200304767 (1) 玖、發明說明 【發明所屬之技術領域】 本發明相關於一種適合用來將一組件例如電子裝置或 散熱座支撐及固定於一安裝表面例如印刷電路板的一表面 的夾具。 【先前技術】 設備製造中的主要成本歸因於組裝。如果可有用來附 著組件的可靠機構，並且如果可利用自動化程序，則在這 方面的成本可減至最小。要在組裝程序中被附著的組件的 本質可能限制可用的附著機構。諸如形狀及重量的因數必 須被考慮，但是在電子技術領域中，也必須考慮相對於其 他組件的鄰近程度，以及經組裝的部分的後續處理，其可 能涉及在經組裝的製品在組裝線上的運輸期間的移動。許 多組件必須準確地及選擇性地被安裝於特別的位置，並且 被支撐成爲被可靠地扣持於所選定的位置，不論在經組裝 的製品的後續處理期間的運動或陡震影響如何。一特定的 例子爲附著於印刷電路板的組件。典型的附著形式包括用 來插入預備的安裝凹部的可軟焊懸垂片，以及可與軟焊接 觸緊固結合的干涉配合。在可用的附著點數目有限的情況 中’此種封裝的質量可能會在將封裝固定於其在電路板上 的操作位置的錯綜複雜的軟焊步驟期間產生難以可靠地支 撐封裝的問題。相對而言龐大的組件例如散熱座可能必須 被安裝成爲在散熱座與一些其他組件或印刷電路板的表面 -6 - (2) (2)200304767 之間有一間隙。以在可靠的自動化組裝程序中一致地達成 所要求的間隙的方式來呈現散熱座或可被散熱座附著的封 裝的能力可能具有挑戰性。 目前製造散熱座的方便方式的一例爲藉著擠製。擠製 的散熱座組件的安裝準備包括附著可被插入位於印刷電路 板上想要的位置的所預備的凹部內的鍍錫黃銅針腳（插座 安裝）’並且附著是藉著軟焊於印刷電路板而完成，例如 藉著波（w’ave )軟焊或軟熔（reflQW )軟焊。 β 被通稱爲散熱座的熱散逸組件是由金屬例如鋁，銅， 或具有良好的熱傳導性的金屬合金例如銅與鎢的合金形成 的被動（passive)裝置。美國專利第4,509,839號及第 5，9 9 1，1 5 4號中敘述熱散逸組件的例子，其中後者也揭示 固定於散熱座的一支撐底座。但是，本發明不受限於上述 前案中所述的特別組件。 此種散熱座及其被設計來保護的電子裝置一般是使用 含有鉛/錫合金的軟焊劑被軟焊。 · 美國專利第5,844,312號（Hi 11 s haw等人）揭示可被 楔擠至散熱座的凹槽內的單件式沖壓成形夾具。諸如電晶 體的電子裝置夾入被設置在夾具上的一隆起部分內，並且 分叉的足件被接收於印刷電路板的孔中。其他已知的用來 安裝散熱座的夾具被插入設置於擠製組件的孔內的圓針腳 〇 上述類型的支座與各種不同的散熱座及其他組件的組 裝費時且昂貴。另外，難以保證在支撐組合以用於軟焊時 -7- (3) (3)200304767 的穩定性。 【發明內容】 本發明的目的爲增進組件在例如用來製造使用電子裝 置的製品的生產線的組裝線中對一表面的附著。本發明的 另一目的爲提供一種夾具，用來對於小規模製造運轉而言 將一組件手動地附著於一印刷電路板，但是更特別的是對 於大量生產是藉著使用自動化機構。本發明的另一目的爲 提供用來將散熱座可靠地附著於印刷電路板上的操作位置 的機構。本發明的另一目的爲提供使軟焊方法來附著物品 的方法，其在附著處理過程期間對物品提供較佳的穩定性 。本發明的目的也爲提供一種支撐夾具，其較容易在印刷 電路板上形成散熱座與電子裝置的組裝。 根據本發明的第一方面，提供一種用來藉著軟焊技術 而將一組件附著於一支座的夾具，此夾具包含具有可提供 對支座的至少一可軟焊連接部分的至少一周邊部分的一剛 硬固定部分，及延伸離開固定部分且可與要被安裝於支座 的組件合作的一支撐部分。 較佳地，夾具的周邊部分具有沿著固定部分的一邊緣 配置的多個安裝足件，而該邊緣在使用時會面對組件所要 附著的支座的表面。較佳地，足件可插入支座的凹部或孔 隙內。或者，足件可配置成爲配合支座表面，並且藉著軟 焊而被表面安裝。 較佳地，安裝懸垂片包含具有可在插入期間朝向彼此 -8- (4) (4)200304767 被壓縮的二部段的一彈性構件。 此種夾具可由具有充分的撓性及彈性性質的平坦基板 形成，以容許成形，成形後的結構形狀保持，以及在支座 上的壓力或干涉配合。如此，夾具可方便地藉著例如壓製 ，沖壓，切削，衝孔等金屬成形步驟而從一金屬薄片形成 。夾具可由輕質金屬載體薄片形成，其具有由軟焊相容金 屬構成的依區域而定的選擇性塗覆層整體鍍層，例如錫或 其合金，以與工業中通用的軟焊劑相容。夾具可藉著機械 加工例如切削或合適部分的衝孔來提供鍵結機構例如懸垂 片，指件，舌件，倒刺，掣子等而被製備成爲用於與要被 附著於支座的組件進行所設計的壓力或干涉配合。要使用 夾具被安裝的組件可具有可與形成在夾具上的鍵結機構合 作的相應形成的槽溝，凹槽，凹部，缺口，凸耳，或止動 件。 根據本發明的另一方面，一種組合包含要藉著軟焊技 術而被安裝在支座上於操作位置的一組件，及附著於組件 的多個夾具。夾具的至少之一具有可提供對支座的可軟焊 連接部分的一固定部分，及延伸離開固定部分且可藉著干 涉配合而與組件合作的一支撐部分或遠端鍵結機構。夾具 的每一個較佳地具有相同的形式，並且具有成爲例如足件 的形式的至少二可軟焊連接部分，用來將夾具附著於支座 。在要被附著的組件爲擠製製品的情況中，可方便地將夾 具設置在擠製製品的自由端部處，因而經由至少四點來達 成穩定的附著。 -9- (5) (5)200304767 此組合理想地適用於將散熱座附著於印刷電路板。更 複雜的封裝也可以相同的方式被安裝在板件上。藉著選擇 夾具的固定部分的長度及/或支撐部分的附著位置，組件 可根據選擇而與支座（板件）隔開或與其接觸。 根據本發明的另一方面，用來將組件附著於支座的方 法包含提供多個夾具，而夾具的每一個具有有可提供對目 標支座的可軟焊連接部分的周邊部分的一剛硬固定部分， 及連接於且延伸離開剛硬固定部分並且可與要被附著於支 座的組件合作的一支撐部分；提供具有用來藉著干涉配合 而與固定部分合作的機構的組件；將充分數目的夾具裝配 於組件以形成具有被排列以用於被導向支座的具有可軟焊 連接部分的多個插腳（limb );將組合導向支座上的一選 定位置；及將組合軟焊於支座上的位置。 藉著使用夾具，較佳地爲散熱座的一擠製體設置有方 便在小規模製造運轉中手動地或自動地將擠製體定位及附 著於支座的穩定支撑件。此處所述的組件與夾具的組合只 要藉著將夾具的各別部分插入板件中可用的或設置於板件 的槽溝，即可在電路板上於四個或四個以上的點處提供穩 定的支撐及附著。每一夾具的支撐部分的遠端鍵結千涉配 合在裝置的每一端部或角落處提供一支撐點。將組合附著 於例如印刷電路板的表面所需的插入力較小，此促進可靠 的軟焊定位及較佳的製品品質控制。 選擇性地，夾具可提供一升立（s t a n d - 〇 f f )位置來將 組件支撐在電路板上方，以防止裝置與電路板接觸。 -10- (6) (6)200304767 在一較佳形式中，組合包含一擠製散熱座本體，其在 對於本體的想要的支撐位置處例如本體的一端面處設置有 供夾具插入的一鍵槽；與一夾具，具有大致上L形的輪廓 5其具有在其被設計的用途中作用成爲一直立支撐件的一 剛硬插腳，其中插腳在用來固定於目標支座的一邊緣處具 有可軟焊連接部分，及連接於且延伸離開剛硬插腳的遠端 鍵結機構，其中鍵結機構可干涉配合在擠製散熱座本體的 鍵槽中。 春 在此種組合中所用的夾具的一另外較佳形式中，剛硬 插腳的強度是藉著提供形成在插腳的平面之外的側壁而被 增進，例如提供當於截面觀看夾具的插腳時爲「C」，「 U」，垂下的「S」，或「Z」形的輪廓。 在一形式中，支撐部分的鍵結機構包含具有設置有倒 刺的臂件的一分叉部分，因而由於夾具材料的彈性，此部 分可藉著將臂件朝向彼此壓縮而被強制裝配在鍵槽內，在 此之後其可抵抗被撒出。 0 以下參考圖式僅以舉例的方式敘述本發明的實施例。 【實施方式】 參考圖1及2，圖中顯示本發明的第一實施例的支撐 夾具1 〇的一般配置，其中圖2的組件裝置2〇的一端被支 撐在電路板30上。此配置顯示插入電路板30的夾具10 的固定部分40及插入組件（組件裝置）20的支撐部分50 。類似的夾具1 0被設置在組件20的相反端（未顯示）處 -11 - (7) (7)200304767 ’使得裝置在每一端處由一夾具1 0支撐。 參考圖3，夾具的固定部分40包含一主矩形薄片部 段60，其具有分別在主部段60的兩側向下延伸的二足件 °足件70分別插入電路板30的孔內，並且被軟焊以將 夾具固定在電路板上。此主部段60具有形成在足件70之 間的凹部80，其提供用於足件70被插入電路板的間隙。 參考圖4 ( a )至4 ( c )，圖4 ( b )的側視圖淸楚地 顯示夾具1 〇的L形形狀，其中固定部分40比支撐部分 5〇寬。形成在每一足件的端部處的有角度輪廓90提供導 入部分，以容許夾具較快地且較準確地插入孔內。在足件 或夾鉗（grip ) 70的內表面100與凹部80的邊緣會合之 處，曲線狀切口 1 1 0減輕剪應力，並且容許夾具10齊平 地座落在電路板的表面上。相鄰於每一切口 1 1 0，設置有 圓形孔隙1 20，其作用成爲用來在軟焊處理過程中減少熱 傳遞的整體熱斷部分（t h e 1· m a 1 b r e a k )。 參考圖4 ( c )，支撐部分50分支成爲形成隔開的二 臂件，用來干涉配合在經擠製的裝置的槽溝1 30中。每一 臂件具有一遠端部1 40，其具有在臂件被壓在一起而插入 槽溝130時有幫助的推拔狀輪廓142，以及在臂件50的彈 力下嚙合槽溝130的倒刺144。 圖5及6顯示本發明的第二實施例。夾具10藉著折 疊固定部分40而在主部段60的每一側處形成有側壁1 60 ，其大致上垂直於主部段60。這些側壁160具有邊緣162 ，其接觸組件20，以穩定組件相對於夾具1 〇的位置。圖 -12- (8) (8)200304767 7 ( a )至7 ( c )顯示具有從各別側壁1 6 0延伸的足件7 〇 的此種夾具的不同視圖。此幾何形狀也對夾具提供額外的 剛性及穩定性，使得當夾具安裝於電路板30時，足件70 不會輕易地橫向於主部段60的平面彎曲。因此，穩定組 件相對於電路板的位置。 圖8及9顯示圖1及5的實施例，其中固定部分40 的整體長度增加一特別量，使得組件被升高在電路板30 的表面上方，此藉著跨越靈敏或「須遠離（keep-out )」 表面區域而促進及保持PCB (印刷電路板）的完整性。 圖10(a)至10(d)及圖11顯示本發明的另外實施 例。在這些實施例中，在敘述類似或相同特徵時保留圖1 至9中所用的參考數字。 圖10(a)顯示具有固定部分41的支撐夾具11，其 中固定部分41具有由狹縫1 9 1分支而形成具有面向外的 倒刺1 8 1的分開足件1 7 2，1 7 3的夾鉗1 7 1。狹縫結束於位 在夾鉗1 7 1與主部段6 1之間的圓形孔隙1 2 1處。圓形孔 隙1 2 1減輕剪應力，並且容許足件在主部段61的平面之 外變形。圓形孔隙1 2 1也作用成爲在軟焊處理過程中減小 熱傳遞的整體熱斷部分。減輕剪應力的弧形切口 2 1 1被設 置在足件1 7 2，1 7 3與主部段1 6 1之間。 圖1 0 ( b )顯示附著於電路板30的夾鉗。夾鉗1 7 1凸 出通過電路板30的孔221，並且倒刺181嚙合電路板以提 供牢固的穩定握持。用來將夾鉗1 7 1插入孔22 1的力將足 件1 7 2，1 7 3朝向彼此壓縮，造成足件在狹縫1 9 1處重疊 200304767 Ο) ，因而減小夾鉗的整體寬度，並且容許夾鉗被插入孔2 2 1 內。足件172與173的重璺可在圖10(c)中看見。夾甜 的結構類似於鋼筆尖端。在其他實施例中，狹縫可爲較寬 的間隙，並且壓縮力可造成足件被驅策朝向彼此，因而在 足件不重疊下使間隙的寬度變窄。 提供對電路板30的強力附著的夾鉗1 7 1在軟焊期間 很有利，因爲其將支撐夾具11的移動減至最小。另外， 使用單一夾鉗將電路板所需的孔的數目減少爲在一擠製輪 廓的每一端部處有一個。 在圖1 1 ( a )及1 1 ( b )中，顯示附著有擠製散熱座 的圖1 0的實施例的側視圖及後視圖。在此例子中，擠製 散熱座（組件裝置，組件）20與電路板30的表面及固定 部分4 1所形成的側壁1 60的邊緣1 62接觸。 圖1 2 ( a )及1 2 ( b )顯示類似於圖1 1 ( a )及1 1 ( b )的實施例，其中固定機構的整體增加，使得擠製裝置（ 擠製散熱座）20升高在電路板30的上方。 製成夾具本身的材料爲可軟焊薄片材料，典型上爲銅 合金。此薄片被沖壓成形爲上述的形狀。有利地，使用沖 壓成形部分降低每單元的成本。 上述的實施例只是成爲例子，並非意欲限制本發明的 範圍。 【圖式簡單說明】 圖1爲根據本發明的組合的部分側視圖。 -14- 200304767 do) 圖2爲圖1的擠製體的部分端視圖。 圖3爲圖1所示的組合的部分端視圖。 圖4 ( a )至4 ( c )爲圖1的夾具的正視圖，側視圖 ，及平面圖。 圖5爲本發明的另一實施例的部分側視圖。 圖6爲圖5所示的組合的部分端視圖。 圖7 ( a )至7 ( c )爲圖6的另一夾具的正視圖，側 視圖，及平面圖。 Φ 圖8爲具有升立部分的圖1所示的實施例的部分側視 圖。 圖9爲具有升立部分的圖6的實施例的部分側視圖。 圖1 0 ( a )爲夾具的另一實施例的正視圖。 圖10 ( b )爲圖1 0 ( a )的實施例的部分正視圖，其 中夾具被安裝於一電路板。 圖1 0 ( c )爲圖1 〇 ( a )的實施例的側視圖。 圖1 1 ( a )及1 1 ( b )顯示連接於圖1 0 ( a )的夾具的 鲁 一擠製體。 圖1 2 ( a )及1 2 ( b )顯示類似於圖1 1 ( a )及1 1 ( b )但是具有升立部段的夾具的另一實施例。 元件對照表 10 支撐夾具 1 1 支撐夾具 20組件裝置，組件，擠製散熱座，擠製裝置 15- (11) (11)200304767 30電路板 40固定部分 4 1固定部分 50支撐部分 60主矩形薄片部段，主部段 61主部段 70足件，夾鉗 80 凹部 90有角度輪廓 100內表面 1 1 0曲線狀切口 120圓形孔隙 1 2 1圓形孔隙 130槽溝 1 4 0遠端部 142推拔狀輪廓 1 4 4 倒刺 160側壁 162 邊緣 1 7 1夾鉗 1 7 2足件 1 7 3足件 1 8 1面向外的倒刺 1 9 1狹縫 -16- (12)200304767 2 1 1弧形切口 221 孔200304767 (1) Description of the invention [Technical field to which the invention belongs] The present invention relates to a jig suitable for supporting and fixing a component such as an electronic device or a heat sink to a mounting surface such as a surface of a printed circuit board. [Prior Art] The main cost in equipment manufacturing is due to assembly. If reliable mechanisms are available to attach the components, and if automated procedures are available, the costs in this regard can be minimized. The nature of the components to be attached during the assembly process may limit the available attachment mechanisms. Factors such as shape and weight must be considered, but in the field of electronics technology, the proximity to other components must also be considered, as well as the subsequent processing of the assembled parts, which may involve the transportation of the assembled product on the assembly line During the move. Many components must be accurately and selectively installed in a particular location and supported to be securely held in the selected location regardless of the effects of motion or sudden shock during subsequent processing of the assembled article. A specific example is a component attached to a printed circuit board. Typical forms of attachment include solderable overhangs for insertion into prepared mounting recesses, and interference fits that can be tightly combined with soldered contacts. With a limited number of attachment points available ', the quality of such a package may create problems in which it is difficult to reliably support the package during the intricate soldering steps that secure the package to its operating position on the circuit board. Relatively large components such as heat sinks may have to be installed with a gap between the heat sink and some other components or the surface of the printed circuit board-(2) (2) 200304767. The ability to present a heat sink or package that can be attached by a heat sink in a way that consistently achieves the required clearance in a reliable automated assembly process can be challenging. An example of a current convenient way to manufacture a heat sink is by extrusion. Preparation for mounting the extruded heat sink assembly includes attaching a tin-plated brass pin (socket mounting) that can be inserted into a prepared recess at a desired position on the printed circuit board, and attaching it by soldering to the printed circuit Plate, such as by wave soldering (w'ave) or solder reflow (reflQW) soldering. The heat dissipating component, which is generally called a heat sink, is a passive device formed of a metal such as aluminum, copper, or a metal alloy having good thermal conductivity such as an alloy of copper and tungsten. Examples of heat dissipating components are described in U.S. Patent Nos. 4,509,839 and 5,99 91,154, where the latter also discloses a support base fixed to a heat sink. However, the present invention is not limited to the specific components described in the foregoing case. Such heat sinks and electronic devices designed to protect them are generally soldered using a solder containing a lead / tin alloy. · U.S. Patent No. 5,844,312 (Hi 11 s haw et al.) Discloses a one-piece stamped forming jig that can be wedged into a groove in a heat sink. An electronic device such as an electric crystal is clamped into a raised portion provided on a jig, and a bifurcated foot piece is received in a hole of a printed circuit board. Other known fixtures for mounting heat sinks are inserted into round pins provided in the holes of the extruded component. Assembly of the above-mentioned types of bearings with various heat sinks and other components is time consuming and expensive. In addition, it is difficult to ensure the stability of -7- (3) (3) 200304767 when supporting the combination for soldering. SUMMARY OF THE INVENTION An object of the present invention is to improve the adhesion of a component to a surface in an assembly line such as a production line used to manufacture an article using an electronic device. Another object of the present invention is to provide a jig for manually attaching a component to a printed circuit board for a small-scale manufacturing operation, but more particularly for mass production by using an automated mechanism. Another object of the present invention is to provide a mechanism for reliably attaching a heat sink to an operating position on a printed circuit board. Another object of the present invention is to provide a method for attaching an article by a soldering method, which provides better stability to the article during the attaching process. An object of the present invention is also to provide a supporting jig, which is relatively easy to form a heat sink and an electronic device on a printed circuit board. According to a first aspect of the present invention, there is provided a jig for attaching a component to a base by means of soldering technology, the jig including at least one periphery having at least one solderable connection portion capable of providing a support to the base. A rigid fixing part of the part, and a supporting part extending away from the fixing part and cooperating with a component to be mounted on the support. Preferably, the peripheral portion of the clamp has a plurality of mounting feet arranged along an edge of the fixed portion, and the edge faces the surface of the support to which the component is to be attached during use. Preferably, the foot is insertable into a recess or aperture of the support. Alternatively, the foot may be configured to mate with the surface of the support and be surface mounted by soldering. Preferably, the mounting pendant comprises an elastic member having two sections that can be compressed toward each other during insertion. -8- (4) (4) 200304767 Such a clamp can be formed of a flat substrate with sufficient flexibility and elasticity to allow forming, maintaining the shape of the structure after forming, and pressure or interference fit on the support. In this way, the jig can be conveniently formed from a metal sheet by metal forming steps such as pressing, punching, cutting, punching and the like. The jig may be formed of a thin metal carrier sheet having a region-specific selective coating composed of solder-compatible metal, such as tin or an alloy thereof, to be compatible with solders commonly used in the industry. The clamp can be prepared by machining such as cutting or punching of a suitable part to provide a keying mechanism such as a pendant, a finger, a tongue, a barb, a detent, etc. to be used as a component to be attached to the support