AU2003283248A8 - Extremely thin substrate support - Google Patents

Extremely thin substrate support

Info

Publication number
AU2003283248A8
AU2003283248A8 AU2003283248A AU2003283248A AU2003283248A8 AU 2003283248 A8 AU2003283248 A8 AU 2003283248A8 AU 2003283248 A AU2003283248 A AU 2003283248A AU 2003283248 A AU2003283248 A AU 2003283248A AU 2003283248 A8 AU2003283248 A8 AU 2003283248A8
Authority
AU
Australia
Prior art keywords
substrate support
extremely thin
thin substrate
extremely
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003283248A
Other versions
AU2003283248A1 (en
Inventor
Clemens Ottermann
Silke Knoche
Thomas Zetterer
Claudia Booss
Gerd Rudas
Frank Voges
Steffen Astheimer
Frank Bohm
Gerhard Weber
Andreas Habeck
Hauke Esemann
Armin Plichta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE20215401U external-priority patent/DE20215401U1/en
Priority claimed from DE10330430A external-priority patent/DE10330430A1/en
Application filed by Schott AG filed Critical Schott AG
Publication of AU2003283248A8 publication Critical patent/AU2003283248A8/en
Publication of AU2003283248A1 publication Critical patent/AU2003283248A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
AU2003283248A 2002-10-07 2003-09-18 Extremely thin substrate support Abandoned AU2003283248A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
DE20215401U DE20215401U1 (en) 2002-10-07 2002-10-07 Composite of a thin substrate and a carrier substrate with releasable connecting means
DE20215401.7 2002-10-07
DE10323301.6 2003-05-21
DE10323302.4 2003-05-21
DE10323304.0 2003-05-21
DE10323301A DE10323301A1 (en) 2002-10-07 2003-05-21 Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate by electrostatic force, useful e.g. in display industry, in polymer electronics, photovoltaic industry, sensors and biotechnology
DE10323303A DE10323303A1 (en) 2002-10-07 2003-05-21 Composite comprises thin substrate (e.g. glass) having less than 0.3 mm thickness releasably bound to carrier substrate through bonding material, useful in e.g. display industry, polymer electronics, in sensors, biotechnology and medicine
DE10323303.2 2003-05-21
DE10323304A DE10323304A1 (en) 2002-10-07 2003-05-21 Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate through adhesive force, useful e.g. in display industry, in polymer electronics, photovoltaic industry, sensors and biotechnology
DE10323302A DE10323302A1 (en) 2002-10-07 2003-05-21 Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate having fine structuring with open, infinitesimal cavities, useful in e.g. display industry, polymer electronics, and biotechnology
DE10330430.4 2003-07-04
DE10330430A DE10330430A1 (en) 2003-07-04 2003-07-04 Composite used e.g. in displays and in the production of optoelectronic components comprises an extremely thin substrate connected to a support substrate by a connecting material
PCT/EP2003/010358 WO2004032593A2 (en) 2002-10-07 2003-09-18 Extremely thin substrate support

Publications (2)

Publication Number Publication Date
AU2003283248A8 true AU2003283248A8 (en) 2004-05-04
AU2003283248A1 AU2003283248A1 (en) 2004-05-04

Family

ID=32097164

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003283248A Abandoned AU2003283248A1 (en) 2002-10-07 2003-09-18 Extremely thin substrate support

Country Status (2)

Country Link
AU (1) AU2003283248A1 (en)
WO (1) WO2004032593A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004018249B3 (en) * 2004-04-15 2006-03-16 Infineon Technologies Ag Method for processing a workpiece on a workpiece carrier
CN101031521A (en) * 2004-09-27 2007-09-05 肖特股份公司 Method for producing a vitroceramic composite shaped body and a composite shaped body
US9847243B2 (en) 2009-08-27 2017-12-19 Corning Incorporated Debonding a glass substrate from carrier using ultrasonic wave
EP2360720A1 (en) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Device for positioning at least two objects, assemblies in particular multi-layer body assemblies, assembly for processing, in particular selenization, of objects, method for positioning at least two objects
EP2360721A1 (en) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Device for positioning at least two objects, assemblies in particular multi-layer body assemblies, assembly for processing, in particular selenization, of objects, method for positioning at least two objects
WO2013120779A1 (en) * 2012-02-16 2013-08-22 Saint-Gobain Glass France Process box, arrangements and methods for processing coated substrates
JP6314136B2 (en) * 2012-07-02 2018-04-18 コーニング インコーポレイテッド Method for processing glass substrate and glass fixture
DE102014224588B4 (en) 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Method for producing a plate-shaped metallized ceramic substrate, carrier for producing the substrate and use of the carrier
CN105486631A (en) * 2015-12-22 2016-04-13 三棵树涂料股份有限公司 Primer adhesion testing method
JP6714562B2 (en) * 2017-09-20 2020-06-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing apparatus, semiconductor device manufacturing method and program
KR102249027B1 (en) * 2019-11-01 2021-05-07 위아코퍼레이션 주식회사 Wafer boat plate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097641A (en) * 1983-11-02 1985-05-31 Hitachi Ltd Method for obtainment of pellet from wafer
IT209910Z2 (en) * 1987-02-06 1988-11-04 Sgs Microelettronica Spa WAFER HOLDER OR SLICE HURRY, USED FOR THE VACUUM STORAGE AND / OR SHIPMENT OF THE SAME.
JPH01289135A (en) * 1988-05-16 1989-11-21 Hitachi Ltd Open type wafer carrier jig
US5169453A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
JPH08222622A (en) * 1995-02-10 1996-08-30 Hitachi Electron Eng Co Ltd Wafer carrier
JPH0940112A (en) * 1995-07-26 1997-02-10 Metsukusu:Kk Thin substrate transporting device
JPH10203584A (en) * 1997-01-22 1998-08-04 Nec Corp Cassette for substrate
KR100284567B1 (en) * 1997-04-15 2001-04-02 후지이 아키히로 Vertical wafer boat
DE19755694C2 (en) * 1997-12-16 2000-05-31 Sez Semiconduct Equip Zubehoer Handling device for thin, disc-shaped objects

Also Published As

Publication number Publication date
WO2004032593A2 (en) 2004-04-22
WO2004032593A3 (en) 2004-09-30
AU2003283248A1 (en) 2004-05-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase