2013-03-07 |
2015-01-13 |
Vlt, Inc. |
Semiconductor device
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2014-04-02 |
2016-11-22 |
Mitsubishi Electric Corporation |
Power semiconductor device
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2016-09-30 |
2018-08-07 |
Rohm Co., Ltd. |
Semiconductor device
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JP1577511S
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2016-11-15 |
2017-05-29 |
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JP1580899S
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2016-11-15 |
2017-07-10 |
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