Perform the designed pressure or interference fit. The component to be mounted using the jig may have a correspondingly formed groove, groove, recess, notch, lug, or stopper that can cooperate with a keying mechanism formed on the jig. According to another aspect of the present invention, a combination includes a component to be mounted on a support in an operating position by soldering technology, and a plurality of clamps attached to the component. At least one of the clamps has a fixed portion that can provide a solderable connection portion to the support, and a support portion or a remote keying mechanism that extends away from the fixed portion and can cooperate with the component by interfering fit. Each of the clamps preferably has the same form, and has at least two solderable connection portions in the form of, for example, a foot piece for attaching the clamp to the support. In the case where the component to be attached is an extruded product, the clamp can be conveniently set at the free end of the extruded product, thereby achieving stable attachment through at least four points. -9- (5) (5) 200304767 This combination is ideal for attaching a heat sink to a printed circuit board. More complex packages can also be mounted on boards in the same way. By selecting the length of the fixed part of the jig and / or the attachment position of the supporting part, the component can be separated from the support (plate) or contacted with it according to the selection. According to another aspect of the present invention, a method for attaching a component to a support includes providing a plurality of clamps, each of which has a rigid portion having a peripheral portion that can provide a solderable connection portion to a target support. A fixed portion, and a supporting portion connected to and extending away from the rigid fixed portion and capable of cooperating with a component to be attached to the support; providing a component having a mechanism for cooperating with the fixed portion by interference fit; it will be sufficient A number of clamps are assembled on the assembly to form a plurality of limbs having solderable connection portions arranged for being guided to the support; guiding the combination to a selected position on the support; and soldering the combination to Position on the stand. By using a clamp, it is preferable to provide a stable support for the extruded body of the heat sink in order to manually and automatically position and attach the extruded body to the support in a small-scale manufacturing operation. The combination of components and fixtures described here can be placed at four or more points on the circuit board by inserting various parts of the fixture into the slots available on the board or provided in the board. Provides stable support and attachment. The distal key of the support portion of each fixture is fitted to provide a support point at each end or corner of the device. The insertion force required to attach the combination to, for example, the surface of a printed circuit board is small, which promotes reliable soldering positioning and better product quality control. Alternatively, the