AU2003225893A1 - Support clip - Google Patents

Support clip

Info

Publication number
AU2003225893A1
AU2003225893A1 AU2003225893A AU2003225893A AU2003225893A1 AU 2003225893 A1 AU2003225893 A1 AU 2003225893A1 AU 2003225893 A AU2003225893 A AU 2003225893A AU 2003225893 A AU2003225893 A AU 2003225893A AU 2003225893 A1 AU2003225893 A1 AU 2003225893A1
Authority
AU
Australia
Prior art keywords
support clip
clip
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003225893A
Other versions
AU2003225893A8 (en
Inventor
Francis Edward Fisher
Terence Edward Lovett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0206681A external-priority patent/GB0206681D0/en
Priority claimed from GB0212083A external-priority patent/GB0212083D0/en
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Publication of AU2003225893A8 publication Critical patent/AU2003225893A8/en
Publication of AU2003225893A1 publication Critical patent/AU2003225893A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44641—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member
    • Y10T24/44744—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member with position locking-means for engaging faces
    • Y10T24/44752—Integral locking-means

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connection Of Plates (AREA)
AU2003225893A 2002-03-21 2003-03-20 Support clip Abandoned AU2003225893A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0206681A GB0206681D0 (en) 2002-03-21 2002-03-21 Support clip
GB0206681.9 2002-03-21
GB0212083A GB0212083D0 (en) 2002-05-25 2002-05-25 Support clip
GB0212083.0 2002-05-25
PCT/US2003/008533 WO2003081641A2 (en) 2002-03-21 2003-03-20 Support clip

Publications (2)

Publication Number Publication Date
AU2003225893A8 AU2003225893A8 (en) 2003-10-08
AU2003225893A1 true AU2003225893A1 (en) 2003-10-08

Family

ID=28456022

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003225893A Abandoned AU2003225893A1 (en) 2002-03-21 2003-03-20 Support clip

Country Status (5)

Country Link
US (1) US20050160568A1 (en)
EP (1) EP1495487A2 (en)
AU (1) AU2003225893A1 (en)
TW (1) TW200304767A (en)
WO (1) WO2003081641A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM243893U (en) * 2002-12-20 2004-09-11 Hon Hai Prec Ind Co Ltd Heat sink clip
ITMI20130520A1 (en) * 2013-04-05 2014-10-06 St Microelectronics Srl CONSTRUCTION OF A HEAT SINK THROUGH WELDING

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183030A (en) * 1963-05-24 1965-05-11 Schlueter Ernest Fastening clip
SE401653B (en) * 1972-06-21 1978-05-22 Springfix Befestigungstechnik MOUNTING CLAMP FOR MOLDINGS WITH T-SHAPE ROCK
DE2915460B2 (en) * 1978-04-25 1981-01-15 Extrados Co. Ltd., Toronto, Ontario (Kanada) palette
US4509839A (en) * 1983-06-16 1985-04-09 Imc Magnetics Corp. Heat dissipator for semiconductor devices
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
US5594624A (en) * 1994-04-05 1997-01-14 Thermalloy, Inc. Strap spring for heat sink clip assembly
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
WO1997014184A1 (en) * 1995-10-13 1997-04-17 Thermalloy, Inc. Solderable transistor clip and heat sink
US5947191A (en) * 1997-05-07 1999-09-07 International Business Machines Electronics module heat sink with quick mounting pins
US5876084A (en) * 1997-07-15 1999-03-02 Prince Corporation Panel mounting clip
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
US6160704A (en) * 1998-12-17 2000-12-12 Intelligent Motion Systems Integral heat-sink and motor assembly for printed circuit boards
US6252773B1 (en) * 1999-04-23 2001-06-26 Lucent Technologies, Inc Heat sink attachment apparatus and method
US6301113B1 (en) * 1999-05-07 2001-10-09 Psc Computer Products, Inc. Retainer clip for heat sink for electronic components
US6125037A (en) * 1999-08-30 2000-09-26 Sun Microsystems, Inc. Self-locking heat sink assembly and method
US6222734B1 (en) * 1999-11-29 2001-04-24 Intel Corporation Clamping heat sinks to circuit boards over processors
TW468940U (en) * 2000-04-14 2001-12-11 Foxconn Prec Components Co Ltd Joggles of thermal dissipative device**941
TW491488U (en) * 2000-07-28 2002-06-11 Foxconn Prec Components Co Ltd Heat sink buckle device
US6513205B1 (en) * 2000-09-15 2003-02-04 Acme United Corporation Multi-product holding and retaining system
US6430049B1 (en) * 2000-12-22 2002-08-06 Foxconn Precision Components Co., Ltd. Clip for heat sink
US20030061688A1 (en) * 2001-09-28 2003-04-03 Rodriguez Maria Del Carmen Ergonomic binder clip

Also Published As

Publication number Publication date
AU2003225893A8 (en) 2003-10-08
TW200304767A (en) 2003-10-01
WO2003081641A2 (en) 2003-10-02
EP1495487A2 (en) 2005-01-12
US20050160568A1 (en) 2005-07-28
WO2003081641B1 (en) 2004-09-23
WO2003081641A3 (en) 2004-07-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase