ITMI992521A0 - Dispositivo per il trattamento di un substrato nastriforme con gas - Google Patents
Dispositivo per il trattamento di un substrato nastriforme con gasInfo
- Publication number
- ITMI992521A0 ITMI992521A0 IT99MI002521A ITMI992521A ITMI992521A0 IT MI992521 A0 ITMI992521 A0 IT MI992521A0 IT 99MI002521 A IT99MI002521 A IT 99MI002521A IT MI992521 A ITMI992521 A IT MI992521A IT MI992521 A0 ITMI992521 A0 IT MI992521A0
- Authority
- IT
- Italy
- Prior art keywords
- treatment
- gas
- ribbon substrate
- ribbon
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19901088A DE19901088B4 (de) | 1999-01-14 | 1999-01-14 | Vorrichtung zum Behandeln eines bandförmigen Substrates mit einem Gas |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI992521A0 true ITMI992521A0 (it) | 1999-12-02 |
ITMI992521A1 ITMI992521A1 (it) | 2001-06-02 |
IT1314251B1 IT1314251B1 (it) | 2002-12-06 |
Family
ID=7894179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT1999MI002521A IT1314251B1 (it) | 1999-01-14 | 1999-12-02 | Dispositivo per il trattamento di un substrato nastriforme con gas. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6328806B2 (it) |
JP (1) | JP2000226656A (it) |
KR (1) | KR100639935B1 (it) |
DE (1) | DE19901088B4 (it) |
GB (1) | GB2345700B (it) |
IT (1) | IT1314251B1 (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
US7247221B2 (en) * | 2002-05-17 | 2007-07-24 | Applied Films Corporation | System and apparatus for control of sputter deposition process |
US7153180B2 (en) * | 2003-11-13 | 2006-12-26 | Eastman Kodak Company | Continuous manufacture of flat panel light emitting devices |
JP4455937B2 (ja) * | 2004-06-01 | 2010-04-21 | 東北パイオニア株式会社 | 成膜源、真空成膜装置、有機elパネルの製造方法 |
KR100744912B1 (ko) * | 2006-05-26 | 2007-08-01 | 삼성전기주식회사 | 자가조정 기능을 갖는 rc 발진기 |
US20080011225A1 (en) * | 2006-07-11 | 2008-01-17 | Mcclure Donald J | Apparatus and methods for continuously depositing a pattern of material onto a substrate |
CN102016103B (zh) * | 2008-02-15 | 2012-10-24 | 松下电器产业株式会社 | 薄膜形成方法及成膜装置 |
US20120090544A1 (en) * | 2010-10-18 | 2012-04-19 | Kim Mu-Gyeom | Thin film deposition apparatus for continuous deposition, and mask unit and crucible unit included in thin film deposition apparatus |
CN204162778U (zh) * | 2014-10-09 | 2015-02-18 | 香港纺织及成衣研发中心有限公司 | 一种可生成图案的磁控溅射卷绕镀膜机 |
TWI780815B (zh) * | 2021-07-13 | 2022-10-11 | 聚合興企業有限公司 | 複合材料樹脂塊自動供膠系統 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE869661C (de) * | 1944-09-15 | 1953-03-05 | Hydrawerk Ag | Verfahren und Vorrichtung zur Verhinderung der Metallisierung auf Unterlagen mit Hilfe einer Abdeckvorrichtung |
US2590557A (en) * | 1949-11-15 | 1952-03-25 | John E Fast & Co | Metallizing process and apparatus |
US3511212A (en) * | 1968-05-16 | 1970-05-12 | Du Pont | Vapor deposition apparatus including a polyimide containing mask |
US3738315A (en) * | 1969-12-03 | 1973-06-12 | Western Electric Co | Coating apparatus including conveyor-mask |
US3799792A (en) * | 1971-12-14 | 1974-03-26 | Texas Instruments Inc | Vapor deposition method |
US4265932A (en) * | 1979-08-02 | 1981-05-05 | Hughes Aircraft Company | Mobile transparent window apparatus and method for photochemical vapor deposition |
JPS5989765A (ja) * | 1982-11-12 | 1984-05-24 | Hitachi Ltd | 薄膜パタ−ン連続成膜装置 |
JPS59177365A (ja) * | 1983-03-24 | 1984-10-08 | Matsushita Electric Ind Co Ltd | 蒸発方法とその装置 |
US4681780A (en) * | 1983-12-01 | 1987-07-21 | Polaroid Corporation | Continuously cleaned rotary coating mask |
JPS61143577A (ja) * | 1984-12-14 | 1986-07-01 | Konishiroku Photo Ind Co Ltd | 薄膜形成装置 |
JPS61261471A (ja) * | 1985-05-13 | 1986-11-19 | Sumitomo Electric Ind Ltd | 部分被覆方法 |
EP0488535A3 (en) | 1990-11-08 | 1992-09-23 | Bmc Technology Corporation | Method and apparatus for manufacturing electrodes for multilayer ceramic capacitors |
JPH0578818A (ja) * | 1991-09-19 | 1993-03-30 | Hitachi Cable Ltd | 部分被膜の形成方法 |
JPH05295524A (ja) * | 1992-04-23 | 1993-11-09 | Mitsubishi Heavy Ind Ltd | 連続真空蒸着装置 |
DE4310085A1 (de) | 1993-03-27 | 1994-09-29 | Leybold Ag | Verfahren und Vorrichtung zur Erzeugung von Mustern auf Substraten |
DE4311581A1 (de) | 1993-03-27 | 1994-12-08 | Leybold Ag | Verfahren und Vorrichtung zur Erzeugung von Muster auf Substraten |
JP3281703B2 (ja) * | 1994-01-12 | 2002-05-13 | 三菱重工業株式会社 | 真空蒸着装置 |
DE19527604A1 (de) * | 1995-07-28 | 1997-01-30 | Leybold Ag | Verfahren und Vorrichtung zur Herstellung von metallfreien Streifen bei der Metallbedampfung |
JPH09310172A (ja) * | 1996-05-21 | 1997-12-02 | Matsushita Electric Ind Co Ltd | 樹脂薄膜の製造方法及び製造装置及び電子部品 |
-
1999
- 1999-01-14 DE DE19901088A patent/DE19901088B4/de not_active Expired - Fee Related
- 1999-12-02 IT IT1999MI002521A patent/IT1314251B1/it active
- 1999-12-08 KR KR1019990055652A patent/KR100639935B1/ko not_active IP Right Cessation
-
2000
- 2000-01-04 US US09/477,357 patent/US6328806B2/en not_active Expired - Fee Related
- 2000-01-11 JP JP2000002947A patent/JP2000226656A/ja active Pending
- 2000-01-12 GB GB0000660A patent/GB2345700B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20010002583A1 (en) | 2001-06-07 |
KR100639935B1 (ko) | 2006-10-31 |
DE19901088B4 (de) | 2008-11-27 |
JP2000226656A (ja) | 2000-08-15 |
IT1314251B1 (it) | 2002-12-06 |
ITMI992521A1 (it) | 2001-06-02 |
GB0000660D0 (en) | 2000-03-01 |
KR20000052432A (ko) | 2000-08-25 |
GB2345700B (en) | 2003-07-09 |
DE19901088A1 (de) | 2000-07-20 |
US6328806B2 (en) | 2001-12-11 |
GB2345700A (en) | 2000-07-19 |
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