fixture may provide a stand-up (s t a n d-0 f f) position to support the component above the circuit board to prevent the device from contacting the circuit board. -10- (6) (6) 200304767 In a preferred form, the combination includes an extruded heat sink body, which is provided at a desired support position for the body, such as an end face of the body with a Keyway; and a clamp having a generally L-shaped profile 5 which has a rigid pin that acts as an upright support in its intended use, wherein the pin has a rim at an edge for fixing to the target support The solderable connection part and the remote keying mechanism connected to and extending away from the rigid pin, wherein the keying mechanism can interfere and fit in the key groove of the extruded heat sink base. In another preferred form of the clamp used by Chun in this combination, the strength of the rigid pin is enhanced by providing a side wall formed outside the plane of the pin, such as when the pin of the clamp is viewed in section. "C", "U", hanging "S", or "Z" shaped outline. In one form, the key-bonding mechanism of the support portion includes a bifurcated portion having an arm member provided with barbs, so this portion can be force-fitted to the key by compressing the arm members toward each other due to the elasticity of the clamp material Inside the tank, after which it resists being spilled. 0 The embodiments of the present invention are described below by way of example only with reference to the drawings. [Embodiment] Referring to Figs. 1 and 2, there is shown a general configuration of a supporting jig 10 of a first embodiment of the present invention, in which one end of a component device 20 of Fig. 2 is supported on a circuit board 30. This configuration shows the fixed portion 40 of the jig 10 inserted into the circuit board 30 and the support portion 50 of the inserted component (assembly device) 20. Similar fixtures 10 are provided at opposite ends (not shown) of the assembly 20 -11-(7) (7) 200304767 ′ so that the device is supported by a fixture 10 at each end. Referring to FIG. 3, the fixing portion 40 of the clamp includes a main rectangular sheet section 60 having two foot pieces extending downwardly on both sides of the main section 60 respectively. The foot pieces 70 are respectively inserted into the holes of the circuit board 30, It is soldered to secure the fixture to the circuit board. This main section 60 has a recess 80 formed between the foot pieces 70, which provides clearance for the foot pieces 70 to be inserted into the circuit board. Referring to Figs. 4 (a) to 4 (c), the side view of Fig. 4 (b) clearly shows the L-shape of the jig 10, in which the fixing portion 40 is wider than the supporting portion 50. An angled profile 90 formed at the end of each foot piece provides a lead-in portion to allow the clamp to be inserted into the hole faster and more accurately. Where the inner surface 100 of the foot or grip 70 meets the edge of the recess 80, the curvilinear cuts 1 1 0 reduce the shear stress and allow the clamp 10 to sit flush with the surface of the circuit board. Adjacent to each incision 1 10, a circular hole 1 20 is provided, which functions