JP1586205S - - Google Patents

Info

Publication number
JP1586205S
JP1586205S JPD2017-1320F JP2017001320F JP1586205S JP 1586205 S JP1586205 S JP 1586205S JP 2017001320 F JP2017001320 F JP 2017001320F JP 1586205 S JP1586205 S JP 1586205S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-1320F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-1320F priority Critical patent/JP1586205S/ja
Priority to US29/610,501 priority patent/USD822629S1/en
Application granted granted Critical
Publication of JP1586205S publication Critical patent/JP1586205S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-1320F 2017-01-26 2017-01-26 Active JP1586205S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2017-1320F JP1586205S (enrdf_load_stackoverflow) 2017-01-26 2017-01-26
US29/610,501 USD822629S1 (en) 2017-01-26 2017-07-13 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-1320F JP1586205S (enrdf_load_stackoverflow) 2017-01-26 2017-01-26

Publications (1)

Publication Number Publication Date
JP1586205S true JP1586205S (enrdf_load_stackoverflow) 2017-09-19

Family

ID=59852673

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-1320F Active JP1586205S (enrdf_load_stackoverflow) 2017-01-26 2017-01-26

Country Status (2)

Country Link
US (1) USD822629S1 (enrdf_load_stackoverflow)
JP (1) JP1586205S (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1592769S (enrdf_load_stackoverflow) * 2017-05-02 2017-12-11
JP1664527S (enrdf_load_stackoverflow) 2019-10-28 2020-07-27
JP1664528S (enrdf_load_stackoverflow) * 2019-10-28 2020-07-27
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber

Family Cites Families (38)

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USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD461171S1 (en) * 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) * 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) * 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
TWD101174S1 (zh) * 2002-03-11 2004-11-01 東芝股份有限公司 半導體元件(四)
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
TWD101154S1 (zh) * 2002-07-10 2004-11-01 松下電器產業股份有限公司 資訊記憶用半導體元件
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
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JP5791283B2 (ja) 2011-01-28 2015-10-07 京セラ株式会社 電子部品収納用パッケージ、およびそれを備えた電子装置
TWD164807S (zh) * 2013-08-06 2014-12-11 璨圓光電股份有限公司 半導體發光元件之部分
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
JP1563812S (enrdf_load_stackoverflow) * 2016-04-11 2016-11-21

Also Published As

Publication number Publication date
USD822629S1 (en) 2018-07-10

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