JP2002100427A - Terminal for connecting wiring board - Google Patents

Terminal for connecting wiring board

Info

Publication number
JP2002100427A
JP2002100427A JP2000290970A JP2000290970A JP2002100427A JP 2002100427 A JP2002100427 A JP 2002100427A JP 2000290970 A JP2000290970 A JP 2000290970A JP 2000290970 A JP2000290970 A JP 2000290970A JP 2002100427 A JP2002100427 A JP 2002100427A
Authority
JP
Japan
Prior art keywords
terminal
press
soldering
wiring board
stress absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000290970A
Other languages
Japanese (ja)
Inventor
Wataru Shimizu
渉 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Calsonic Kansei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calsonic Kansei Corp filed Critical Calsonic Kansei Corp
Priority to JP2000290970A priority Critical patent/JP2002100427A/en
Publication of JP2002100427A publication Critical patent/JP2002100427A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To enhance workability of soldering a terminal to a circuit board, after it has been pressed in and retained by a connector housing or the like. SOLUTION: This terminal for connecting a wiring board is an elongated one, formed by cutting and pressing a sheet metal used as material. In the terminal, a contact part to a mating terminal, a press-in retention part which is pressed in and retained by the housing, a stress-absorbing part, and a soldering part to the circuit board are formed along the axis, which extends from its one end to the other end, in this order. The contact part, the press-in retention part and the soldering part respectively have surfaces directed in the same direction. The stress-absorbing part is formed by bending the base part of a fallen U-shaped projection part projecting in parallel with the surface and perpendicularly to the axis of the press-in retention part and the soldering part from the side edge of the press-in retention part and the soldering part between the press-in retention part and the soldering part in the direction perpendicular to the surface along a folding line which is parallel with the axis.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、回路基板に半田付
け固定し、さらにコネクタハウジング圧入保持させる端
子であって、特にコネクタハウジング等に圧入保持せし
めた後の端子の回路基板への半田付け作業性を高めるこ
とができる配線基板接続用端子構造に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal to be soldered and fixed to a circuit board and further press-fitted and held in a connector housing. The present invention relates to a wiring board connection terminal structure capable of improving the performance.

【0002】[0002]

【従来の技術】例えば、コネクタハウジングに貫通保持
させた接続用端子の一端を回路基板に貫通させ、その貫
通端部を回路基板に施されている回路に半田付け固定す
る配線基板接続用端子の従来例として、特開平10−2
33269号公報に記載されているものがある。
2. Description of the Related Art For example, one end of a connection terminal penetrated and held in a connector housing is penetrated through a circuit board, and the penetrating end is soldered and fixed to a circuit provided on the circuit board. As a conventional example, Japanese Patent Laid-Open No. 10-2
There is one described in Japanese Patent No. 33269.

【0003】この従来の配線基板接続用端子の構造を図
10及び図11に基いて説明すると、図10において、
1は配線基板接続用端子(以下これを単に端子と称す)
は、その長手方向略中間部がクランク状に折り曲げられ
た応力吸収部2に形成されており、その応力吸収部2は
コネクタハウジング3に形成されている係止孔4内で圧
入保持される。そして上記端子1の一端は、コネクタハ
ウジング3内に位置される相手端子との接続端1Aに形
成され、またその端子1の他端は回路基板5との半田付
け端1Bに形成されている。
The structure of this conventional wiring board connection terminal will be described with reference to FIGS. 10 and 11. FIG.
1 is a wiring board connection terminal (hereinafter simply referred to as a terminal)
Is formed in a stress absorbing portion 2 having a substantially middle portion in the longitudinal direction bent into a crank shape. The stress absorbing portion 2 is press-fitted and held in a locking hole 4 formed in the connector housing 3. One end of the terminal 1 is formed at a connection end 1A with a mating terminal located in the connector housing 3, and the other end of the terminal 1 is formed at a soldering end 1B with the circuit board 5.

【0004】上記応力吸収部2の必要性は、端子1の半
田付け端1Bを回路基板5に半田付けするときの端子1
に熱膨張による伸長が生じ、この端子の伸長力により、
該端子に半田付けされた回路基板5面の回路箔が剥離さ
れてしまうという不具合を防止するためのものである。
The necessity of the stress absorbing portion 2 is that the soldering end 1 B of the terminal 1 is soldered to the circuit board 5.
Elongation occurs due to thermal expansion.
This is to prevent the problem that the circuit foil on the surface of the circuit board 5 soldered to the terminals is peeled off.

【0005】そして上記端子1の半田付け端1Bを、回
路基板5に半田付けする手順としては、先ずその端子1
を、コネクタハウジング3に形成されている係止孔4内
を貫通させて、クランク形状に折り曲げられた端子1の
応力吸収部2を、その係止孔4内に圧入係止させる。次
いでコネクタハウジング3に係止されている端子1の半
田付け端1Bを、回路基板5に予め穿設されている半田
付け孔5A内に貫通させた上で半田付けを行なうのであ
る。
The procedure for soldering the soldering end 1B of the terminal 1 to the circuit board 5 is as follows.
Is passed through a locking hole 4 formed in the connector housing 3, and the stress absorbing portion 2 of the terminal 1 bent into a crank shape is press-fitted and locked in the locking hole 4. Next, soldering is performed after the soldering end 1B of the terminal 1 locked to the connector housing 3 is penetrated into a soldering hole 5A formed in the circuit board 5 in advance.

【0006】[0006]

【発明が解決しようとする課題】ところが、上記形状の
端子1にあっては、その端子長手方向の途中部でクラン
ク形状に折り曲げられた応力吸収部2を形成している
が、この応力吸収部2は、端子の板厚方向へクランク形
状に折り曲げたものであるので、この応力吸収部は、弾
性変形を起しやすく、これが原因でコネクタハウジング
3に圧入保持せしめた端子1の位置精度特に半田付け端
1Bの位置精度が安定せず、そのために例えば自動組立
機等によりコネクタハウジング3に圧入保持されている
端子1の半田付け端1Bを、回路基板5の半田付け孔5
A内へ挿入位置せしめることが困難となり、端子1と回
路基板5との半田付け作業に支障を起すものであった。
特にコネクタハウジング3に対して多数本の端子1が圧
入係止されているような場合は、それら端子の半田付け
端1Bを、回路基板に予め穿設されているそれぞれの半
田付け孔内へ円滑に挿入せしめることは困難であった。
However, in the terminal 1 having the above-mentioned shape, a stress absorbing portion 2 bent into a crank shape is formed at an intermediate portion in the longitudinal direction of the terminal. 2 is bent in a crank shape in the direction of the thickness of the terminal, so that the stress absorbing portion is liable to be elastically deformed. Due to this, the positional accuracy of the terminal 1 pressed and held in the connector housing 3, especially solder The positional accuracy of the attachment end 1B is not stable. Therefore, for example, the soldering end 1B of the terminal 1 pressed and held in the connector housing 3 by an automatic assembler or the like is inserted into the soldering hole 5 of the circuit board 5.
This makes it difficult to insert the terminal 1 into the circuit board A, which hinders the work of soldering the terminal 1 and the circuit board 5.
In particular, when a large number of terminals 1 are press-fitted into the connector housing 3, the soldered ends 1B of these terminals are smoothly inserted into respective solder holes pre-drilled in the circuit board. It was difficult to insert the

【0007】また図11に示す従来例は、各端子1に設
けた応力吸収部2の形状をその端子1の板厚方向へ湾曲
形成したものであるが、この従来例の場合も、その応力
吸収部2を端子の板厚方向へ湾曲する形状となしている
ことで該応力吸収部の形状的安定性が悪くこのために、
コネクタハウジング3に固定された端子1の半田付け端
1Bの位置の安定性が悪いものであった。
In the conventional example shown in FIG. 11, the shape of the stress absorbing portion 2 provided on each terminal 1 is formed to be curved in the thickness direction of the terminal 1. Since the shape of the absorbing portion 2 is curved in the thickness direction of the terminal, the shape stability of the stress absorbing portion is poor, so that
The stability of the position of the soldering end 1B of the terminal 1 fixed to the connector housing 3 was poor.

【0008】従って、上記同様に端子1の半田付け端1
Bを回路基板5に予め形成されている半田付け孔5A内
に挿通せしめる組付け作業の困難性を有するものであっ
た。
Accordingly, the soldered end 1 of the terminal 1 is
B has difficulty in an assembling operation for inserting B into a soldering hole 5A formed in the circuit board 5 in advance.

【0009】本発明は、かかる従来の事実に鑑みてなさ
れたもので、配線基板接続用端子の両端間に応力吸収部
を形成し、その応力吸収部を境とする一方端部を、コネ
クタハウジングに圧入保持させ、その他方端部を、回路
基板に穿設されている半田付け孔内に貫通させて、回路
基板に施されている回路に半田付けする配線基板接続用
端子において、該配線基板接続用端子への無荷重状態で
は、その応力吸収部を境とする端子両端部相互間での変
位を阻止して、端子両端間での位置ずれを防止可能とす
る応力吸収部を設けて、コネクタハウジングに圧入保持
させた配線基板接続用端子における半田付け端の設定位
置にずれが生じないようにして、該半田付け端を回路基
板に予め設けている半田付け孔内へ挿入するときの端子
挿入作業性を高めることを可能とする配線基板接続用端
子の提供を目的とする。
The present invention has been made in view of such a conventional fact, and has a stress absorbing portion formed between both ends of a wiring board connecting terminal, and one end portion bordering the stress absorbing portion is connected to a connector housing. At a wiring board connection terminal for soldering to a circuit provided on the circuit board by allowing the other end to penetrate into a soldering hole formed in the circuit board. In a no-load state to the connection terminal, a stress absorbing portion is provided that prevents displacement between both terminal portions of the terminal bordering the stress absorbing portion and prevents displacement between the terminal both ends, A terminal for inserting the soldering end into a soldering hole previously provided on the circuit board so that the set position of the soldering end in the wiring board connection terminal pressed and held in the connector housing does not occur. Improves insertion workability And an object thereof is to provide a wiring board connecting terminals to allow.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
に本発明の請求項1では、端子の長手方向中途部に、そ
の長手軸方向に撓み得る応力吸収部を形成し、その応力
吸収部を境とする一端部を、ハウジングに圧入保持さ
せ、その他端部を、回路基板に予め形成されている半田
付け孔内に挿入して、回路基板に設けられている回路と
半田付けする配線基板接続用端子において、該配線基板
接続用端子は、板金を素材として裁断プレス成形される
細長の端子であって、該端子は、その一端から他端に向
う軸心に沿って相手端子との接触部、ハウジングにより
圧入保持される圧入保持部、応力吸収部、回路基板との
半田付け部の順で形成されており、上記接触部、圧入保
持部、半田付け部のそれぞれは、同一方向の表面を有し
ており、上記応力吸収部は、上記圧入保持部と半田付け
部との間で、圧入保持部及び半田付け部の側縁より上記
表面と平行方向かつ圧入保持部及び半田付け部の軸心と
直交方向へ張り出す横U字形の張り出し部の基部を、上
記軸心と平行な折り線に沿い上記表面と直角方向へ折り
曲げてなる配線基板接続用端子であることを特徴として
いる。
To achieve the above object, according to the present invention, a stress absorbing portion which can bend in the longitudinal axis direction is formed at a middle portion in the longitudinal direction of the terminal, and the stress absorbing portion is formed. A wiring board that press-fits and holds one end of the circuit board into the housing and inserts the other end into a soldering hole formed in advance on the circuit board and solders the circuit provided on the circuit board In the connection terminal, the wiring board connection terminal is an elongated terminal cut and pressed using a sheet metal as a material, and the terminal is in contact with a mating terminal along an axis from one end to the other end. Part, a press-fit holding part press-fitted and held by the housing, a stress absorbing part, and a soldering part with the circuit board, and each of the contact part, the press-fit holding part, and the soldering part is a surface in the same direction. And the above-mentioned stress absorption The portion extends horizontally between the press-fit holding portion and the soldering portion in a direction parallel to the surface and in a direction perpendicular to the axis of the press-fit holding portion and the soldering portion from a side edge of the press-fit holding portion and the soldering portion. It is a wiring board connecting terminal formed by bending a base of a U-shaped overhang along a folding line parallel to the axis in a direction perpendicular to the surface.

【0011】また本発明の請求項2では、請求項1に加
えて、応力吸収部が、圧入保持部及び半田付け部の表面
幅方向対称位置に対設されている配線基板接続用端子で
あることを特徴としている。
According to a second aspect of the present invention, in addition to the first aspect, the stress absorbing portion is a wiring board connecting terminal provided at a position symmetrical in the surface width direction of the press-fit holding portion and the soldering portion. It is characterized by:

【0012】従って上記請求項1及び請求項2に記載の
発明によれば、圧入保持部と半田付け部との間で形成さ
れている応力吸収部が圧入保持部と半田付け部との側縁
より横U字形に湾曲形成されさらに該U字形部がそれら
圧入保持部及び半田付け部の表面に対して直角方向へ折
り曲げ形成されていることから、圧入保持部に対し、応
力吸収部を介して連結される半田付け部の形態安定性が
良好となる。
Therefore, according to the first and second aspects of the present invention, the stress absorbing portion formed between the press-fit holding portion and the soldering portion has a side edge between the press-fit holding portion and the soldering portion. Since the U-shaped portion is formed to be bent in a direction perpendicular to the surfaces of the press-fit holding portion and the soldering portion, the U-shaped portion is formed to be bent through the stress absorbing portion with respect to the press-fit holding portion. The form stability of the connected soldering portions is improved.

【0013】[0013]

【発明の実施の形態】以下に本発明を図面に示す実施の
形態に基いて詳細に説明する。 実施例1 図1乃至図5において、11は良導性の金属板を素材と
して打抜きプレス成形される配線基板接続用端子であっ
て、この配線基板接続用端子11は、その一端部に相手
端子との接触部12が形成されており、この接触部12
から他端部方向へ向って、圧入保持部13、応力吸収部
14、半田付け部15の順で形成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. Example 1 In FIGS. 1 to 5, reference numeral 11 denotes a wiring board connection terminal which is stamped and press-formed from a metal plate having good conductivity, and the wiring board connection terminal 11 has a mating terminal at one end thereof. Contact portion 12 is formed.
The press-fit holding section 13, the stress absorbing section 14, and the soldering section 15 are formed in this order from the other end toward the other end.

【0014】上記接触部12、圧入保持部13及び半田
付け部15の表面は、同一平面となるように形成されて
おり、またそれらの表面幅L及びL1は、適宜寸法幅に
設定されている。
The surfaces of the contact portion 12, the press-fit holding portion 13 and the soldering portion 15 are formed so as to be flush with each other, and their surface widths L and L1 are appropriately set to dimensional widths. .

【0015】上記圧入保持部13と、半田付け部15と
の間で形成されている応力吸収部14の構成は、圧入保
持部13端と、半田付け部15端との間で、それら表面
と平行方向でしかもそれら圧入保持部13及び半田付け
部15の軸心Y及びY1と直交方向へ張り出すように形
成した横U字状の張り出し部の基部を、上記軸心Y,Y
1と平行な折り線Sに沿い、上記表面と直角方向へ折り
曲げて形成されたものである。
The structure of the stress absorbing portion 14 formed between the press-fit holding portion 13 and the soldering portion 15 is as follows. The bases of the lateral U-shaped overhangs formed in the parallel direction so as to overhang in a direction perpendicular to the axes Y and Y1 of the press-fit holding portion 13 and the soldering portion 15 are connected to the axes Y and Y.
It is formed by bending in a direction perpendicular to the surface along a folding line S parallel to 1.

【0016】このような構造に形成された配線基板接続
用端子11は、その圧入保持部13と半田付け部15と
の間の側縁よりそれら圧入保持部13及び半田付け部1
5の表面に対して直角となるように折り曲げられた横U
字形の応力吸収部14を一体形成していることから、そ
の応力吸収部14の作用で、圧力保持部13と、半田付
け部15との間の軸心Y,Y1方向の応力を吸収せしめ
ることができる。さらに圧入保持部13と、半田付け部
15との間に設けられたU字形の応力吸収部14は、板
厚方向と直交方向へ湾曲形成せしめたので、従来の板厚
方向へ湾曲形成する応力吸収部と比較して、本実施例に
よる応力吸収部によれば端子の形態安定性が高められて
いる。
The wiring board connecting terminal 11 formed in such a structure is connected to the press-fit holding portion 13 and the soldering portion 1 from a side edge between the press-fit holding portion 13 and the soldering portion 15.
5 which is bent so as to be perpendicular to the surface of 5
Since the stress absorbing portions 14 are formed integrally, the stress in the axial center Y, Y1 direction between the pressure holding portion 13 and the soldering portion 15 can be absorbed by the action of the stress absorbing portions 14. Can be. Further, since the U-shaped stress absorbing portion 14 provided between the press-fitting holding portion 13 and the soldering portion 15 is formed to be curved in a direction orthogonal to the thickness direction, the conventional stress formed to be curved in the thickness direction. Compared with the absorbing portion, the stress absorbing portion according to the present embodiment has improved terminal shape stability.

【0017】従って本実施例の配線基板接続用端子11
を、例えば図5で示すようにコネクタハウジングに設け
た端子圧入孔16に圧入保持せしめた後、その配線基板
接続用端子11に形成されている半田付け部15を、回
路基板17に設けられている半田付け孔18内へ挿通し
ようとするとき、その半田付け部15の位置安定性が良
いために、その半田付け部15を、半田付け孔18内へ
円滑に挿通させることができ、このため配線基板接続用
端子11と回路基板17との半田付けの作業性が向上す
る。 実施例2 図6乃至図9において、この実施例で示す配線基板接続
用端子11は、例えば比較的大容量の電流を流す回路に
使用する場合に有利である大型の端子を示すものであっ
て、この実施例の配線基板接続用端子11では、その端
子幅方向対称位置に、上記実施例と同様に圧入保持部1
3と半田付け部15との間に跨がってそれぞれの応力吸
収部14を対設せしめたものである。
Therefore, the wiring board connection terminal 11 of this embodiment is
For example, as shown in FIG. 5, after being press-fitted and held in a terminal press-fitting hole 16 provided in a connector housing, a soldering portion 15 formed in the wiring board connection terminal 11 is provided on a circuit board 17. When trying to insert into the soldering hole 18, the position stability of the soldering portion 15 is good, so that the soldering portion 15 can be smoothly inserted into the soldering hole 18. The workability of soldering the wiring board connection terminal 11 and the circuit board 17 is improved. Embodiment 2 In FIGS. 6 to 9, the wiring board connection terminal 11 shown in this embodiment is a large terminal which is advantageous when used in a circuit for flowing a relatively large current, for example. In the wiring board connection terminal 11 of this embodiment, the press-fit holding portion 1 is located at a position symmetrical in the terminal width direction in the same manner as in the above embodiment.
Each of the stress absorbing portions 14 is provided so as to straddle between the soldering portion 3 and the soldering portion 15.

【0018】この実施例で示す配線基板接続用端子11
に設けた応力吸収部14も、前記実施例1で説明した応
力吸収部14と同様に、板厚方向と直交方向へ湾曲形成
しているので、端子の形態安定性が高められる。さらに
この実施例では応力吸収部をダブルで設けているので端
子の形態安定性は一層高められるので、大型の配線基板
接続用端子として有利である。
The wiring board connection terminal 11 shown in this embodiment.
Similarly to the stress absorbing portion 14 described in the first embodiment, since the stress absorbing portion 14 provided in the first embodiment is formed to be curved in the direction perpendicular to the plate thickness direction, the shape stability of the terminal is enhanced. Further, in this embodiment, since the stress absorbing portion is provided in double, the form stability of the terminal can be further enhanced, which is advantageous as a large-sized wiring board connecting terminal.

【0019】[0019]

【発明の効果】以上述べたように本発明の請求項1及び
2に記載の配線基板接続用端子によれば、その圧入保持
部と半田付け部との間で形成されている応力吸収部が、
圧入保持部と半田付け部との側縁より横U字形に湾曲形
成され、かつ該U字形部分が、それら圧入保持部及び半
田付け部の表面に対して直角方向へ折り曲げ形成してな
るものであるから、その圧入保持部に対し、応力吸収部
を介して連結されている半田付け部の形態安定性が良好
であり、このためにこの配線基板接続用端子の半田付け
部と、回路基板に予め形成されている半田付け孔への挿
通作業を円滑かつ容易に行なうことができ、配線基板接
続用端子と回路基板との半田付けの作業性が向上する。
As described above, according to the wiring board connecting terminal of the first and second aspects of the present invention, the stress absorbing portion formed between the press-fit holding portion and the soldering portion is provided. ,
The U-shaped portion is formed by bending in a horizontal U-shape from the side edge of the press-fit holding portion and the soldering portion, and the U-shaped portion is bent at right angles to the surfaces of the press-fit holding portion and the soldering portion. Therefore, the shape stability of the soldering portion connected to the press-fit holding portion via the stress absorbing portion is good, and therefore, the soldering portion of this wiring board connection terminal and the circuit board have The work of inserting into the soldering hole formed in advance can be performed smoothly and easily, and the workability of soldering the wiring board connection terminal and the circuit board is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明よりなる配線基板接続用端子の実施例を
示した正面図
FIG. 1 is a front view showing an embodiment of a wiring board connection terminal according to the present invention.

【図2】本発明よりなる配線基板接続用端子の実施例を
示した側面図
FIG. 2 is a side view showing an embodiment of a wiring board connection terminal according to the present invention.

【図3】本発明よりなる配線基板接続用端子の実施例を
示した平面図
FIG. 3 is a plan view showing an embodiment of a wiring board connection terminal according to the present invention.

【図4】本発明よりなる配線基板接続用端子の実施例を
示した斜視図
FIG. 4 is a perspective view showing an embodiment of a wiring board connection terminal according to the present invention.

【図5】本発明よりなる配線基板接続用端子をハウジン
グに圧入しかつ回路基板に半田付けした状態の断面説明
FIG. 5 is an explanatory sectional view showing a state in which the wiring board connection terminal according to the present invention is pressed into a housing and soldered to a circuit board.

【図6】本発明よりなる配線基板接続用端子の他の実施
例を示す正面図
FIG. 6 is a front view showing another embodiment of the wiring board connection terminal according to the present invention.

【図7】本発明よりなる配線基板接続用端子の他の実施
例を示す側面図
FIG. 7 is a side view showing another embodiment of the wiring board connection terminal according to the present invention.

【図8】本発明よりなる配線基板接続用端子の他の実施
例を示す平面図
FIG. 8 is a plan view showing another embodiment of the wiring board connection terminal according to the present invention.

【図9】本発明よりなる配線基板接続用端子の他の実施
例を示す斜視図
FIG. 9 is a perspective view showing another embodiment of the wiring board connection terminal according to the present invention.

【図10】従来の配線基板接続用端子の取付形態を示し
た説明図
FIG. 10 is an explanatory view showing a mounting form of a conventional wiring board connection terminal.

【図11】さらに他の従来例である配線基板接続用端子
の取付形態を示した説明図
FIG. 11 is an explanatory view showing a mounting form of a wiring board connection terminal as still another conventional example.

【符号の説明】[Explanation of symbols]

11 配線基板接続用端子 12 接触部 13 圧入保持部 14 応力吸収部 15 半田付け部 DESCRIPTION OF SYMBOLS 11 Wiring board connection terminal 12 Contact part 13 Press-fit holding part 14 Stress absorption part 15 Soldering part

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 端子の長手方向中途部に、その長手軸方
向に撓み得る応力吸収部を形成し、その応力吸収部を境
とする一端部を、ハウジングに圧入保持させ、その他端
部を、回路基板に予め形成されている半田付け孔内に挿
入して、回路基板に設けられている回路と半田付けする
配線基板接続用端子において、該配線基板接続用端子
は、板金を素材として裁断プレス成形される細長の端子
であって、該端子は、その一端から他端に向う軸心に沿
って相手端子との接触部、ハウジングにより圧入保持さ
れる圧入保持部、応力吸収部、回路基板との半田付け部
の順で形成されており、上記接触部、圧入保持部、半田
付け部のそれぞれは、同一方向の表面を有しており、上
記応力吸収部は、上記圧入保持部と半田付け部との間
で、圧入保持部及び半田付け部の側縁より上記表面と平
行方向かつ圧入保持部及び半田付け部の軸心と直交方向
へ張り出す横U字形の張り出し部の基部を、上記軸心と
平行な折り線に沿い上記表面と直角方向へ折り曲げてな
ることを特徴とする配線基板接続用端子。
1. A stress absorbing portion which can bend in the longitudinal axis direction is formed in a middle portion in a longitudinal direction of a terminal, one end portion bordering the stress absorbing portion is press-fitted and held in a housing, and the other end portion is A wiring board connection terminal to be inserted into a soldering hole formed in advance on the circuit board and soldered to a circuit provided on the circuit board, wherein the wiring board connection terminal is formed by using a sheet metal as a cutting press. An elongated terminal to be formed, the terminal having a contact portion with a counterpart terminal along an axis from one end to the other end, a press-fit holding portion pressed and held by a housing, a stress absorbing portion, a circuit board; The contact portion, the press-fit holding portion, and the soldering portion each have a surface in the same direction, and the stress absorbing portion is soldered to the press-fit holding portion. Press-fit holding part and solder The base of the horizontal U-shaped overhanging portion extending from the side edge of the attaching portion in a direction parallel to the surface and in a direction perpendicular to the axis of the press-fit holding portion and the soldering portion, along the folding line parallel to the axis, A terminal for connecting a wiring board, which is bent at a right angle to the terminal.
【請求項2】 応力吸収部が、圧入保持部及び半田付け
部の表面幅方向対称位置に対設されていることを特徴と
する請求項1に記載の配線基板接続用端子。
2. The wiring board connection terminal according to claim 1, wherein the stress absorbing portion is provided opposite to the press-fit holding portion and the soldering portion at positions symmetrical in the surface width direction.
JP2000290970A 2000-09-25 2000-09-25 Terminal for connecting wiring board Pending JP2002100427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000290970A JP2002100427A (en) 2000-09-25 2000-09-25 Terminal for connecting wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000290970A JP2002100427A (en) 2000-09-25 2000-09-25 Terminal for connecting wiring board

Publications (1)

Publication Number Publication Date
JP2002100427A true JP2002100427A (en) 2002-04-05

Family

ID=18774120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000290970A Pending JP2002100427A (en) 2000-09-25 2000-09-25 Terminal for connecting wiring board

Country Status (1)

Country Link
JP (1) JP2002100427A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009186393A (en) * 2008-02-08 2009-08-20 Nsk Ltd State quantity measuring device for rolling bearing unit
JP2010015722A (en) * 2008-07-01 2010-01-21 Japan Aviation Electronics Industry Ltd Connector and contact
US7880372B2 (en) 2008-03-06 2011-02-01 Toyoda Gosei Co., Ltd. LED lamp system and method of making same
CN113196576A (en) * 2018-12-14 2021-07-30 住友电装株式会社 Wire harness member
KR20220095937A (en) * 2020-12-30 2022-07-07 주식회사 에이치엘클레무브 terminal socket and manufacturing method thereof
WO2023238630A1 (en) * 2022-06-09 2023-12-14 株式会社オートネットワーク技術研究所 Terminal metal fitting

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009186393A (en) * 2008-02-08 2009-08-20 Nsk Ltd State quantity measuring device for rolling bearing unit
US7880372B2 (en) 2008-03-06 2011-02-01 Toyoda Gosei Co., Ltd. LED lamp system and method of making same
JP2010015722A (en) * 2008-07-01 2010-01-21 Japan Aviation Electronics Industry Ltd Connector and contact
CN113196576A (en) * 2018-12-14 2021-07-30 住友电装株式会社 Wire harness member
KR20220095937A (en) * 2020-12-30 2022-07-07 주식회사 에이치엘클레무브 terminal socket and manufacturing method thereof
KR102492648B1 (en) 2020-12-30 2023-01-27 주식회사 에이치엘클레무브 terminal socket and manufacturing method thereof
WO2023238630A1 (en) * 2022-06-09 2023-12-14 株式会社オートネットワーク技術研究所 Terminal metal fitting

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