as an integral thermal break portion (t h e 1 · m a 1 b r e a k) for reducing heat transfer during the soldering process. Referring to Fig. 4 (c), the supporting portion 50 is branched to form spaced two-arm pieces for interference fit in the grooves 130 of the extruded device. Each arm member has a distal portion 1 40 having a push-out profile 142 that is helpful when the arm members are pressed together and inserted into the slot 130, and a tip that engages the slot 130 under the elastic force of the arm member 50 Thorn 144. 5 and 6 show a second embodiment of the present invention. The jig 10 forms a side wall 1 60 at each side of the main section 60 by folding the fixing portion 40, which is substantially perpendicular to the main section 60. These side walls 160 have edges 162 that contact the component 20 to stabilize the position of the component relative to the fixture 10. Figures -12- (8) (8) 200304767 7 (a) to 7 (c) show different views of such fixtures with foot pieces 70 extending from respective side walls 160. This geometry also provides additional rigidity and stability to the fixture, so that when the fixture is mounted on the circuit board 30, the foot 70 will not easily bend transversely to the plane of the main section 60. Therefore, stabilize the position of the component relative to the board. Figures 8 and 9 show the embodiment of Figures 1 and 5, in which the overall length of the fixed portion 40 is increased by a special amount, so that the component is raised above the surface of the circuit board 30, by crossing the sensitive or "keep- out) ”surface area to promote and maintain PCB (printed circuit board) integrity. 10 (a) to 10 (d) and Fig. 11 show another embodiment of the present invention. In these embodiments, reference numerals used in FIGS. 1 to 9 are retained when describing similar or identical features. FIG. 10 (a) shows a support jig 11 having a fixing portion 41 having a branching part 1 7 1 branched by a slit 1 9 1 to form a foot part 1 8 1 with outwardly facing barbs 1 7 2, 1 7 3 Clamp 1 7 1. The slit ends at a circular aperture 1 2 1 between the clamp 1 7 1 and the main section 6 1. The circular aperture 1 2 1 reduces the shear stress and allows the foot to deform outside the plane of the main section 61. The circular pores 1 2 1 also function as an integral thermal break portion that reduces heat transfer during the soldering process. An arc-shaped incision 2 1 1 for reducing the shear stress is provided between the foot pieces 1 7 2, 1 7 3 and the main section 16 1. FIG. 10 (b) shows the clamps attached to the circuit board 30. FIG. The clamp 1 7 1 projects through the hole 221 of the circuit board 30, and the barb 181 engages the circuit board to provide a firm and stable grip. The force used to insert the clamp 1 7 1 into the hole 22 1 compresses the foot pieces 1 7 2, 1 7 3 towards each other, causing the foot pieces to overlap at the slit 1 9 1 (200304767 0), thereby reducing the overall size of the clamp. Width and allow the clamp to be inserted into the hole 2 2 1. The weight of the feet 172 and 173 can be seen in Fig. 10 (c). The sweetened structure is similar to the pen tip. In other embodiments, the slit may be a wider gap, and the compressive force may cause the feet to be driven toward each other, thereby narrowing the width of the gap without the feet overlapping. The clamp 171, which provides strong adhesion to the circuit board 30, is advantageous during soldering because it minimizes the movement of the support jig 11. In addition, the use of a single clamp reduces the number of holes required for the circuit board to one at each end of an extruded profile. 11 (a) and 11 (b) show a side view and a rear view of the embodiment of FIG. 10 with an extruded heat sink attached. In this example, the extruded heat sink (component device, component) 20 is in contact with the surface of the circuit board 30 and the edge 1 62 of the side wall 160 formed by the fixed portion 41. Figures 1 2 (a) and 1 2 (b) show an embodiment similar to that of Figures 1 1 (a) and 1 1 (b), in which the whole of the fixing mechanism is increased so that the extrusion device (extrusion heat sink) is 20 liters High above the circuit board 30. The jig itself is made of a solderable sheet material, typically a copper alloy. This sheet is press-formed into the shape described above. Advantageously, the use of a press-formed part reduces the cost per unit. The embodiments described above are examples only and are not intended to limit the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial side view of a combination according to the present invention. -14- 200304767 do) Fig. 2 is a partial end view of the extruded body of Fig. 1. FIG. 3 is a partial end view of the combination shown in FIG. 1. 4 (a) to 4 (c) are a front view, a side view, and a plan view of the jig of FIG. 1. FIG. 5 is a partial side view of another embodiment of the present invention. FIG. 6 is a partial end view of the combination shown in FIG. 5. 7 (a) to 7 (c) are a front view, a side view, and a plan view of another jig of FIG. Φ Fig. 8 is a partial side view of the embodiment shown in Fig. 1 with a raised portion. Fig. 9 is a partial side view of the embodiment of Fig. 6 with a raised portion. FIG. 10 (a) is a front view of another embodiment of the jig. Fig. 10 (b) is a partial front view of the embodiment of Fig. 10 (a), in which the fixture is mounted on a circuit board. FIG. 10 (c) is a side view of the embodiment of FIG. 10 (a). Figures 1 1 (a) and 1 1 (b) show an extruded body connected to the clamp of Figure 10 (a). Figs. 12 (a) and 12 (b) show another embodiment of a jig similar to Figs. 11 (a) and 11 (b) but with a raised section. Component comparison table 10 Support jig 1 1 Support jig 20 component device, component, extruded heat sink, extrusion device 15- (11) (11) 200304767 30 Circuit board 40 fixing part 4 1 fixing part 50 support part 60 main rectangular sheet Section, main section 61, main section 70 feet, clamp 80, recess 90, angled profile 100, inner surface 1 1 0 curvilinear cut 120, circular aperture 1 2 1 circular aperture 130 slot, 1 4 0 distal end 142 Push-out profile 1 4 4 Barb 160 Side wall 162 Edge 1 7 1 Clamp 1 7 2 Foot 1 7 3 Foot 1 8 1 Barb facing outward 1 9 1 Slit-16- (12) 200304767 2 1 1 arc cut 221 holes
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